Abstract: A memory device having a memory cell comprising NMOS only transistors. An SRAM bit cell comprises a first pass gate (PG) NMOS transistor coupled to a first bit line signal and a word line signal; a second PG NMOS transistor coupled to a second bit line signal and the word line signal; a first pull down (PD) NMOS transistor operatively coupled to the first PG NMOS transistor; a second PD NMOS transistor operatively coupled to the second PG NMOS transistor; a first pull up (PU) NMOS transistor operatively coupled to the first PD NMOS transistor; and a second PU NMOS transistor operatively coupled to the second PD NMOS transistor. Each of the back gates of the first and second PU NMOS transistors are coupled to a predetermined voltage signal for biasing the first and second PU NMOS transistors.

Abstract: Packaged integrated circuit devices include an oscillator circuit having a resonator (e.g., quartz crystal, MEMs, etc.) associated therewith, which is configured to generate a periodic reference signal. A built-in self-test (BIST) circuit is provided, which is selectively electrically coupled to first and second terminals of the resonator during an operation by the BIST circuit to test at least one performance characteristic of the resonator, such as at least one failure mode. These test operations may occur during a built-in self-test time interval when the oscillator circuit is at least partially disabled. In this manner, built-in self-test circuitry may be utilized to provide an efficient means of testing a resonating element/structure using circuitry that is integrated within an oscillator chip and within a wafer-level chip-scale package (WLCSP) containing the resonator.

Abstract: A system for dual mode operation having power saving and active modes in a stacked circuit topology having logic preservation is provided. The system includes a pre-charge circuit and a sleep mode control circuit for providing a signal to disable a plurality of circuit elements and switching a mode of the system, the sleep mode control circuit being coupled to the pre-charge circuit and further being coupled to a logic function circuit, wherein the plurality of circuit elements comprise logic gates and transistor devices. The system also includes a keeper circuit coupled to the global bitline, and the logic function circuit coupled to a solar bitline, wherein the logic function circuit preserves a state of the solar bitline, the state of the global bitline determines the state of the solar bitline. The system includes an effective pull-up transistor coupled to the sleep mode control circuit and the logic function circuit.

Abstract: A memory device includes a memory cell array including a plurality of memory cell groups, and a decoder circuit configured to control selection of the memory cell groups. The decoder circuit includes an address decoder circuit configured to activate the decoder circuit based on an input address, a plurality of information retention circuits, each of which corresponds to one of the memory cell groups and outputting a signal that indicates whether or not the corresponding memory cell group is defective, a transistor having a gate connected to each of the outputs of the information retention circuits, and a signal output circuit configured to output a control signal for selecting or not selecting the memory cell groups based on an on/off state of the transistor.

Abstract: Disclosed herein is an electronic device including a bit line and a complementary bit line, first and second cross coupled inverters, a first pass gate coupled between the complementary bit line and the first inverter, and a second pass gate coupled between the bit line and the second inverter. The electronic device also includes third and fourth cross coupled inverters, a third pass gate coupled between the complementary bit line and the third inverter, and a fourth pass gate coupled between the bit line and the fourth inverter. The first, second, and fourth inverters are powered between a supply node and a reference node, and the third inverter is powered between a floating node and the reference node. The first pass gate and third pass gate are coupled in parallel.

Abstract: A method includes using a first tracking circuit corresponding to a first set of access ports of a memory macro to cause a signal transition of a first tracking signal based on an edge of a clock signal. Using a second tracking circuit corresponding to a second set of access ports of the memory macro, a signal transition of a second tracking signal is caused based on the edge of the clock signal. A reset signal is generated based on the signal transition of the first tracking signal and the signal transition of the second tracking signal. A read operation or a write operation on the memory macro is performed based on the edge of the clock signal and the reset signal.

Abstract: A static random-access memory is described. The SRAM includes a storage cell and a voltage supply to supply the storage cell with a reduced voltage during a write operation. The SRAM cell includes a first pass gate and a second pass gate. A first resistor is coupled between the first pass gate and a first side of the storage cell. A second resistor is coupled between the second pass gate and a second side of the storage cell.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: Passive write assist passively improves SRAM performance (e.g., write margin speed) while reducing manufacturing costs (e.g., die area, packaging) and operating costs (e.g., power consumption, cooling) associated with active write assist schemes. Passive write assist may be implemented in peripheral circuitry or embedded in an SRAM array or even in each array cell or bitcell. For example, one or more memory cells may be converted to provide passive write assist to a plurality of other memory cells. As another example, each memory cell may independently implement passive write assist using one or more high resistive contacts to couple to the array power supply, resulting in the array voltage level being changed by different amounts in different memory cells according to cell variations.

Abstract: An integrated circuit is provided having a semiconductor structure, the semiconductor structure including a vertical field-effect transistor; and a diode wherein the vertical field-effect transistor and the diode are co-integrated in the semiconductor structure.

Abstract: In some examples, a nonvolatile storage element may be configured to store a state or value during a low power or powered down period of a circuit. For example, the nonvolatile storage element may include a bridge of resistive elements that have a resistive state that may be configured by applying voltages to multiple drive paths. A sense amplifier may be connected to the bridge in order to resolve a voltage differential associated with the bridge to either power or ground and, thereby determine the state associated with on the nonvolatile storage element.

Abstract: A semiconductor memory device includes a plurality of memory cells, a data bus connected to a first column of the memory cells, by which data is transferred to and from the memory cells of the first column, a data latch storing data indicating whether the first column is defective or not, and a transistor having a first terminal connected to the data bus, a second terminal connected to a voltage source, and a gate connected to an output of the data latch.

Abstract: Within a memory 2 comprising an array 4 of bit cells 6 write driver circuitry 14 uses a boosted write signal which is boosted to a lower than normal level during a write operation. Column select transistors 16 are driven by column select circuitry 12. The column select signal is boosted to a lower than normal level when a column is unselected and to higher than a normal level when a column is selected. Voltage boost circuitry, such as charge pumps 20, 22 are employed within the column select circuitry 12 to achieve these boosted levels for the columns select signal.

Abstract: An integrated circuit includes a first conductive line on a first metal level of the integrated circuit. The integrated circuit further includes a second conductive line on a second metal level of the integrated circuit. The integrated circuit further includes a slot via electrically connecting the first conductive line with the second conductive line. The slot via overlaps with the first conductive line and the second conductive line. The slot via extends beyond a periphery of at least one of the first conductive line or the second conductive line.

Abstract: An integrated circuit can include multiple SRAM cells, each including at least two pull-up transistors, at least two pull-down transistors, and at least two pass-gate transistors, each of the transistors having a gate; at least one of the pull-up transistors, the pull-down transistors, or the pass-gate transistors having a screening region a distance below the gate and separated from the gate by a semiconductor layer, the screening region having a concentration of screening region dopants, the concentration of screening region dopants being higher than a concentration of dopants in the semiconductor layer, the screening region providing an enhanced body coefficient for the pull-down transistors and the pass-gate transistors to increase the read static noise margin for the SRAM cell when a bias voltage is applied to the screening region; and a bias voltage network operable to apply one or more bias voltages to the multiple SRAM cells.

Abstract: Apparatus, systems, and methods to implement polarity based data transfer function on a write data unit are described. The transfer function takes into account certain data values that are common, and transforms them to predetermined values that consume less power and are less common. Similarly, these predetermined values are transformed to the common values.

Abstract: A fine grained negative wordline scheme for SRAM memories is disclosed. The scheme includes a circuit having a static random access memory (SRAM) cell including at least a wordline coupled to a plurality of NFETs of a transistor array. The circuit further includes a wordline driver including a plurality of inverters coupled between a wordline group decode node, a power supply and the wordline. Overvoltage on the wordline driver and NFETs of the SRAM cell are eliminated by applying a power gating mode and lowering the power supply voltage.

Abstract: A semiconductor integrated circuit which can respond to changes of the amount of retained data at the time of standby is provided. The semiconductor integrated circuit comprises a logic circuit (logic) and plural SRAM modules. The plural SRAM modules perform power control independently of the logic circuit, and an independent power control is performed among the plural SRAM modules. Specifically, one terminal and the other terminal of a potential control circuit of each SRAM module are coupled to a cell array and a local power line, respectively. The local power line of one SRAM module and the local power line of the other SRAM module share a shared local power line. A power switch of one SRAM module and a power switch of the other SRAM module are coupled in common to the shared local power line.

Abstract: According to one embodiment of the present disclosure, an apparatus is provided. The apparatus comprises a data input to receive a data signal. The apparatus further comprises a latching circuitry. The latching circuitry comprises a first Correlated Electron Switch (CES) element and a second CES element. The latching circuitry further comprises a control circuit coupled to the first CES element and the second CES element. The control circuit is configured to program impedance states of the first CES element and the second CES element based on the data signal.

Abstract: Static random access memory (SRAM) bitcell structures with improved minimum operation voltage (Vmin) and yield are provided. The structures may include a silicon substrate, a deep n-well (DNW) layer, p-well (PW) regions, doped back-plate (BP) regions, a buried oxide (BOX) layer, and/or active regions formed on the BOX layer and over portions of the BP regions. At least one BP region may extend below at least one shallow trench isolation (STI) region, at least one contact to back plate (CBP), at least one active region and at least one PC construct overlapping the at least one active region forming a channel of at least one of a first pass gate (PG1) transistor and a second pass gate (PG2) transistor. The at least one CBP facilitates biasing of at least one the PG1 and PG2 transistors during at least one of a read, write or standby operation of the structures.

Abstract: A semiconductor memory apparatus includes an effective region which is a portion of the memory region and functions as a data storage space, a residual region which is another portion of the memory region, and a capacity control circuit which restricts supply of power and signals to the residual region.

Abstract: A memory write tracking device is applied to a data write operation to at least a memory cell row. The memory write tracking device includes a dummy cell row, a variation sensor, a judging device and a word-line pulse generator. The dummy cell row includes a plurality of dummy memory cells for simulating the data write operation to the memory cell row. The variation sensor senses a set of circuit parameters for write ability of the memory cell row. The judging device determines a threshold number according to a change of the set of circuit parameters and sends an enabling signal when a threshold number of the dummy memory cells have been successfully written with the data. The word-line pulse generator determines a write cycle of the data write operation in response to the enabling signal. An associated memory write tracking method is also provided.

Abstract: A circuit for implementing a write operation of a memory is described. The circuit comprises a data line buffer coupled to a data line and an inverted data line for writing data; a plurality of memory elements, each memory element having a first node coupled to the data line and a second node coupled to the inverted data line; and a write assist circuit having a first node coupled to data line and a second node coupled to the inverted data line, wherein the write assist circuit comprises a pair of pull-down transistors comprising first pull-down transistor coupled to the first node of an amplifier portion and a second pull-down transistor coupled to a second node of the amplifier portion, and a pair of pull-up transistors comprising a first pull-up transistor coupled to the first node of the amplifier portion and a second pull-up transistor coupled to the second node of the amplifier portion. A method of implementing a write operation of a memory of a memory is also described.

Abstract: A circuit arrangement for enabling a partial reconfiguration of a circuit implemented in an integrated circuit device is described. The circuit arrangement comprises a plurality of circuit blocks, wherein each circuit block is configurable to implement a predetermined function and comprises a control circuit configured to receive a global enable signal and a plurality of global reconfiguration signals; and a routing network coupled to the plurality of circuit blocks for routing the global enable signal and the plurality of global reconfiguration signals to each circuit block of the plurality of circuit blocks; wherein each circuit block of the plurality of circuit blocks is configured to independently receive a local enable signal enabling a partial reconfiguration of the circuit in response to the plurality of global reconfiguration signals.

Abstract: A memory and apparatus are disclosed. The memory includes a memory core having a plurality of memory cells. The memory also includes a first write assist circuit configured to assist writing to a first group of the plurality of memory cells of the memory core. Additionally, the memory includes a second write assist circuit configured to assist writing to a second group of the plurality of memory cells of the memory core. The apparatus includes at least one processor. The apparatus also includes a memory array. The memory array includes a memory core having a plurality of memory cells. The memory also includes a first write assist circuit configured to assist writing to a first group of the plurality of memory cells of the memory core and a second write assist circuit configured to assist writing to a second group of the plurality of memory cells of the memory core.

Abstract: A semiconductor memory device includes a first and a second TFET whose gates and drains are cross-coupled. The drain of the first TFET is connected to a first node. The drain of the second TFET is connected to a second node. Included are a first access transistor connecting the first node to a first write bit line, a second access transistor connecting the second node to a second write bit line, and a third access transistor connecting the first node to a first read bit line. The first access transistor is constructed of a TFET connected in such a manner as that current flows from the first node to the first write bit line upon turning-on. The second access transistor is constructed of a TFET connected in such a manner as that current flows from the second node to the second write bit line upon turning-on.

Abstract: A memory comprised of a plurality of single port SRAM memory cells, each driven by two word lines in an asynchronous manner has a hold mode, a read mode and a write mode. Each of the single port SRAM memory cells includes a first write switch, a second write switch and a latch. The first write switch is electrically connected to a first word line and is turned on by a first turn-on signal transmitted by the first word line. The second write switch is electrically connected to a second word line and is turned on by a second turn-on signal transmitted by the second word line. When the memory is in the write mode, the second write switch is turned on by the second turn-on signal having a delay with respect to the first turn-on signal, thereby blocking the pseudo read of the unselected memory cell.

Abstract: Embodiments of the present invention disclose a service data transmission method. An AN entity of a first network sends a first request message to an AN entity of a second network corresponding to a target cell in which a UE is located, so as to request the AN entity of the second network to establish a radio bearer for the UE. The AN entity of the first network sends a second request message to the UE, so as to request the UE to establish the radio bearer with the AN entity of the second network. After the AN entity of the second network has established the radio bearer with the UE, the AN entity of the first network transmits service data to the UE by using the AN entity of the second network.

Abstract: In an image information chip or the like, a multi-port SRAM is embedded with a logic circuit. When the 3 port is used, the 1 port may serve as a differential write and readout port, and the 2 port may serve as a single ended readout dedicated port. While the occupied area of an embedded SRAM can be reduced, the number of write and readout ports is limited to only one, and readout characteristics as fast as differential readout cannot be expected in single ended readout. A new arrangement is therefore provided in which three differential write and readout ports are included in a memory cell structure of the embedded SRAM, an N-well region, for example, is arranged at the center of a cell, and a P-well region is arranged on both sides thereof.

Abstract: Provided is a semiconductor storage device including: first memory cells; first word lines; first bit lines; a first common bit line; second memory cells; second word lines; second bit lines; a second common bit line; a first selection circuit that connects the first common bit line to a first bit line selected from the first bit lines; a second selection circuit that connects the second common bit line to a second bit line selected from the second bit lines; a word line driver that activates any one of the first and second word lines; a reference current supply unit that supplies a reference current to a common bit line among the first and second common bit lines, the common bit line not being electrically connected to a data read target memory cell; and a sense amplifier that amplifies a potential difference between the first and second common bit lines.

Abstract: Embodiments include apparatuses, methods, and systems related to an assist circuit that may be coupled to one or more components of a memory system to selectively lower a supply voltage that is delivered to the component. For example, the assist circuit may be coupled to a plurality of bitcells (e.g., register file bitcells). The assist circuit may selectively lower the supply voltage delivered to the bitcells during at least a portion of a write operation and/or during an inactive state of the bitcells. Additionally, or alternatively, the assist circuit may be coupled to a read circuit to selectively lower the supply voltage delivered to the read circuit during an inactive state of the read circuit. The assist circuit may include a control transistor coupled in parallel with one or more diodes between a main supply rail and a supply node of the bitcells and/or read circuit.

Abstract: Memory cell of the SRAM type, including storage transistors forming a memory point for storing a bit and a read port having at least one MOS transistor, a TFET transistor, a power terminal and a read bit line whereof a potential is designed to vary depending on the value of the stored bit, and such that: the gate of the MOS transistor is connected to the memory point, and the gate of the TFET transistor is able to receive a read command signal; a first electrode of the MOS transistor is connected to the power supply terminal; a second electrode of the MOS transistor is connected to a first electrode of the TFET transistor; a second electrode of the TFET transistor is connected to the read bit line.

Abstract: A sense amplifier enable signal generating circuit includes an input coupled to a dummy bit line of a memory. A voltage comparator circuit compares a voltage on the dummy bit line to a threshold voltage and generates an output signal when the voltage falls below that threshold voltage. A multi-bit counter circuit counts a count value in response to the output signal. A pull-up circuit pulls up the voltage on the dummy bit line in response to the output signal. A count comparator circuit compares the count value to a count threshold and generates a sense amplifier enable signal when the count value equals the count threshold.

Abstract: An integrated circuit includes: a latch unit suitable for inverting a voltage level of a first node and driving a second node with the inverted voltage level of the first node, and inverting a voltage level of the second node and driving the first node with the inverted voltage level of the second node; and a sink unit coupled with one or more among the first and second nodes, and suitable for sinking a charge of the coupled node.

Abstract: A memory macro comprises a plurality of columns and a plurality of footers. A column of the plurality of columns comprises a plurality of nodes corresponding to a plurality of memory cells in the column. A footer of the plurality of footers corresponds to each column of the plurality of columns, is coupled with the plurality of nodes of the each column, and, in response to a column select signal of the plurality of columns, is configured to have a first current-sinking capability or a second current-sinking capability different from the first current-sinking capability.

Abstract: A fine grained negative wordline scheme for SRAM memories is disclosed. The scheme includes a circuit having a static random access memory (SRAM) cell including at least a wordline coupled to a plurality of NFETs of a transistor array. The circuit further includes a wordline driver including a plurality of inverters coupled between a wordline group decode node, a power supply and the wordline. Overvoltage on the wordline driver and NFETs of the SRAM cell are eliminated by applying a power gating mode and lowering the power supply voltage.

Abstract: A memory device may include a first inverter, a second inverter, and a control transistor. The control transistor is electrically connected to each of an output terminal of the first inverter and an input terminal of the second inverter for controlling an electrical connection between the output terminal of the first inverter and the input terminal of the second inverter.

Abstract: Embodiments include a read column select negative boost driver of a memory device. The negative boost driver may include a negative boost element coupled to a P-type metal-oxide-semiconductor (PMOS) pass gate, and configured to negatively boost a read column select signal below a negative power supply level VSS dependent on a boost control signal. The negative boost driver may further include an N-type metal-oxide-semiconductor (NMOS) boost control transistor coupled to the negative boost element and to a read column select inverter, and configured to tri-state the read column select inverter dependent on the boost control signal.

Abstract: In a semiconductor memory device, static memory cells are arranged in rows and columns, word lines correspond to respective memory cell rows, and word line drivers drive correspond to word lines. Cell power supply lines correspond to respective memory cell columns and are coupled to cell power supply nodes of a memory cell in a corresponding column. Down power supply lines are arranged corresponding to respective memory cell columns, maintained at ground voltage in data reading and rendered electrically floating in data writing. Write assist elements are arranged corresponding to the cell power supply lines, and according to a write column instruction signal for stopping supply of a cell power supply voltage to the cell power supply line in a selected column, and for coupling the cell power supply line arranged corresponding to the selected column at least to the down power supply line on the corresponding column.

Abstract: A static random access memory (SRAM) device is provided in accordance with some embodiments. The SRAM device comprises a plurality of two-port SRAM arrays, which comprise a plurality of two-port SRAM cells. Each two-port SRAM cell comprises a write port portion, a read port portion, a first plurality of metal lines located in a first metal layer, a second plurality of metal lines located in a second metal layer, a third plurality of metal lines located in a third metal layer a plurality of edge cells, a plurality of well strap cells, and a plurality of jumper structures. Each jumper structure comprises first, second, and third metal landing pads located in the second metal layer and electrically connecting metal lines of the first and third metal layers.

Abstract: Collision detection systems for detecting read-write collisions in memory systems after word line activation are disclosed. In one aspect, a collision detection system is provided. The collision detection system includes a collision detection circuit for each bit cell row of memory array. Each collision detection circuit is configured to receive a write and read word line signal corresponding to the bit cell row. The collision detection circuit is configured to detect a write and read word line signal pair being active for a write and read operation for the same bit cell row. The collision detection circuit is configured to generate a collision detection signal to notify clients associated with the memory system that a read-write collision occurred. Detecting the read-write collisions after read word line activation reduces or avoids overhead delays in the read path, as opposed to detecting read-write collisions prior to activation of the read word line.

Abstract: A method of operating an SRAM array may include: providing a plurality of bit cells, each of the plurality of bit cells comprising a cross coupled inverter pair; a first pass gate; and a second pass gate. A word line voltage may be applied to the first pass gate and the second pass gate, while a first cell positive voltage supply CVdd may be applied to terminals of the cross coupled inverter pair. The first cell positive voltage supply CVdd may be varied relative to the word line voltage during a selected operation of the plurality of bit cells.

Abstract: An integrated circuit structure includes an SRAM array including a first sub-array having a first plurality of rows and a plurality of columns of SRAM cells, and a second sub-array having a second plurality of rows and the plurality of columns of SRAM cells. A first bit-line and a first complementary bit-line are connected to the first and the second pass-gate MOS devices of SRAM cells in a column in the first sub-array. A second bit-line and a second complementary bit-line are connected to the first and the second pass-gate MOS devices of SRAM cells in the column in the second sub-array. The first bit-line and the first complementary bit-line are disconnected from the second bit-line and the second complementary bit-line. A sense amplifier circuit is electrically coupled to, and configured to sense, the first bit-line, the first complementary bit-line, the second bit-line, and the second complementary bit-line.

Abstract: The invention concerns a memory cell comprising first and second resistive elements (202, 204) coupled respectively between first and second storage nodes and first and second intermediate nodes, at least one of them being programmable to take up one of at least two resistive states (Rmin? Rmax); a third transistor (220) coupled between the first and second intermediate nodes; a fourth transistor (502) coupled between the first storage node (206, 210) and a data input node (506); and a control circuit arranged, during a write phase, to activate the third and fourth transistors and to couple the data input node to a second supply voltage (VDD, GND) via a first circuit block (508) in order to generate a current in a first direction through the first and second resistive elements in order to program the resistive state of at least one of the elements.

Abstract: Pipelining is included inside a register file memory. A register file memory device includes a static bitcell, and pipelined combinational logic. The combinational logic pipeline couples the I/O (input/output) node to the static bitcell. The pipeline includes multiple stages, where each stage includes a static logic element and a register element, where the operation of each stage transfers data through to a subsequent stage. The number of stages can be different for a read than a write. The multiple stages perform the operations to execute the read or write request.

Abstract: In some embodiments, a circuit comprises a plurality of memory banks, a column line tracking loop and/or a row line tracking loop, and a tracking circuit. The plurality of memory banks are arranged in a plurality of rows and a plurality of columns of memory building blocks. The column line tracking loop traverses at least a portion of the plurality of rows. The row line tracking loop traverses at least a portion of the plurality of columns. The tracking circuit is configured to receive a first edge of a first signal, cause the first edge of a first signal to be propagated through the column line tracking loop and/or through the row line tracking loop and cause a second edge of the first signal when receiving the propagated first edge of the first signal. The first signal is associated with accessing of the plurality of memory banks.

Abstract: A memory including an array of nvSRAM cells and method of operating the same are provided. Each nvSRAM cell includes a volatile charge storage circuit, and a non-volatile charge storage circuit including exactly one non-volatile memory (NVM) element, a first transistor coupled to the NVM element through which data true is coupled to the volatile charge storage circuit, a second transistor coupled to the NVM element through which a complement of the data is coupled to the volatile charge storage circuit and a third transistor through which the NVM element is coupled to a positive voltage supply line (VCCT). In one embodiment, the first transistor is coupled to a first node of the NVM element, the second transistor is coupled to a second node of the NVM element and the third transistor is coupled between the first node and VCCT. Other embodiments are also disclosed.

Abstract: A memory and a method for operating a memory are provided. The memory includes a memory cell having a first circuit to store a bit and a second circuit to decouple the stored bit from a power supply and from a return. The method includes storing a bit in a memory cell by a first circuit and decoupling the stored bit from a power supply and a return by a second circuit. Another memory is provided. The memory includes a memory cell having means for storing a bit by a feedback and means for disabling the feedback.

Abstract: In an embodiment of the invention, power is provided to an SRAM array without causing latch-up by charging the positive voltage node in the SRAM array and the Nwell regions in the SRAM at approximately the same rate.

Abstract: A memory system may provide for a successful write of a multi-port memory cell (e.g., dual-port 2WR SRAM cell) when it is simultaneously accessed by more than one port. This multi-port memory cell may include at least two independent accesses to the memory cell, where each access may be controlled by an independent wordline signal. Each port may have an independent pair of bitlines. Multiple write circuitry (e.g., double write circuitry) may enable the write driver to drive the input data to more than one pair of bitlines simultaneously.