With Spacer Patents (Class 361/758)
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Patent number: 6778400Abstract: An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.Type: GrantFiled: May 13, 2002Date of Patent: August 17, 2004Assignee: Robert Bosch GmbHInventors: Juergen Kurle, Kurt Weiblen, Stefan Pinter, Frieder Haag
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Patent number: 6771517Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.Type: GrantFiled: July 26, 2002Date of Patent: August 3, 2004Assignee: Silicon Graphics, Inc.Inventors: Thomas Alex Crapisi, Jeffrey Scott Cogner, Stephen Cermak, III, Stephen A. Bowen, Rodney Ruesch, David Paul Gruber, Bonnie Kay Dobbs
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Patent number: 6768648Abstract: A coupling unit for attaching an electric wiring substrate to a cabinet of an electronic apparatus is passed through a slit provided in a sheet and the sheet is fixed. At this time, the coupling unit is grasped by restoring force of the sheet since a width of the slit is smaller than a thickness of the coupling unit. Incidentally, when both sides of the slit are curled up by the coupling unit, force by which the slit is further caused to be ruptured acts, but rupture can be prevented by rupture stop portions provided in both ends of the slit.Type: GrantFiled: June 5, 2003Date of Patent: July 27, 2004Assignee: Pioneer CorporationInventor: Hironobu Kobayashi
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Patent number: 6768196Abstract: A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. The microchip coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.Type: GrantFiled: September 4, 2002Date of Patent: July 27, 2004Assignee: Analog Devices, Inc.Inventors: Kieran Harney, Lewis Long
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Patent number: 6762944Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.Type: GrantFiled: October 3, 2002Date of Patent: July 13, 2004Assignee: NEC CorporationInventor: Manabu Mizusaki
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Patent number: 6760231Abstract: A fastening assembly, used for fixedly fastening a first and a second structure (1100, 1200) of a device together, comprises an anchoring block (1500), an insert plate (1400), and a screw (1300). The first structure is provided with a hole (1110). The anchoring block, fixedly arranged on the second structure, includes two parallel holding flanges (1510, 1512) and two parallel protruding ribs (1520), wherein the holding flange (1510) further includes a slot (15101). The protruding ribs extend approximately perpendicular to the two holding flanges on two sides thereof. The insert plate is held between the holding flanges, and is provided with a threaded hole (1410) and a pair of hooked clamping members (1420) that respectively tightly clamp the protruding ribs. The screw extends through the hole of the first structure and engages in the threaded hole of the insert plate to fixedly fasten the first and second structures of the device together.Type: GrantFiled: March 28, 2003Date of Patent: July 6, 2004Assignee: High Tech Computer, Corp.Inventors: Weicheng Hung, Sheng-Ming Lou, James Wu, Yente Chiang
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Patent number: 6751102Abstract: A mounting apparatus includes a plurality of standoffs (1) bent from a bottom plate (10) a computer enclosure (5). Each standoff includes a support body (12) bent perpendicularly from the bottom plate, and a mounting body (14) bent perpendicularly from a distal end of the support body. A rib (122) is formed by stamping the support body at a bottom portion thereof adjacent the bottom plate. The rib has a generally triangular pyramidal configuration. The mounting body includes a connection (16) bent perpendicularly from a distal end of the support body, a bent position (18) bent upwardly from a distal end of the connection portion, and fixing portion (20) bent horizontally from a distal end of the bent portion away from the connection portion. A mounting hole (22) is defined in the fixing portion. A circuit board (2) is fixed to the standoffs with screws.Type: GrantFiled: March 13, 2003Date of Patent: June 15, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Yun-Lung Chen
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Patent number: 6749072Abstract: A frame structure includes a pair of sideboards facing each other, each sideboard having an inner surface provided with a plurality of support grooves for receiving and supporting panel plates, a first joint for fixing one of the pair of sideboards to a base and a second joint for fixing the other of the pair of sideboards to the base and provided with a movement-effecting mechanism. The first and second joints have formed on the facing inner surfaces thereof at substantially the same height steps for contacting side surfaces of the panel plates and supporting the panel plates. At least one of the steps has a surface for contacting at one side surface of one of the panel plates prior to panel plates being received in the plurality of support grooves in order to set a distance between end surfaces of opposed ones of the plurality of support grooves equal to a sum of the width of the panel plates received in and supported by the plurality of support grooves and a predetermined clearance.Type: GrantFiled: June 11, 2002Date of Patent: June 15, 2004Assignee: NIX, Inc.Inventors: Tamotsu Matsuda, Hitoshi Takano
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Patent number: 6747875Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.Type: GrantFiled: September 25, 2001Date of Patent: June 8, 2004Assignee: Innoveta TechnologiesInventors: Carl Milton Wildrick, Gordon K. Y. Lee
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Publication number: 20040100777Abstract: A circuit board device includes one or more slots formed in a board, and one or more fastener members having one or more projections engageable into the slots of the board, to anchor the fastener member to the board, and to prevent the fastener member from moving relative to the board while welding the fastener member to the board with one or more solders. One or more electronic components may then be precisely and easily aligned with and secured to the fastener members with the other fastener members. A solder member may be applied on the board for securing to the solders.Type: ApplicationFiled: November 27, 2002Publication date: May 27, 2004Inventor: Kuoshao Lee
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Patent number: 6741477Abstract: A rack-mount apparatus for mounting printed circuit boards and other types of electronic components is provided. A five-sided enclosure is provided for mounting one of several different types of electronic components. The enclosure includes a bottom panel having countersunk holes for mounting electronic component. The countersunk holes are arranged according to two or more mounting patterns. Mounting hardware is also provided for mounting the printed circuit board or other type of electronic component to the bottom panel without protruding from the bottom surface of the bottom panel and also providing a gap between the printed circuit board and the bottom panel as specified by the type of printed circuit board or other electronic component. The rack-mount apparatus allows many different types of printed circuit boards or electronic components to be mounted in a standard rack-mount chassis.Type: GrantFiled: March 18, 2002Date of Patent: May 25, 2004Inventor: Clas Gerhard Sivertsen
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Patent number: 6731517Abstract: A card edge connector (10) for electrically interconnecting a daughter board to a mother board includes an insulating housing (11), a plurality of contacts (16) retained in the housing, a pair of side arms (14) integrally extending from opposite ends of the housing, and a pair of metal springs (17) attached on corresponding side arms. Each side arm forms a platform (12) for supporting the daughter board, each platform defining thereon a reversed L-shaped, retention slit (15). Each metal spring has a retention member (174) retained in corresponding retention slit and a board-mounted member (173) for soldering on the mother board. The board-mounted member has substantial resilience which can be deformable when soldering the contacts on the mother board to thereby facilitate the stability of the assembly of the card edge connector.Type: GrantFiled: March 12, 2003Date of Patent: May 4, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Hung-Chi Yu
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Patent number: 6693799Abstract: A circuit board mount is provided for mounting a circuit board in an electronic equipment housing. The mount is mountable on a surface within the housing and includes a slot for receiving and supporting the circuit board at a first height with respect to the housing surface. The mount further comprises at least one upstand of a second height higher than that of the circuit board, whereby a component can be supported on the upstand without contacting the circuit board. The mount is thus able to support the circuit board and to protect the circuit board during handling of other components within the housing.Type: GrantFiled: January 16, 2002Date of Patent: February 17, 2004Assignee: Sun Microsystems, Inc.Inventors: Gerald Ronald Gough, James Robert Kitchen
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Patent number: 6680849Abstract: An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.Type: GrantFiled: March 29, 2002Date of Patent: January 20, 2004Assignee: Nortel Networks CorporationInventors: John C. Atkinson, Simon E. Shearman
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Publication number: 20030214791Abstract: A fastening assembly, used for fixedly fastening a first and a second structure (1100, 1200) of a device together, comprises an anchoring block (1500), an insert plate (1400), and a screw (1300). The first structure is provided with a hole (1110). The anchoring block, fixedly arranged on the second structure, includes two parallel holding flanges (1510, 1512) and two parallel protruding ribs (1520), wherein the holding flange (1510) further includes a slot (15101). The protruding ribs extend approximately perpendicular to the two holding flanges on two sides thereof. The insert plate is held between the holding flanges, and is provided with a threaded hole (1410) and a pair of hooked clamping members (1420) that respectively tightly clamp the protruding ribs. The screw extends through the hole of the first structure and engages in the threaded hole of the insert plate to fixedly fasten the first and second structures of the device together.Type: ApplicationFiled: March 28, 2003Publication date: November 20, 2003Inventors: Weicheng Hung, Sheng-Ming Lou, James Wu, Yente Chiang
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Publication number: 20030210532Abstract: An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.Type: ApplicationFiled: May 9, 2002Publication date: November 13, 2003Applicant: Gateway, Inc.Inventors: Bao G. Le, Derek T. Nguyen, David R. Davis, Allan L. Klink
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Patent number: 6646890Abstract: Mezzanine boards can be added to and removed from a supporting base board mounted in a slot of a shelf adjacent other base boards while the base boards remain in electrical service. Guide rails allow a mezzanine board to be slid into position from the front edge of the base board. The guide rails themselves can be moved to provide a new spacing to accommodate a different width mezzanine board without having to take the supporting base board out of service. Openings in the sides of the guide rails promote the flow of air between the mezzanine board and the base board to provide cooling.Type: GrantFiled: September 4, 2002Date of Patent: November 11, 2003Assignee: Lucent Technologies Inc.Inventors: Charles Calvin Byers, Todd Keaffaber, Andrew F. Scott
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Patent number: 6633491Abstract: A method and apparatus to support varying sizes of memory cards against shock and vibration. One embodiment of the invention involves a method to assemble a support clip to one or more cards attached on a substrate by a connector. A second embodiment of the invention involves a method to fabricate a support clip. A third embodiment of the invention involves an assembled substrate with a plurality of cards secured by one or more support clips to the substrate.Type: GrantFiled: August 17, 2001Date of Patent: October 14, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christopher Gregory Malone, Stephan Karl Barsun, Thomas J. Augustin
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Patent number: 6611423Abstract: The present invention relates to an improved industrial computer casing with a height below 2U, and such computer casing has a plurality of supporting posts with different heights, and a corresponding protruded ear base on each lateral side of the computer casing, so that when the casing is in use, a motherboard can be secured onto the supporting post. If needed, the hard disk drive frame can be embedded into the ear base and then the hard disk drive can be secured to the hard disk drive frame or the hard disk drive frame is secured between the supporting posts by means of the conformation of hard disk drive frame on the convex screw base such that motherboard and a hard disk drive or an interface card are able to be securely accommodated into the casing to reduce the occupied space of the overall casing.Type: GrantFiled: August 10, 2001Date of Patent: August 26, 2003Assignee: Portwell Inc.Inventor: Chih-Chung Chen
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Patent number: 6587352Abstract: A female screw device is constructed to include a female screw rod adapted for mounting in a mounting hole of a motherboard to support an object above the motherboard, the female screw rod having an axially extended screw hole for the installation of a screw, and a quick-release cap adapted for fastening to the female screw rod to close the screw hole for enabling the female screw rod to be installed in a mounting hole of a motherboard by a SMT automatic machine, the quick-release cap having a cap body and a plurality of springy retaining arms adapted for fastening to the screw hole of the female screw rod to secure the cap body to the female screw rod to block up the screw hole.Type: GrantFiled: June 21, 2002Date of Patent: July 1, 2003Inventor: Chiang Chun Lin
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Patent number: 6587351Abstract: A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.Type: GrantFiled: April 2, 2002Date of Patent: July 1, 2003Assignee: Cooper TechnologiesInventors: Jeffrey Lynn Hollinsworth, Randy John Bicknese, Varinder Kumar Kalra, Keith Allen Spalding
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Patent number: 6552914Abstract: A circuit board assembly mechanism for assembling a first circuit board in suspension in the circuit board assembly mechanism includes a base and connecting bracket. The base has a pillar extruding from a bottom plate of the base and a side plate bending from a wing of the bottom plate. The pillar is positioned corresponding to a first hole of first circuit board and houses it atop by inserting a fixer through the first hole into the pillar. The connecting bracket has a first end and a second end in opposition to each other for connecting the first circuit board with the side plate of the base by fixing the first end on the first circuit board and restricting the second end on the side plate, thereby assembling the first plate in suspension within the base by the pillar and the connecting bracket and reserving the space between the first circuit board and the bottom plate for assembling a second circuit board.Type: GrantFiled: March 27, 2000Date of Patent: April 22, 2003Assignee: Aten International Co., Ltd.Inventor: Chang-Yu Chang
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Patent number: 6549410Abstract: The invention relates to a mounting arrangement for a heatsink for cooling a microelectronic device contained within a chassis. The mounting arrangement includes a heatsink, a motherboard incorporating the microelectronic device thereon and securing means adapted to position both the heatsink and the motherboard in a mounting configuration so that the motherboard is held in fixed relation to the chassis and the heatsink is biased in thermal contact with the microelectronic device by means of a biasing means adapted to engage with both the securing means and the heatsink, whereby the weight of the heatsink thereby is substantially supported by the chassis by way of the securing means. The securing devices in a preferred embodiment correspond to pins which pass through the heatsink, through the motherboard, while simultaneously anchoring same to the chassis, and are attached to the chassis.Type: GrantFiled: November 20, 2001Date of Patent: April 15, 2003Assignee: Hewlett-Packard CompanyInventor: Xavier Cohen
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Patent number: 6545870Abstract: A technique is provided for the insertion and removal of a motherboard and a heatsink from a computer chassis without the use of tools or threaded fasteners. The technique allows the heatsink to be supported by the chassis and not the motherboard thereby preventing damage to the motherboard.Type: GrantFiled: December 14, 2001Date of Patent: April 8, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Gregory C. Franke, Donald J. Hall, Jeffrey A. Lambert
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Patent number: 6542372Abstract: An spacer assembly for spacing a circuit board from a chassis includes a plug that is adapted to extend through a mounting aperture in the chassis and a cap that is adapted to receive the plug in locking engagement for sandwiching the chassis therebetween. The cap has an upper wall that supports the circuit board and a skirt that extends from the upper wall to form a hollow interior that is sized to receive the plug. First cooperating structure on the plug and cap hold the plug within the hollow interior of the cap, while second cooperating structure on the plug and cap hold the chassis therebetween.Type: GrantFiled: September 25, 2001Date of Patent: April 1, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: David M. Paquin, David A. Selvidge
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Publication number: 20030058627Abstract: An spacer assembly for spacing a circuit board from a chassis includes a plug that is adapted to extend through a mounting aperture in the chassis and a cap that is adapted to receive the plug in locking engagement for sandwiching the chassis therebetween. The cap has an upper wall that supports the circuit board and a skirt that extends from the upper wall to form a hollow interior that is sized to receive the plug. First cooperating structure on the plug and cap hold the plug within the hollow interior of the cap, while second cooperating structure on the plug and cap hold the chassis therebetween.Type: ApplicationFiled: September 25, 2001Publication date: March 27, 2003Inventors: David M. Paquin, David A. Selvidge
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Patent number: 6535394Abstract: Electronic apparatus is described comprising a printed circuit board mounted on a support structure. The printed circuit board has at least one keyhole shaped fixing hole, the support structure being provided with at least one electrically conducting fixing post having an at least partially circumferential slot for engaging the fixing hole. The printed circuit board has a conducting surface adjacent said fixing hole that is disposed to provide an electrical contact with said post so as to establish an electrical circuit between at least one component mounted on the printed circuit board and the support structure. The arrangement is particularly suitable for securely coupling a computer's motherboard to its casing or chassis.Type: GrantFiled: September 22, 1999Date of Patent: March 18, 2003Assignee: Hewlett-Packard CompanyInventor: Claus Hirzmann
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Publication number: 20030030997Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.Type: ApplicationFiled: October 3, 2002Publication date: February 13, 2003Applicant: NEC CORPORATIONInventor: Manabu Mizusaki
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Patent number: 6493240Abstract: The present invention is an interposer for electrically coupling a microcard with a mother board. The interposer includes a frame which is interposed between the microcard and the motherboard, electrically connecting the microcard and the motherboard by means of plated via-holes. The substrate is organic and a plurality of chips are mounted on both sides of the substrate. On the opposite sides of the interposer are pluralities of metal pads which are coupled by metallized via holes, the pads in turn connected to the chips, thereby coupling chips or cards on one side of the interposer to chips or boards on the other side. Electrical connection between the chips on the top side of the substrate and the metal pads on the lower side of the substrate is provided by the metallized via holes.Type: GrantFiled: May 17, 2001Date of Patent: December 10, 2002Assignee: International Business Machines CorporationInventors: Patrizio Broglia, Francesco Garbelli, Alberto Monti
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Patent number: 6493233Abstract: A method and assembly for mounting printed circuit boards (PCBs) to a chassis. In one embodiment, a plurality of internally-threaded mounting posts are secured (e.g., press-fit) to the chassis and the PCB includes a plurality of holes into which the mounting posts extend. Each hole includes a pair of keepout pads to isolate internal PCB circuitry (other than ground planes) from electric contact with the assembly components. A threaded faster is used to secure the assembly. In another embodiment, a collar is added to the assembly and the extending portion of the post is elongated such that it extends into the collar, providing additional thread engagement for thinner PCBs. In a third embodiment, hat-section components are secured (e.g., via wave soldering) over respective holes in the PCB. The hat-section component includes a counterbore through which the threaded fastener passes and is sized to receive a portion of a threaded standoff.Type: GrantFiled: August 21, 2001Date of Patent: December 10, 2002Assignee: Intel CorporationInventors: David S. De Lorenzo, Casey R. Winkel
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Patent number: 6490168Abstract: An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44).Type: GrantFiled: September 27, 1999Date of Patent: December 3, 2002Assignee: Motorola, Inc.Inventors: William Rochowicz, Declan Killarney, Tom Gall, Chris Van Houten, Don Zito
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Patent number: 6490165Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.Type: GrantFiled: November 14, 2001Date of Patent: December 3, 2002Assignee: NEC CorporationInventor: Manabu Mizusaki
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Latching apparatus and method for providing radial alignment of a housing mounted on a circuit board
Patent number: 6486406Abstract: An apparatus and method for providing radial alignment of a housing mounted on a circuit board is provided. A mounting leg portion extends outward from a mounting surface of the housing. The mounting leg portion has a body portion, an end portion, and a radial alignment portion. The radial alignment portion extends outward from the mounting surface. The radial alignment portion has a circumference, and is adapted to be received in a mounting opening formed in the circuit board. The radial alignment portion prevents radial movement of the mounting leg portion with respect to the circuit board. The end portion of the mounting leg portion includes a snap portion for engaging the circuit board and securing the mounting leg portion to the circuit board.Type: GrantFiled: November 14, 2000Date of Patent: November 26, 2002Assignee: 3Com CorporationInventors: Gerald A. Greco, Kenneth S. Laughlin, Philip A. Ravlin -
Patent number: 6480397Abstract: A cover structure (1) for a portable electronic device includes a metallic shell (10) and a plastic mounting frame (9) secured to the shell. The shell has a skirting panel (101) and a bottom panel (100) which cooperatively define a space (102) for receiving the mounting frame. The frame includes a U-shaped part (11) and an arcuate part (12) which are respectively dimensioned to closely fit onto corresponding end portions of the shell. Each of the U-shaped and arcuate parts includes at least one threaded post (112, 121) adapted for engaging with a corresponding fastening member (3), in order to fasten a printed circuit board (2) of the portable electronic device to the cover structure.Type: GrantFiled: November 5, 2001Date of Patent: November 12, 2002Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Che-Yuan Hsu, Yonk Yang
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Patent number: 6466447Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.Type: GrantFiled: January 24, 2001Date of Patent: October 15, 2002Assignee: Denso CorporationInventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka
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Publication number: 20020145857Abstract: A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.Type: ApplicationFiled: April 2, 2002Publication date: October 10, 2002Inventors: Jeffrey Lynn Hollinsworth, Randy John Bicknese, Varinder Kumar Kalra, Keith Allen Spalding
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Patent number: 6462954Abstract: A connector of a modular machine board disposed on an inner edge of a back board of a display apparatus of an electronic device contacts with joint points of the electronic device, such that metal resilient pieces of said connector are assured to tightly contact with said joint points by means of the resilience of resilient component. As a result, even under vibration, the resilient component can regulate the up-and-down position of said connector along with vibration force to enable the metal resilient pieces to maintain a tight contact at the joint points of the electronic device.Type: GrantFiled: June 26, 2001Date of Patent: October 8, 2002Assignee: Inventec CorporationInventors: Ping-Huang Kuo, Sung-Ming Song
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Patent number: 6442036Abstract: A terminal main body portion 2 of a rectangular cylindrical shape capable of being inserted into an attachment hole formed at a substrate is provided with a male type coupled terminal at its upper end portion and an attachment base portion 5 at its lower end portion. Projection pieces 6 are formed at the lower end portion of the attachment base portion 5 so as to protrude outward. Engagement pieces 7 are formed at positions above the respective projection pieces 6 by a predetermined interval. When the terminal main body portion 2 is inserted into the attachment hole, the substrate mount type terminal 1 is attached to the substrate P in a manner that the substrate P is sandwiched between the projection pieces 6 and the engagement pieces 7 at the peripheral edge portion of the attachment hole.Type: GrantFiled: January 25, 2001Date of Patent: August 27, 2002Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventor: Toshihiko Komatsu
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Patent number: 6424538Abstract: A system for protecting circuit board mounting devices within an enclosure. The system includes one or more protective housings that are disposed about corresponding openings through a printed circuit board. A flexible clip is attached to the printed circuit board proximate each opening. Each clip includes a retainer portion designed to receive the head of the standoff. The protective housings extend around the retainer portion, and protect the secure mounting of the circuit board to corresponding standoffs.Type: GrantFiled: October 18, 2000Date of Patent: July 23, 2002Assignee: Compaq Computer CorporationInventor: David M. Paquin
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Publication number: 20020093798Abstract: A circuit board mount is provided for mounting a circuit board in an electronic equipment housing. The mount is mountable on a surface within the housing and includes a slot for receiving and supporting the circuit board at a first height with respect to the housing surface. The mount further comprises at least one upstand of a second height higher than that of the circuit board, whereby a component can be supported on the upstand without contacting the circuit board. The mount is thus able to support the circuit board and to protect the circuit board during handling of other components within the housing.Type: ApplicationFiled: January 16, 2002Publication date: July 18, 2002Inventors: Gerald Ronald Gough, James Robert Kitchen
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Patent number: 6404650Abstract: A system is provided for positioning a plurality of cards in an electronic module intended to be plugged into a backplane. The system includes a spacing element comprising a succession of spacers of increasing section (diameter). Spacers are arranged end to end and are preferably cylindrical. The difference of section between successive spacers forms a kind of stair step or shoulder. These successive steps position the electronic cards parallel to one another, with a predetermined spacing which corresponds to the spacing of the backplane connectors. Fastening means, such as a nut, are associated with the steps for maintaining the cards. The cards are bored so that the spacing element can be inserted and the nuts applied. The size of the hole in each card is such that the surface around the hole can be pressed against the corresponding shoulder by means of the nut installed on the opposite side.Type: GrantFiled: December 8, 1999Date of Patent: June 11, 2002Assignee: International Business Machines CorporationInventors: Henri Boniface, Bruno Centola, Jean-Marc Legrand
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Patent number: 6404646Abstract: A PC board support is disclosed to include a hollow support shell adapted to support a PC board above a frame, a spring mounted inside the support shell, the support shell having a top opening, a top neck, and a retainer head at the top of the top neck, and a slide supported on the spring inside the support shell and moved along a vertical sliding groove at the retainer head and top neck of the support shell in and out of the top opening to unlock/lock the PC board.Type: GrantFiled: October 17, 2001Date of Patent: June 11, 2002Assignee: Enlight CorporationInventors: Hsiang-Hsiang Tsai, Chao-Kun Chan
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Patent number: 6384332Abstract: An encapsulated device and method for making such encapsulated device containing a bladder disposed between a wall of the case and the encapsulant. The bladder defines a space devoid of encapsulant and contains a collapsible insert such as an open cell foam material, thereby allowing the unimpeded thermal expansion of the encapsulant. By reducing thermal expansion stresses on the encapsulated devices, the reliability of the encapsulated device is improved.Type: GrantFiled: June 28, 2000Date of Patent: May 7, 2002Assignee: Bombardier Motor Corporation of AmericaInventor: Mark J. Skrzypchak
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Patent number: 6347044Abstract: A structure for mounting a printed circuit board (PCB) in an electronic apparatus housing is disclosed. The structure comprises a plurality of holes, a plurality of bosses, and a plurality of seat members. The holes are formed in the printed circuit board. The bosses are formed on the upper surface of the bottom of the electronic apparatus housing at positions corresponding to the positions of the holes. Each of the seat members consists of a seat portion, a vertical cylinder portion and a flange. The seat portion serves to support the bottom surface of the head of a screw while being positioned on the top surface of each of the bosses, and has a center hole through which the screw passes. The vertical cylinder portion is extended from the circumferential end portion of the seat portion, defines a hollow portion in which the head of the screw is positioned, and is inserted into each of the holes of the main board.Type: GrantFiled: June 9, 2000Date of Patent: February 12, 2002Assignee: Samsung Electronics Co., Ltd.Inventors: Bum-Young Won, Bum-Su Park
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Patent number: 6345994Abstract: The present invention provides for an apparatus and method for supporting a circuit board such as a motherboard in the chassis of a computer. Embodiments of the apparatus provide for a circuit board support clip that supports the motherboard between a first and a second leg that cooperate to exert force on the circuit board in substantially opposite direction to support the circuit board.Type: GrantFiled: January 13, 1999Date of Patent: February 12, 2002Assignee: Micron Technology, Inc.Inventor: Greg P. Johnson
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Patent number: 6341068Abstract: A storage card module for supporting more than one SCSI storage device on a printed circuit board to be coupled to a CPCI backplane. The storage devices are positioned on the board with a predetermined spacing disposed therebetween. One or more low profile connectors are disposed in the predetermined spacing for each storage device depending on the number of pins needed. For an 8-bit fast tape drive, a 50-pin low profile connector is utilized. A pair of 34-pin low profile connectors are utilized for connecting to a 16-bit fast-wide SCSI disk drive. Electrical traces are buried in the board substrate which couple the low profile connectors to a card connector on the printed circuit board. The card connector is mated to the CPCI backplane via a backplane connector. A SCSI I/O interface is in an electrical conductive relationship with at least a portion of the backplane connector. Power is provided to the drives via a pair of 4-pin low profile power connectors disposed in the predetermined spacing.Type: GrantFiled: March 31, 2000Date of Patent: January 22, 2002Assignee: Alcatel USA Sourcing, L.P.Inventors: Ed Bradley, Melvin G. Peel, Jr., Hadi M. Hayek, Ignacio Linares
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Patent number: 6333855Abstract: A mounting device for supporting a printed circuit board on a carrier includes a spacing element attached onto the carrier and an electrically conducting mounting element coupled to the spacing element for forming a mechanical and electrically conducting connection between the printed circuit board and the carrier. The spacing element has a sleeve-type spacing section and a mounting section attached to the spacing sections. Preferably, the section is formed by elastic, finger-type or wing-type mounting sections that are provided for engagement in corresponding recesses of the carrier. The mounting element is preferably a screw that is screwed into the carrier when tightened.Type: GrantFiled: May 24, 1999Date of Patent: December 25, 2001Assignee: Alarmcom Elpro SAInventors: Jean François Prabaonnaud, George Wegmann, Roger Leroy, Jean Louis Vassal
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Patent number: 6328169Abstract: A frame structure includes a pair of side frame boards, with the inner surfaces of the side frame boards that face each other being provided with a plurality of support grooves for receiving panel plates. The frame structure has a device for adjusting the spacing between the side frame boards. The adjustment device is a projection provided on at least one of the inner surfaces of the side frame boards that face each other, the size of the projection being such that the spacing is set to an amount that is the width of the received panel plates plus a clearance.Type: GrantFiled: September 27, 2000Date of Patent: December 11, 2001Assignee: Nikko Kogyo Kabushiki KaishaInventors: Tamotsu Matsuda, Hitoshi Takano
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Patent number: 6327155Abstract: A printed circuit card assembly for preventing flame spread in an equipment assembly includes a printed circuit board having first and second sides, at least one of the first and second sides of the printed circuit board adapted for mounting a plurality of electronic components thereon; and a heat absorbing flame resistant shield facing one side of the printed circuit board for absorbing heat energy from an adjacent printed circuit card assembly thereby reducing heat transfer to the printed circuit board.Type: GrantFiled: December 16, 1999Date of Patent: December 4, 2001Assignee: Nortel Networks LimitedInventors: Mark Jeffrey Niepmann, Eric Hoyt Wong, Edward R. Champion, Jr.
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Patent number: 6320761Abstract: An attachment device for a housing is provided which is suitable for snapping onto a hat rail which is attached to a plate, and allows screw attachment to a plate. The housing base has a bevelled area on one side of a snap-action device and, in this area, screw eyelets are intgrated in a spacer which is arranged resiliently on the housing base. Said spacer is supported on the plate when screwed together.Type: GrantFiled: May 18, 1999Date of Patent: November 20, 2001Assignee: Siemens AktiengesellschaftInventor: Willy Sabisch