Abstract: Handshaking sense amplifier. In accordance with a first embodiment, an electronic circuit includes a sense amplifier configured to differentially sense contents of a memory cell. The circuit also includes a self-timing circuit configured to detect a completion of evaluation by the sense amplifier; and to initiate a subsequent memory operation responsive to the completion. A completion of evaluation may not be aligned with a clock edge.

Abstract: A circuit includes a first data line, a second data line, a reference node, and a memory cell. The memory cell includes a data node, a first transistor, a second transistor, and a third transistor. The first transistor and the second transistor are connected in series between the first data line and the reference node. The first transistor is configured to be turned off when the gate of the first transistor has a voltage level corresponding to the first logical value. The third transistor is between the data node and the second data line. The third transistor is configured to be turned off when a gate of the third transistor has a voltage level corresponding to a second logical value different from the first logical value.

Abstract: A circuit includes a hybrid switch, which includes a Tunnel Field-Effect Transistor (TFET) having a first source, a first drain, and a first gate. The hybrid switch further includes a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) connected to the TFET in parallel, with the MOSFET including a second source connected to the first source, a second drain connected to the first drain, and a second gate connected to the first gate.

Abstract: A circuit comprises a first transistor, a capacitive component, a second transistor, and a data line. The first transistor has a threshold voltage value. A first terminal of the first transistor is coupled with a first terminal of the capacitive component and a second terminal of the second transistor. A second terminal of the first transistor is configured to receive a second-terminal voltage value. A third terminal of the first transistor is configured to receive a third-terminal voltage value. A first terminal of the second transistor is coupled with the data line. A third terminal of the second transistor is configured to receive a second-transistor control signal. The first transistor is configured to be on and off to maintain the data line at a data line voltage value.

Abstract: An SRAM with buffered-read bit cells is disclosed (FIGS. 1-6). The integrated circuit includes a plurality of memory cells (102). Each memory cell has a plurality of transistors (200, 202). A first memory cell (FIG. 2) is arranged to store a data signal in response to an active write word line (WWL) and to produce the data signal in response to an active read word line (RWL). A test circuit (104) formed on the integrated circuit is operable to test current and voltage characteristics of each transistor of the plurality of transistors of the first memory cell (FIGS. 7-10).

Abstract: A semiconductor storage device capable of performing low-voltage operation, reducing standby current, and decreasing memory size is provided. The semiconductor storage device is a semiconductor device including first to fourth transistors and a capacitor. The first transistor has a function of supplying a first signal to the capacitor. The capacitor has a function of accumulating electric charge based on the first signal. The second transistor has a function of supplying the electric charge based on the first signal to a gate of the third transistor. The third transistor has a function of outputting a first potential to a wiring and a function of supplying the first potential to a gate of the fourth transistor. The fourth transistor has a function of supplying a second potential to the capacitor through the second transistor.

Abstract: The present invention provides a layout pattern of an 8-transistor static random access memory (8T-SRAM), at least including a first diffusion region, a second diffusion region and a third diffusion region disposed on a substrate, a critical dimension region being disposed between the first diffusion region and the third diffusion region. The critical dimension region directly contacts the first diffusion region and the third diffusion region, a first extra diffusion region, a second extra diffusion region and a third extra diffusion region disposed surrounding and directly contacting the first diffusion region, the second diffusion region and the third diffusion region respectively. The first, the second and the third extra diffusion region are not disposed within the critical dimension region.

Abstract: A memory device includes a first select transistor having a first current electrode coupled to a first bit line, a control electrode and a second current electrode. A second select transistor has a first current electrode coupled to a second bit line, a control electrode and a second current electrode. A first bi-directional resistive element has a cathode coupled to the second current electrode of the first select transistor and an anode coupled to an internal node. A second bi-directional resistive element has a cathode coupled to the internal node and an anode coupled to the second current electrode of the second select transistor. A third transistor has a first current electrode coupled to a third bit line, a second current electrode coupled to the internal node, and a control electrode coupled to a word line.

Abstract: A memory cell includes a bistable element and two p-channel transistors (i.e., first and second p-channel transistors). The bistable element includes a plurality of inverting circuits and at least one data storage node. The bistable element may be formed in a first region on the substrate that is partially formed by a p-type diffusion region and an n-type diffusion region. The first and second p-channel transistors are coupled serially. The first p-channel transistor may also have its gate terminal coupled to the at least one data storage node of the bistable element. A method of manufacturing the memory cell includes forming a bistable element having at least first and second data storage nodes, forming a write-only port of the memory cell over an n-type diffusion region and forming a read-only port of the memory cell over a p-type diffusion region.

Abstract: A memory driving circuit includes a current source configured to output a second current, a first switching unit configured to undergo switching to connect to the current source selectively to output the second current, a voltage generating unit configured to provide a reference voltage, a capacitive energy storage unit configured to store energy according to the reference voltage, a third switching unit configured to undergo switching to connect the voltage generating unit and the capacitive energy storage unit selectively, a second switching unit configured to undergo switching to connect the capacitive energy storage unit selectively to output a third current, and a current output terminal configured to output the second current, the third current, or the sum of the second current and the third current.

Abstract: A multi-supply dual port register file is disclosed. The register file may be used for transferring data between two power domains that operate on different voltages or frequencies. The register file comprises a memory cell that stores the data transferred between the domains. The memory cell may be independently supplied by a reference voltage independent of that of the memory periphery. A write power domain write data to the memory cell in accordance with its operating voltage and frequency and an independent read power domain may read data from the memory cell in accordance with its independent operating voltage and frequency. The register file facilitates efficient crossing between the read and write power domains.

Abstract: A latch circuit includes: first to Nth storage nodes where N is an even number equal to or more than four; and first to Nth pairs of transistors, each of which comprises a PMOS transistor and an NMOS transistor coupled in series with each other through a corresponding node among the first to Nth storage nodes. The PMOS transistor is coupled to one of the storage nodes included in previous one of the pairs of transistors at a gate of the PMOS transistor. The NMOS transistor is coupled to one of the storage nodes included in next one of the pairs of transistors at a gate of the NMOS transistor. The PMOS transistors of the first to Nth pairs of transistors are formed in a first active region. The NMOS transistors of the first to Nth pairs of transistors are formed in a second active region, separated from the first active region.

Abstract: An integrated circuit has a first circuit portion on a first level and a second circuit portion on a second level different from the first level. The first circuit portion includes a first cell having a first voltage value at a first node and a second voltage value at a second node. The second circuit portion includes a second cell coupled with the first cell, the second cell being selectively controllable to supply a voltage to the first cell based on an instruction to supply the voltage. The instruction to supply the voltage is based on a determined mismatch between the first voltage value and the second voltage value being greater than a predetermined threshold value.

Abstract: This disclosure provides a content addressable memory which includes: a data memory cell for storing a data bit; a mask memory cell for storing a mask bit; and a comparing and readout unit connected to at least one read word line for receiving at least one read word signal, connected to at least one function bit line for receiving a search bit signal, and connected to the data memory cell and the mask memory cell for receiving the data bit and the mask bit; wherein the data memory cell is connected to a data-use write word line for receiving a data-use write word signal, the mask memory cell is connected to a mask-use write word line for receiving a mask-use write word signal, so as to decide whether a write bit signal can be written into the data bit and the mask bit through a pair of write bit lines.

Abstract: Random access memory having a plurality of memory cells, each of the plurality of memory cells having a memory element and a first electrical characteristic being variable based, at least in part, on temperature and a bias circuit operatively coupled to at least one of the plurality of memory cells, the bias circuit being configured to generate a bias voltage for the at least one of the plurality of memory cells. The bias circuit has a second electrical characteristic being variable based, at least in part, on temperature. The first electrical characteristic is approximately proportional to the second electrical characteristic over a predetermined range of temperatures, the predetermined range of temperatures being greater than zero. The bias voltage on each of the plurality of memory cells is approximately proportional with variations in the first electrical characteristic over the predetermined range of temperatures.

Abstract: A pulse width modulation device for use in an N-ports random access memory having a plurality of word line sets, wherein a specified word line set comprises N port word lines. The pulse width modulation device comprises a status detecting device and a clock signal generator. The status detecting device is coupled to the N port word lines having a first and a second port word line, and outputs a first control signal when both the voltage values of the first and second port word lines are within a first level range. The clock signal generator is coupled to the status detecting device and the specified word line set, and generates and outputs a first clock signal to the specified word line set, wherein a duration of the first clock signal kept within the first level range is variable in response to the first control signal.

Abstract: A non-volatile static random access memory (nvSRAM) circuit is provided. The nvSRAM circuit includes first and second switches and a latch circuit. The first switch has a first terminal coupled to a first bit line. The second switch has a first terminal coupled to a second bit line. The latch circuit is coupled to second terminals of the first and second switches. The latch circuit has a first non-volatile memory element. When the nvSRAM circuit is at a writing mode, first input data on the first bit line is written into in the latch circuit, and the first non-volatile memory element has a first state corresponding to the first data. When the nvSRAM circuit is at a reading mode, first readout data is generated according to the first state of the first non-volatile memory element is generated and provided to the first bit line.

Abstract: A semiconductor memory device having a memory cell array in which a plurality of memory cells are arranged in columns and rows to form a matrix pattern includes read word lines, read bit lines, and read source lines. Each of the plurality of memory cells includes: first and second inverters which are cross-coupled to each other; a first transistor which is connected between a read bit line and a read source line and of which the gate is connected to the output terminal of the first inverter; and a second transistor which is connected in series to the first transistor and of which the gate is connected to a read word line.

Abstract: A plurality of storage nodes in a single chassis is provided. Each of the plurality of storage nodes has a storage capacity with nonvolatile solid-state memory for user data storage. The plurality of storage nodes is configured to support uniform storage capacities and non-uniform storage capacities among the plurality of storage nodes, as a storage cluster. The plurality of storage nodes is configured to distribute the user data and metadata throughout the plurality of storage nodes such that the plurality of storage nodes can read the user data, using erasure coding, despite loss of two of the plurality of storage nodes.

Abstract: An integrated circuit can include multiple SRAM cells, each including at least two pull-up transistors, at least two pull-down transistors, and at least two pass-gate transistors, each of the transistors having a gate; at least one of the pull-up transistors, the pull-down transistors, or the pass-gate transistors having a screening region a distance below the gate and separated from the gate by a semiconductor layer, the screening region having a concentration of screening region dopants, the concentration of screening region dopants being higher than a concentration of dopants in the semiconductor layer, the screening region providing an enhanced body coefficient for the pull-down transistors and the pass-gate transistors to increase the read static noise margin for the SRAM cell when a bias voltage is applied to the screening region; and a bias voltage network operable to apply one or more bias voltages to the multiple SRAM cells.

Abstract: Two-Port SRAM cells are described. In an embodiment, a cell includes first, second, and read-port pull-down, first and second pull-up, first, second, and read-port pass-gate transistors. Each transistor includes a first source/drain region in an active area, a channel extending above the active area, and a second source/drain region above the channel. First source/drain regions of pull-down transistors are electrically coupled through a first active area. First source/drain regions of pull-up transistors are electrically coupled through a second active area. A first gate electrode is around channels of the first pull-up, first pull-down, and read-port pull-down transistors. A second gate electrode is around the channels of the second pull-up and pull-down transistors. Second source/drain regions of the first pull-up, pull-down, and pass-gate transistors are electrically coupled to the second gate electrode.

Abstract: The invention is provided to suppress a current supplied to a storage element so as not to vary for each layer in a semiconductor memory device obtained by connecting a plurality of memory cells in series. A semiconductor memory device according to the invention includes a plurality of memory cells connected in series between a first signal line and a second signal line, and supplies a different gate voltage to at least two of selection transistors included in the memory cells, respectively (refer to FIG. 2).

Abstract: A hybrid write-assist memory system includes an array voltage supply and a static random access memory (SRAM) cell that is controlled by bit lines and a word line and employs a separable cell supply voltage coupled to the array voltage supply. Additionally, the hybrid write-assist memory system includes a supply voltage droop unit that is coupled to the SRAM cell and provides a voltage reduction of the separable cell supply voltage during a write operation. Also, the hybrid write-assist memory system includes a negative bit line unit that is coupled to the supply voltage droop unit and provides a negative bit line voltage concurrently with the voltage reduction of the separable cell supply voltage during the write operation. A method of operating a hybrid write-assist memory system is also provided.

Abstract: Apparatus and methods are disclosed, including a method that raises an electrical potential of a plurality of access lines to a raised electrical potential, where each access line is associated with a respective charge storage device of a string of charge storage devices. The electrical potential of a selected one of the access lines is lowered, and a data state of the charge storage device associated with the selected access line is sensed while the electrical potential of the selected access line is being lowered. Additional apparatus and methods are described.

Abstract: A memory cell having integrated read and write assist functionality includes a storage element and first and second switching circuits. The first switching circuit is configured to selectively couple a first internal storage node of the storage element with a first bit line. The second switching circuit is configured to selectively couple a second internal storage node of the storage element with a second bit line. During a read operation, at least one of the first and second switching circuits is configured to increase a switching threshold of at least one inverter in the storage element. During a write operation, at least one of the first and second switching circuits is configured such that ground bounce associated with at least one of the first and second switching circuits assists in writing a logical state of the memory cell.

Abstract: An intermediate mode is set between the active mode in which a threshold voltage is low and a standby mode in which a threshold voltage is high. When a mode is shifted from the active mode to the standby mode, the threshold voltage for the active mode is raised temporarily to a threshold voltage for the intermediate mode and then the threshold voltage for the intermediate mode is raised to the threshold voltage for the standby mode. When a mode is shifted from the standby mode to the active mode, the threshold voltage for the standby mode is lowered temporarily to the threshold voltage for the intermediate mode and then the threshold voltage for the intermediate mode is lowered to the threshold voltage for the active mode.

Abstract: A latch circuit may include: first to Nth storage nodes where N is an even number equal to or more than four; first to Nth pairs of transistors each including a PMOS transistor and an NMOS transistor which are coupled in series through a corresponding storage node among the first to Nth storage nodes, wherein each of the first to Nth storage nodes is coupled to a gate of the NMOS transistor of the transistor pair at the previous stage and a gate of the PMOS transistor of the transistor pair at the next stage; first to Nth PMOS transistors suitable for driving corresponding storage nodes among the first to Nth storage nodes to a high level; and first to Nth NMOS transistors suitable for driving corresponding storage nodes among the first to Nth storage nodes to a low level.

Abstract: A static random access memory (SRAM) circuit includes a write port and a read port coupled to the write port. The read port includes a read bit line and a first p-type metal oxide semiconductor (PMOS) transistor having a silicon germanium (SiGe) channel. The read port also includes a second PMOS transistor having a second SiGe channel, where the second PMOS transistor is coupled to the first PMOS transistor.

Abstract: A wordline driver supply block supporting multiple operation modes of a memory of a microprocessor in a device for reducing power consumption thereof.

Abstract: A method of interleaving comprising: generating a combined data by combining, a plurality of columns of input data to be inputted to a plurality of adjacent sub-interleavers into a column, wherein data within same rows among the plurality of columns of input data have same delay time; writing the combined data row by row into an off-chip memory; delaying the combined data, by the off-chip memory; and splitting data outputted by the off-chip memory into the plurality of columns such that each split column includes data corresponding to one of the plurality of adjacent sub-interleavers.

Abstract: The present invention provides a technique for performing write operations within a memory device comprising an array of memory cells. Wordline driver circuitry is used to assert a wordline signal to activate an addressed memory cell in the array. Write driver circuitry is used to perform a write operation to write a data value into the addressed memory cell, and is responsive to assertion of a write assist enable signal during the write operation to implement a write assist mechanism. Further, control circuitry is used to control timing of assertion of the wordline signal in dependence on timing of assertion of the write assist enable signal. By making the timing of assertion of the wordline signal dependent on the timing at which the write assist enable signal is asserted, it has been found that writeability of the memory cells is significantly improved.

Abstract: A semiconductor memory is disclosed that includes a first data line, a second data line, a first coupling line and a second coupling line. The first coupling line is configured to capacitively couple the first coupling line with the first data line. The second coupling line is configured to capacitively couple the second coupling line with the second data line.

Abstract: In a non-volatile semiconductor memory device capable of programming SRAM data in an SRAM into a non-volatile memory unit while implementing a high-speed operation in the SRAM, a voltage required to program the SRAM data into the non-volatile memory unit can be lowered. Thus, the SRAM can be operated at high speed with a low power supply voltage because the thickness of a gate insulating film of each of a first access transistor, a second access transistor, a first load transistor, a second load transistor, a first drive transistor, and a second drive transistor constituting the SRAM connected to the non-volatile memory unit can be set to 4 [nm] or less. Therefore, the SRAM data in the SRAM can be programmed into the non-volatile memory unit while a high-speed operation in the SRAM can be implemented.

Abstract: A signal delay cell for use in resolving hold time violations in an IC has a first multiplexer having a first functional data input node and a scan data input node TI and a second multiplexer having a second functional data input node, a second input node connected to the output of the first multiplexer and a flip-flop module. The propagation of a data input signal applied to the first multiplexer is delayed, and the hold margin of the flip-flop module is increased by transit through the first multiplexer. The signal delay cell is available to replace a flip-flop having a scan data hold problem, and also for use in solving a functional data violation in the same or another cell.

Abstract: Embodiments include an array of SRAM cells, an SRAM cell, and methods of forming the same. An embodiment is an array of static random access memory (SRAM) cells including a plurality of overlapping rectangular regions. Each of overlapping rectangular regions including an entire first SRAM cell, a portion of a second adjacent SRAM cell in a first corner region of the rectangular region, and a portion of a third adjacent SRAM cell in a second corner region of the rectangular region, the second corner region being opposite the first corner region. Embodiments also include multi-finger cell layouts.

Abstract: A communication processor that is compatible with a plurality of communication protocols while limiting increases in circuit scale is provided. The communication processor includes a computational processing circuit resource having a plurality of programmable function units (FUs). An operation mode determination unit determines an operation mode indicating a communication protocol application state. A permitted processing time determination unit determines a permitted processing time in accordance with the determined operation mode. In accordance with the permitted processing time, a resource allocation unit divides the plurality of FUs and allocates computational resources for each communication protocol indicated by the operation mode. A region controller controls the allocated computation resources. The computational processing circuit resource outputs data from after the computational processing at the timing when the computation processing ends.

Abstract: A fin Field Effect Transistor (finFET) can include a source region and a drain region of the finFET. A gate of the finFET can cross over a fin of the finFET between the source and drain regions. First and second silicide layers can be on the source and drain regions respectively. The first and second silicide layers can include respective first and second surfaces that face the gate crossing over the fin, where the first and second surfaces are different sizes.

Abstract: Integrated circuits with memory cells are provided. The memory cells may be arranged in rows and columns. Each column of memory cells may be coupled to a respective pair of data lines. The data lines may be precharged using precharge circuitry. The precharge circuitry may include n-channel precharge transistors, an equalizer transistor, an isolation transistor, a pull-down transistor, a voltage booster, and control logic. The voltage booster may provide boosted voltage signal for overdriving the n-channel transistors by pulsing a control signal. During first pulse of the control signal, the data lines may be charged up to an intermediate voltage level. During second pulse of the control signal, the data lines may be charged up to a positive power supply voltage level that is greater than the intermediate voltage level. Performing double boosted data line precharge in this way can help reduce leakage and improve memory performance.

Abstract: To provide a semiconductor device including a volatile memory which achieves high speed operation and lower power consumption. For example, the semiconductor device includes an SRAM provided with first and second data holding portions and a non-volatile memory provided with third and fourth second data holding portions. The first data holding portion is electrically connected to the fourth data holding portion through a transistor. The second data holding portion is electrically connected to the third data holding portion through a transistor. While the SRAM holds data, the transistor is on so that both the SRAM and the non-volatile memory hold the data. Then, the transistor is turned off before supply of power is stopped, so that the data becomes non-volatile.

Abstract: A static random access memory (SRAM) includes a voltage generator coupled to receive a positive power supply voltage, and to controllably generate a first power supply voltage, which is with a reduced level and is higher than a retention voltage during a specific period. A first inverter and a second inverter each is connected between the first power supply voltage and a second power supply voltage. The first inverter and the second inverter are cross-coupled, and the output nodes of the first inverter and the second inverter act as a bit node pair.

Abstract: An SRAM cell with dynamic split ground (GND) and split wordline (WL) for extreme scaling is disclosed. The memory cell includes a first access transistor enabled by a first wordline to control access to cross coupled inverters by a first bitline. The memory cell further includes a second access transistor enabled by a second wordline to control access to the cross coupled inverters by a second bitline. The memory cell further includes a split ground line comprising a first ground line (GNDL) separated from a second ground line (GNDR). The GNDL is connected to a transistor of a first inverter of the cross coupled inverters and the GNDR is connected to a first transistor of a second inverter of the cross coupled inverters.

Abstract: A nonvolatile memory is provided. A semiconductor device (a nonvolatile memory) has a circuit configuration similar to that of a general SRAM. By providing a transistor whose off-state current is small between a stored data holding portion and a power supply line of the SRAM, leakage of electric charge from the stored data holding portion is prevented. As the transistor whose off-state current is small provided for preventing leakage of electric charge from the stored data holding portion, a transistor including an oxide semiconductor film is preferably used. Such a configuration can also be applied to a shift register, whereby a shift register with low power consumption can be obtained.

Abstract: A programmable logic device (PLD) is provided with a two-level voltage regulator for powering SRAM cells within the device. In one example, a PLD includes a plurality of static random access memory (SRAM) cells configured to store a configuration for the programmable logic device. The PLD also includes a two-level voltage regulator configured to selectively charge a first power supply node to a reduced voltage and to an enhanced voltage that is greater than the reduced voltage. The SRAM cells are powered through a coupling to the first power supply node. The PLD also includes a control circuit configured to control the two-level voltage regulator to charge the first power supply node to the reduced voltage during a write operation for the SRAM cells and to charge the first power supply node to the enhanced voltage during normal operation of the configured programmable logic device.

Abstract: The disclosed technology relates generally to electromechanical devices, and relates more specifically to a nanoelectromechanical switch device and a method for manufacturing the same. In one aspect, an electromechanical device includes a first electrode stack and a second electrode stack, both electrode stacks extending in a vertical direction relative to a substrate surface and being spaced apart by a gap.

Abstract: Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate and a contact formed adjacent to the gate structures over the substrate. The semiconductor structure further includes a plurality of metal layers formed over the gate structures. In addition, some of the metal layers include metal lines extending in the first direction, and some of the metal layers include metal lines extending in a second direction substantially perpendicular to the first direction. Furthermore, the gate structures follow the following equation: 0.2 ? ? P gate ? ? min + 0.35 ? ? L gate ? ? min + 0.3 ? ? H gate ? ? min - 20 0.2 ? ? L gate ? ? min + 0.8 ? ? H gate ? ? min - 5 × 0.3 ? ? L gate ? ? min + 0.3 ? ? H gate ? ? min + 5 38 ? 0.32 Pgate min is the minimum value among gate pitches of the gate structures.

Abstract: A static memory cell is provided. The static memory cell includes a data latch circuit and a voltage provider. The data latch circuit is configured to store a bit data. The data latch circuit has a first inverter and a second inverter, and the first inverter and the second inverter are coupled to each other. The first inverter and the second inverter respectively receive a first voltage and a second voltage as power voltages. The voltage provider provides the first voltage and the second voltage to the data latch circuit. When the bit data is written to the data latch circuit, the voltage provider adjusts a voltage value of one of the first and second voltages according to the bit data.

Abstract: Integrated circuits with memory cells are provided. A memory cell may include first and second cross-coupled inverting circuits configured to store a single data bit. The first inverting circuit may have an output serving as a first data storage node for the memory cell, whereas the second inverting circuit may have an output serving as a second data storage node for the memory cell. Access transistors may be coupled between the first and second data storage nodes and corresponding data lines. Each of the first and second inverting circuit may have a pull-down transistor and at least two pull-up transistors stacked in series. The pull-down transistors may have body terminals that are reverse biased to help reduce leakage current through the first and second inverting circuits. The memory cell may be formed using a narrower two-gate configuration or a wider four-gate configuration.

Abstract: Methods and systems to provide bit cell write-assist, including equalization of voltages of Bit and Bit nodes of a bit cell prior to a write operation. Equalization may be performed with a pulse-controlled transistor to transfer charge between the storage nodes. Pulse width and/or amplitude may be configurable, such as to scale with voltage. Bit cell write-assist may include reduction of bit cell retention strength during equalization, which may be continued during a write operation. Write-assist may be provided to each of multiple bit cells when a write operation is directed to a subset of the bit cells, which may conserve power and/or area. A partially-decoded address may be used to provide write-assistance to multiple bit cells prior to a write operation. Write-assistance may permit writing of Bit and Bit with a voltage swing significantly lower than an operating voltage of the bit cell.

Abstract: A capacitance coupled to a memory node and a word line of an SRAM cell provides an electrostatic capacitance between the memory node and the word line. The capacitance has a first electrostatic capacitance when the word line is in a nonselective state (usually a LOW level) and the memory node retains a HIGH level; the capacitance has a second electrostatic capacitance which is smaller than the first electrostatic capacitance when the word line is in the nonselective state (usually the LOW level) and the memory node retains the LOW level.

Abstract: A semiconductor memory device comprises an array of memory cells arranged in rows and columns, control lines coupled to the rows of memory cells for accessing the memory cells, conductive lines coupled to the rows of memory cells for powering the memory cells, and a control circuit configured to maintain non-selected conductive lines at a first voltage level and boost a selected conductive line to a second voltage level in an access operation, the second voltage level being higher than the first voltage level.