With Spacer Patents (Class 361/758)
  • Patent number: 7400511
    Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: July 15, 2008
    Assignee: Denso Corporation
    Inventors: Atsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
  • Patent number: 7359210
    Abstract: A shock absorbing system may be mounted on a circuit board, such as a carrier card, to reinforce the circuit board and/or to absorb shock forces from a neighboring circuit board, such as a mezzanine card coupled to the carrier card. The shock absorbing system may include one or more support members extending across at least a portion of the carrier card. One or more rollers may be supported on the support member(s) in a manner that allows rotation to facilitate insertion and/or extraction of mezzanine cards from the carrier card. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: April 15, 2008
    Assignee: Intel Corporation
    Inventors: Mark D. Summers, Edoardo Campini
  • Patent number: 7349222
    Abstract: A plasma display panel, a chassis coupled to the plasma display panel, a substrate having a hole therethrough and having circuits to drive the plasma display panel, the substrate spaced apart from the chassis, a grounding boss extending from the chassis, the grounding boss having a diameter smaller than the hole and passing through the hole without contacting the substrate, a grounding bracket fixed on the grounding boss, spaced a predetermined distance from the substrate, and electrically connected to the chassis through the grounding boss, and a spacer inserted into the hole, disposed between the grounding boss and the grounding bracket and determining a height of the grounding bracket.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: March 25, 2008
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Myoung-Kon Kim
  • Patent number: 7304856
    Abstract: An assembly for holding circuit cards may comprise a plurality of slots, each slot being configured to receive a circuit card. At least one slot may be modifiable so as to permit the at least one slot to hold circuit cards having differing depths.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: December 4, 2007
    Assignee: Honeywell International, Inc.
    Inventor: Philip Andretta
  • Patent number: 7289337
    Abstract: The field of the invention is that of electronic computers that have to operate in a harsh mechanical environment. One of the main fields of application relates to computers for on-board fixed-wing and rotary-wing aircraft avionics systems operating in a highly vibratory environment. These computers generally comprise one or more large electronic cards. To limit the effects of vibrations on the integrity of the electronic components and on the connection system for the card, the invention proposes to place on each face braced structures for reducing the mechanical effects of the vibrations or for shifting the resonant frequencies of the electronic cards so as to avoid high-Q effects.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: October 30, 2007
    Assignee: Thales
    Inventors: Catherine Lavergne, Mathieu Casagrande
  • Patent number: 7286369
    Abstract: The present invention discloses a pad and an electronic device employing the same, wherein the pad has an accommodating groove, a ditch disposed around the periphery of the accommodating groove, and at least one guiding groove disposed between the ditch and the accommodating groove, and one end of the guiding groove coupled to the ditch and the other end coupled to the accommodating groove; such that if a glue for attaching the pad with an electronic device is melted by heat, the melted glue will flow into the ditch, and thus can achieve the effects of preventing the melted glue flowing out from the body as well as guiding and collecting the melted glue within the body.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: October 23, 2007
    Assignee: Inventec Corporation
    Inventor: Chun-Yi Yaor
  • Publication number: 20070230144
    Abstract: There is disclosed a base member for holding, without screws, a printed circuit board having conductive traces and electronic components and which can fit into an electric outlet box. The base member has walls which define a cavity where at least one wall of the cavity has a rib, the top of which functions as a stop for the printed circuit board. A cap having snap features adapted to engage the walls of the cavity restricts removal of the printed circuit board when snapped into position on top of the printed circuit board. The cap conceals the electronics on the printed circuit board and has at least one rib on its bottom surface to apply pressure to the printed circuit board assembly to help hold it in place. An aperture in the cap provides access to a pin header which is electrically connected to the printed circuit board. A screw terminal block is provided to connect the terminals on the pin header to a sensor.
    Type: Application
    Filed: December 29, 2006
    Publication date: October 4, 2007
    Inventor: John B. Engel
  • Patent number: 7264501
    Abstract: The invention provides a board-shaped fixing mechanism, which is adapted to fasten a planar board having a plurality of first positioning portions onto a carrier board, and includes a plurality of second positioning portions adapted to correspondingly couple with the first positioning portions, a fastening member disposed between the planar board and the carrier board, and at least one fixing portion for fastening the fastening member to the carrier, the fastening member being provided with a blocking portion for blocking the planar board, and an elastic portion for actuating the blocking portion to block the planar board by propping up to abut against and support one side of the planar board to restrict it from moving in both vertical and lateral directions, thereby fastening the planar board without having to use any tool to resolve the drawbacks of prior techniques.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: September 4, 2007
    Assignee: Inventec Corporation
    Inventor: Linger Lin
  • Patent number: 7253511
    Abstract: A multipackage module has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package substrate. A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die. The first die is electrically connected by wire bonds to conductive traces in the die-attach side of the substrate. The second die is electrically connected by wire bonds to the first package substrate, and may additionally be electrically connected by wire bonds to the first die. In some embodiments a spacer is mounted upon the first die, on a spacer attach region of the surface of the first die that is not within the die attach region, and which may be generally near a margin of the first die.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: August 7, 2007
    Assignee: ChipPAC, Inc.
    Inventors: Marcos Karnezos, Flynn Carson, Youngcheol Kim
  • Patent number: 7245496
    Abstract: A circuit board fixer structure, for fixing a circuit board having at least one through hole, includes a carrier for carrying the circuit board, a pillar, and a stud. The pillar is mounted on the carrier and is formed with a first opening and a second opening corresponding to the first opening. The circuit board is fixed in place on the carrier by the pillar penetrating the through hole of the circuit board and the stud penetrating the first and second openings of the pillar to be coupled to the pillar. By the circuit board fixer structure, there is no need to use any tool to assemble and disassemble a circuit board in an electronic device, making the assembly and disassembly of the circuit board convenient to implement.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: July 17, 2007
    Assignee: Inventec Corporation
    Inventors: Zi-Gui Luo, Eva Ma, Bg Fan
  • Patent number: 7233503
    Abstract: An assembled structure. A first substrate having a base surface is connected to a second substrate by at least one metallic clamping device. The clamping device, vertically disposed on the second substrate, comprises two parts: a first half and a second half having a supporting surface. The first half comprises a main unit and a plurality of spaced arm units disposed on the main unit, and each arm unit comprises a first part extending from the main unit and a second part extending from the first part. When the base surface of the first substrate contacts the supporting surface of the second half, at least one of the second parts of the arm units presses the first substrate on the second half, so that the first substrate is positioned by and electrically connected to the clamping device.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: June 19, 2007
    Assignee: Benq Corporation
    Inventor: Wei-Chieh Chen
  • Patent number: 7193859
    Abstract: A cabinet (10) for a television set or an electric apparatus includes a casing having a front wall (11) and a bottom wall (12), a key top (13), guide structures (20a, 20c, 20b) for holding a narrow first printed wiring board (30) provided with a tact switch (30a) and a wide second printed wiring board (130) provided with a tact switch (1301) at different levels, respectively. Either of the first printed wiring board (30) or the second printed wiring board (130) can be held in the casing without changing the design of the cabinet (10).
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: March 20, 2007
    Assignee: Funai Electric Co., Ltd.
    Inventor: Yasuo Horiuchi
  • Patent number: 7180751
    Abstract: An input/output transition board system for collecting and distributing input/output signals between a backplane board and an I/O board while allowing for additional electronic devices. The input/output transition board system includes a transition board having at least one front connector and at least one rear connector. The front connector is connectable to a corresponding rear panel connector within a backplane board. The rear connector is connectable to a corresponding front I/O connector of an I/O board. The transition board collects and passes the signals between the I/O board and the backplane board. The transition board is also preferably active with additional electronic devices connected to the transition board.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: February 20, 2007
    Assignee: Isothermal Systems Research, Inc.
    Inventors: Gregory S. Geschke, William C. Gustafson, Alan B. Roberts
  • Patent number: 7170740
    Abstract: A foldable support structure suitable for a notebook is provided. The notebook includes a keyboard, a circuit board, and a support frame, disposed above the circuit board for carrying the edge of the keyboard. The support structure is disposed inside an opening of the support frame for supporting the bottom of the keyboard. The support structure and the support frame are fabricated as a whole. The support structure includes a flexibility section, a support section and a pedestal section. The flexibility section is connected to the support frame and the support section. The pedestal section is connected to the support section. The deformed flexibility section keeps the support section away from the circuit board. The support section has a support surface for supporting the keyboard. The pedestal section is suitable for connecting the circuit board such that a distance is kept between the support section and the circuit board.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: January 30, 2007
    Assignee: Compal Electronics, Inc.
    Inventors: Jen-Hao Liu, San-Yang Lo, Hong-Wen Lee
  • Patent number: 7158384
    Abstract: A vibration reducing structure of an electronic device includes first and second housings, a printed circuit board, a first post and a second post. The first and second housings define a closed space therebetween. The printed circuit board is disposed within the space and having a heavy component mounted on a first surface thereof. The first post is arranged on the first housing and under the heavy component. The second post is arranged on the second housing and above the heavy component.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: January 2, 2007
    Assignees: Delta Electronics, Inc., Delta Electronics (Thailand) Public Company, Limited
    Inventor: Jui Ching Huang
  • Patent number: 7136289
    Abstract: A system for providing dual 10 GB uplinks in the front side of a single rack unit switch that stacks two MSA X2 I/O devices in a limited space. In one embodiment the two X2 I/O devices are mounted on opposite sides of a single circuit board positioned above the motherboard.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: November 14, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Samir Vasavda, William F. Edwards, Jr., Michael Kornprobst, David Nelsen
  • Patent number: 7130198
    Abstract: A protection circuit module for rechargeable batteries includes a substrate, electronic components mounted on the obverse surface of the substrate for forming a protection circuit for rechargeable batteries, a housing mounted on the obverse surface of the substrate and including a top wall partially defining an enclosure for accommodating the electronic components, and a resin sealer loaded in the enclosure of the housing for sealing the electronic components. The top wall of the housing includes an opening for loading the resin sealer into the housing.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: October 31, 2006
    Assignee: Rohm Co., Ltd.
    Inventor: Naoya Tanaka
  • Patent number: 7119276
    Abstract: A board mounting apparatus includes a chassis and a chassis base member positioned in the chassis, the chassis base member defining a channel and an open volume adjacent the channel. A first portion of the channel comprises a first width. A second portion of the channel has a second width greater than the first width. The second portion is operable to accept a sliding connector, and the first portion is operable to secure at least a portion of both a fixed and sliding connector.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: October 10, 2006
    Assignee: Dell Products L.P.
    Inventors: Darren Pav, Richard Eddings, Andrea Falkin
  • Patent number: 7114974
    Abstract: An electrical connector assembly (1) includes a card edge connector (20) used to be mounted on a mother board (10) and defining a slot (210), a daughter card (30), and a board hold down (40) for being mounted on the mother board. The daughter card includes a mating edge (31) inserted into the slot of the card edge connector, and a rear edge (32) opposite to the mating edge and defining an engaging hole (320). The board hold down is separated from the card edge connector and includes a pivot bracket (42) engaged with the engaging hole of the daughter card, and a pin latch (44) pivoted on the pivot bracket and having a latch portion (442) abutting against the rear edge of the daughter card for preventing the rear edge from rising upwardly.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: October 3, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Iosif R. Korsunsky, Tod M. Harlan, Brian J. Gillespie, Joanne E. Shipe
  • Patent number: 7113409
    Abstract: Mounting structures for facilitating fast and easy installation and/or removal of electronics components into or out of a computer system are disclosed. The mounting structures include a base and a stackable mounting structure. Each mounting structure generally includes generally parallel and opposing spacers, tapered supports extending from the spacers to engage holes defined on a surface of an electronics component, and a base portion extending between being generally orthogonal to the spacers. The spacers may define orifices to facilitate securing the mounting structure and the electronics component to an electronics base via, e.g., a hook and loop material. The stackable mounting structure may include sharp points and angled legs to also engage the electronics component below.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: September 26, 2006
    Assignee: Google Inc.
    Inventor: William H. Whitted
  • Patent number: 7085141
    Abstract: A circuit board holder includes a base portion, and a mounting portion coupled to the base portion. The mounting portion is configured to actuate with a first circuit board when the circuit board holder attaches to the first circuit board. The circuit board holder further includes a capturing portion coupled to the base portion. The capturing portion is configured to capture an edge of a second circuit board when the circuit board holder attaches to the first circuit board and when the second circuit board electrically connects with the first circuit board. Such a holder alleviates the need to consume a large amount of circuit board space on the second circuit board. Furthermore, the use of such a circuit board holder enables the first and second circuit boards to maintain reliable electrical connectivity even when exposed to heavy shock or vibration.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: August 1, 2006
    Assignee: Cisco Technology, Inc.
    Inventor: George Youzhi Yi
  • Patent number: 7075772
    Abstract: An electrostatic gripper for moving wafers includes bipolar electrodes with an insulating layer of zirconium oxide, which are positioned on a circuit board. The gripper is produced by a pressing process and can be operated with a DC voltage of less than 900 V. As a result, heating of the wafer is almost completely prevented even under a vacuum.
    Type: Grant
    Filed: July 5, 2003
    Date of Patent: July 11, 2006
    Assignee: Integrated Dynamics Engineering GmbH
    Inventor: Peter Heiland
  • Patent number: 7052291
    Abstract: A system permitting vertical and horizontal movement of a first board for proper mating of a first connector on the first board to a second connector on a second board. The first board being aligned pivots about a pivot pin, which is mounted on a mechanical plate at a first end of the board that is opposite to a second end of the board to which a first connector is mounted. This pivoting allows transverse (horizontal) movement of the first board. The first board floats on springs located between the first board and the mechanical plate to which the first board is mounted. These springs afford longitudinal (vertical) movement of the first board, while also providing a friction fit between the first board and the mechanical plate. When the first connector is aligned properly with as second connector on a second board, the first and second connectors can be mated.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: May 30, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard Barina, Dean F. Herring, Glenn E. Myrto
  • Patent number: 7048564
    Abstract: A sealed electronic module includes a housing having an open end and a circuit board that is both peripherally and centrally supported within the housing, where potting material applied to the exposed face of the circuit board peripherally and centrally affixes the circuit board to the housing and also environmentally seals the module. The central support for the circuit board is provided by a support post that is integral with the housing. A reduced size tip of the support post extends through an opening formed in a central area of the circuit board, and potting material applied to the exposed face of the circuit board for sealing the module also flows into the circuit board opening around the tip of the support post. The cured potting material structurally bonds the periphery of the circuit board to the housing walls and the central area of the circuit board to the housing support post.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: May 23, 2006
    Assignee: Delphi Technologies, Inc.
    Inventor: Lee R. Hinze
  • Patent number: 7042734
    Abstract: A CompactPCI blade assembly includes a main printed circuit assembly (PCA), a mezzanine PCA, an electrical connector, and at least one support structure. The main PCA is couplable to a connector plane of a CompactPCI-based computer system. The electrical connector is coupled between the mezzanine PCA and the main PCA. The at least one support structure is mechanically coupled between the main PCA and the mezzanine PCA and establishes a board-to-board distance between the mezzanine PCA and the main PCA of at least one slot unit width.
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: May 9, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James D. Hensley, Kirk M. Bresniker, Glenn C. Simon
  • Patent number: 7004764
    Abstract: Described is a retainer having a base for attaching to a first circuit board. Opposing spatially separated first and second support members extend from one side of the base. The first support member has a latch portion and a terrace for supporting a portion of a second circuit board thereon. An arm has a free first end with a projection extending therefrom and a second end pivotally attached to the second support member for rotational movement between an open position and a closed position. An intermediate section of the arm latches onto the latch portion when the arm is rotated into the closed position. The free first end of the arm extends beyond the first support member for pressing the projection against a surface of the second circuit board when the intermediate section of the arm is latched onto the latch portion.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: February 28, 2006
    Assignee: EMC Corporation
    Inventors: Maida Boudreau, Gerald J. Cote, W. Brian Cunningham, C. Ilhan Gundogan
  • Patent number: 6995982
    Abstract: A motherboard is secured in a chassis by a spring loaded plunger. An anchor member is mounted in the chassis. The anchor member includes a ramp and a receiver. The motherboard has an opening formed therein. A first member is secured to the motherboard. A second member is resiliently mounted on the first member so that the second member extends through the opening. The motherboard is moved on the chassis so that the second member is moved in a first direction by engaging the ramp, and the resilient mounting of the second member urges the second member in a second direction into the receiver.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: February 7, 2006
    Assignee: Dell Products L.P.
    Inventors: Juan Gonzalez, Ralph W. Jensen, Matthew S. McGuff, Alex Z. Rodriguez, Ty R. Schmitt
  • Patent number: 6985367
    Abstract: A circuit board retainer and support apparatus has a first board including a first side and an opposed second side. It also has a first multi-board clip extending from the first side, with the first multi-board clip including a first short spacer block having a short support surface located a first height above the first side, a first long spacer block having a long support surface located a second height above the first side, and a first securing flange, having a first barb with an engagement surface that is a third height above the first side. Also, the first long spacer block is located adjacent to the first securing flange and the first short spacer block is located adjacent to the first long spacer block and farther from the first securing flange than the first long spacer block. The first multi-board clip may also include a second barb extending from the securing flange in an opposed direction from the first and a second securing flange and barb extending from the second side of the first board.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: January 10, 2006
    Assignee: Lear Corporation
    Inventor: Brian J. Scigiel
  • Patent number: 6979892
    Abstract: A method for preparing a non-thermal plasma reactor substrate includes disposing electrical vias on green stage first and second ceramic plates; filling the electrical vias with conductive material; and forming electrical contact via cover pads; disposing conductive material on the first ceramic plate to form an electrode plate having a main electrode portion and a terminal lead for electrically connecting the main electrode portion to the electrical vias; laminating the electrode plate and the second ceramic plate together, embedding the electrode therebetween; co-firing the plates to form a laminated co-fired embedded-conductor element; stacking a plurality of the laminated co-fired embedded-conductor elements to form a multi-cell stack, the filled electrical vias aligning in the stack to provide an electrical bus for connecting alternating elements in the stack; and disposing spacers with matching vias and via cover pads between adjacent pairs of elements to form exhaust gas passages.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: December 27, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: Bob Xiaobin Li, David Kwo-Shyong Chen, Joachim Kupe, David Emil Nelson
  • Patent number: 6967850
    Abstract: A short card support for supporting a short printed circuit card insertable into an electronic system is disclosed. The short card support has a card guide end adapted to couple to the card guide of the electronic system and a card receptor end adapted to couple with a first edge of the short printed circuit card. A support span between the card guide end and the card receptor end permits the short card support to accommodate varying lengths of short printed circuit cards.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: November 22, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew Harvey Barr, Robert William Dobbs
  • Patent number: 6967834
    Abstract: There is provided an electronic apparatus which allows an operating panel surface thereof to be precisely finished and coated in a bright color and hence be attractive in appearance. A main case covers a plurality of operators so as to allow the operators to be operated. A first board, which processes signals generated by operations of the operators, is mounted in the main case and has electronic circuitry formed thereon. A second board, which processes signals at least from the first board, is mounted in the main case and has electronic circuitry formed thereon. The second board is disposed under the first board. At least one stay connects between the opposite sides of the main case. The first board is disposed on the stay, and the second board is disposed under the stay.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: November 22, 2005
    Assignee: Yamaha Corporation
    Inventor: Ryotaro Sugimoto
  • Patent number: 6914785
    Abstract: A circuit component has an elastically deformable first structure, a second structure, and a support structure coupling the first and second structures, wherein the support structure acts a fulcrum about which the first structure can be variably deformed in response to a variable force, to provide either a variable capacitor or a variable tank circuit having a variable capacitor and an inductor. In one particular embodiment, the circuit component includes a zipper actuator for elastically deforming the first structure. A method of making a circuit component includes forming an elastically deformable first structure, forming a second structure, and forming a support structure coupling the first and second structures, to provide either a variable capacitor or a variable tank circuit having a variable capacitor and an inductor. In one particular embodiment, the method includes forming a zipper actuator for elastically deforming the first structure.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: July 5, 2005
    Assignee: Massachusetts Institute of Technology
    Inventors: Alexander H. Slocum, Jeffrey Lang, James R. White, Hong Ma, Xueen Yang
  • Patent number: 6898087
    Abstract: A resilient element includes interconnected lower and upper parts. The lower part includes a planar bottom segment having front and rear ends, a first curved segment that curves upwardly and rearwardly from the front end of the planar bottom segment, and a second curved segment that curves upwardly and forwardly from the rear end of the planar bottom segment. The upper part includes a planar top portion having front and rear ends, a first curved portion that curves downwardly and rearwardly from the front end of the planar top portion, and a second curved portion that curves downwardly and forwardly from the rear end of the planar top portion. The first curved segment and the second curved portion have interconnected distal ends.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: May 24, 2005
    Inventor: Wei-Chen Chen
  • Patent number: 6894217
    Abstract: An electronic device and a fastening apparatus in the electronic device. The device includes a main board, a shield and a supporting seat. The shield has a first opening and a second opening. The supporting seat includes a first engaging portion, a second engaging portion and a third engaging portion. The supporting seat connects with the shield by the first and second engaging portion and supports the main board by the third engaging portion. The first engaging portion connects to the first opening to prevent the supporting seat from moving along the X and Z axes and the second engaging portion connects to the second opening to prevent the supporting seat from moving along the Y axis. The X, Y, and Z axes are perpendicular to each other.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 17, 2005
    Assignee: Aopen Inc.
    Inventor: Chao-Kang Li
  • Patent number: 6892646
    Abstract: A guidance electronics unit is provided for an explosively-launched vehicle, e.g., a projectile or missile, comprising a plurality of circuit card assemblies, each circuit card assembly containing a plurality of electronic components and interconnections, each circuit card assembly maintained in a housing and spaced apart. All spaces surrounding each circuit card assembly are filled with a granular material to provide support for each circuit card assembly during explosive launch. Further, a method for supporting circuit card assemblies in the guidance electronics unit is provided. The problem of enabling guidance electronics to survive the large loads encountered during an explosive launch out of a gun, such as a howitzer, or missile launch tube is thereby solved.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: May 17, 2005
    Assignee: Raytheon Company
    Inventors: Craig A. Zimmerman, Justin C. Dyster, Mathew H. Bosse, Norman Lange, Tovan Adams, Lee Rodriguez
  • Patent number: 6885564
    Abstract: An electronics chassis box includes a pair of opposing sidewalls, a pair of opposing end walls, a bottom surface, a top cover, and ring connectors assemblies mounted in selective ones of the walls of the electronic box. Boss members extend from the bottom surface at different heights upon which circuit cards are mounted in spatial relationship to each other. A flex interconnect substantially reduces and generally eliminates the need of a motherboard by interconnecting the circuit cards to one another and to external connectors mounted within the ring connector assemblies.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: April 26, 2005
    Assignee: Honeywell International Inc.
    Inventor: John E. Hockett
  • Patent number: 6867984
    Abstract: A resilient contact element includes a unitary conductive contact strip that has a strip axis and that is configured with a mounting section, a curved section, a resilient section and a contact section. The mounting section is to be disposed on a mounting plane, and has opposite front and rear end portions along the strip axis. The curved section includes a first curved segment that curves rearwardly from the rear end portion away from the mounting plane, and a second curved segment that curves rearwardly from the first curved segment toward the mounting plane. The resilient section curves forwardly from the second curved segment away from the mounting plane, and has a first end connected to the second curved segment, and an opposite second end. The contact section extends forwardly from the second end of the resilient section, and is generally parallel to the mounting section.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: March 15, 2005
    Assignee: Emi Stop Corporation
    Inventor: Wei-Chen Chen
  • Patent number: 6865088
    Abstract: An electronic equipment contains a circuit board in a casing. The casing encloses a spacing and has a top panel covering the spacing. The circuit board has a pair of end portions and a major surface extending between the pair of the end portions for mounting electronic parts on the major surface. The circuit board is disposed in the spacing of the casing in opposed relation to the top panel. A stay member has an elongated shape extending between the pair of the end portions of the circuit board for reinforcing the major surface of the circuit board. The stay member has a bottom coupling portion disposed in contact with the major surface of the circuit board for coupling with the circuit board, and a top contact portion disposed in contact with a back surface of the top panel for engagement with the casing.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: March 8, 2005
    Assignee: Yamaha Corporation
    Inventors: Tsutomu Watanabe, Takashi Fujita
  • Patent number: 6863562
    Abstract: A connector for attaching a printed circuit board to other apparatus is formed as a separate connector body with a plurality of pins projecting from one end surface that are attached to the printed circuit board by being secured in vias through the board and a threaded opening at the end surface opposite the one end surface from which the pins project. When a bolt is received in the connector threaded opening and drawn tight to secure the printed circuit board to other apparatus, the stresses and material deformation induced by the securing bolt are isolated from the printed circuit board. Further, the attachment of the pins to the printed circuit board rather than the use of screws extending through holes in the circuit board reduces the size of ‘keep out’ zones that must be avoided by the wiring paths on each wiring surface of the printed circuit board through which mounting holes extend.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: March 8, 2005
    Assignee: International Business Machines Corporation
    Inventors: Randall Scott Jensen, Michael T. Peets
  • Patent number: 6853560
    Abstract: A mounting clip that attaches a circuit component to an electrical device attenuates vibration of the circuit component as the electrical device is operated. The mounting clip is designed for a thermo-protector of an electric motor and removably attaches the thermo-protector to a switch housing of the electric motor. The thermo-protector is connected in the circuit of the electric motor and wiring of the electric motor that communicates with the thermo-protector is attached to the mounting clip. The mounting clip is provided with a spring mechanism that engages an abutment provided on the switch housing and biases the mounting clip and the attached thermo-protector and thermo-protector wiring away from the switch housing and thereby attenuates vibration of the thermo-protector and its wiring.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: February 8, 2005
    Assignee: Emerson Electric Co.
    Inventors: Gary W. Borcherding, Barry M. Newberg, Ranney Dohogne, William R. Lewis, Paul G. Michaels
  • Patent number: 6842345
    Abstract: A circuit board support assembly includes a frame, an electronic component and a circuit board. The circuit board and the electronic component are each coupled to the frame along a common axis.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: January 11, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan K. Barsun, Steven R. Hahn, Thomas J. Augustin
  • Patent number: 6831839
    Abstract: An adjustable circuit sled module for a mass storage device has a housing, a mass storage device, a circuit board, a cover and spacers. The spacers position the mass storage device to align the power and data interface ports of the mass storage device with corresponding power and data interface connectors of the circuit board. The resulting sled module can be adjusted to accommodate a variety of brands and sizes of mass storage devices.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: December 14, 2004
    Assignee: Netezza Corporation
    Inventor: Eric T. Bovell
  • Patent number: 6822878
    Abstract: Various embodiments of a circuit board support arrangement and associated methods are provided that facilitate hot plug access to circuit components in a server, computer system or other device. A circuit board support arrangement comprises a first circuit board and a second circuit board that is attached to a pivot joint. The second circuit board is juxtaposed over and pivotal relative to the first circuit board, and, an electronic coupling is attached between the first circuit board and the second circuit board.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: November 23, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert W. Dobbs, James K. Koch, Thane M. Larson
  • Publication number: 20040218370
    Abstract: A latching apparatus (208, 408) for mounting a computer module (202, 402) in a holding fixture (103) is disclosed, where the computer module comprises a baseboard (204, 404) and a faceplate (206, 406). The latching apparatus includes a handle (210, 410) rotatably coupled to the baseboard, where the handle has an outer portion (214, 414) and an inner portion (216, 416), where the outer portion includes a locking pin (218, 418) substantially parallel to the faceplate, and where the handle is movable between a latched position (220, 420) and an unlatched position (221, 421). A retention spring mechanism (222, 422) having a latching portion (224, 424) and a positional portion (226, 426), where the latching portion springably retains the handle in the latched position by engaging the locking pin, and where the positional portion frictionally interfaces with the inner portion of the handle to engage the handle in any of a plurality of positions.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 4, 2004
    Inventor: Henry Wong
  • Patent number: 6813161
    Abstract: An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: November 2, 2004
    Assignee: Gateway, Inc.
    Inventors: Bao G. Le, Derek T. Nguyen, David R. Davis, Allan L. Klink
  • Patent number: 6813162
    Abstract: A circuit board assembly has a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. Support shims are disposed between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: November 2, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Jeffrey L. Deeney
  • Publication number: 20040196637
    Abstract: An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.
    Type: Application
    Filed: April 20, 2004
    Publication date: October 7, 2004
    Inventors: Bao G. Le, Derek T. Nguyen, David R. Davis, Allan L. Klink
  • Patent number: 6798051
    Abstract: An interface unit and a printed circuit board configuration includes at least two interface units for linking conventional commercially available packages of integrated circuits on a printed circuit board in a more flexible and compact way, which allows compact high-performance electronic circuits to be produced on a small surface area and with low development expenditure.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: September 28, 2004
    Assignee: Infineon Technologies AG
    Inventors: Alexander Benedix, Reinhard Düregger, Robert Hermann
  • Patent number: 6791843
    Abstract: An electronic system includes a first system component having a first connector and a second system component having a second connector. One of the first system component having the second system component pivots between a first position in which the first connector and the second connector are disconnected and a second position in which the first connector and the second connector are connected.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: September 14, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert W. Dobbs, Stephan K. Barsun, Andrew H. Barr
  • Patent number: 6781055
    Abstract: A motherboard mounting device (100) includes a standoff (10) and an annular elastic clip (20), both of which are made of electrically conductive material. The standoff includes a head (12), a body (16), and a neck (14) between the head and the body. The clip is undulated, and defines a central opening (22). The clip has a plurality of radial upper and lower ridges (24, 26). The clip is mounted around the neck of the standoff. Several motherboard mounting devices are used to mount a motherboard (50) to a computer enclosure. The heads of the standoffs are extended through the motherboard, and the motherboard is pushed horizontally so it is sandwiched between the heads and the bodies. The motherboard is accordingly securely mounted to the enclosure. The upper ridges and the heads maintain good electrical contact with a grounding trace formed on both upper and lower surfaces of the motherboard.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: August 24, 2004
    Assignee: Hon Hai Precision Ind. Co., LTD
    Inventor: Li Ping Chen