Abstract: A block control device for a semiconductor memory and a method for controlling the same are disclosed, which relate to a technology for controlling a block operation state of a Low Power Double-Data-Rate 2 (LPDDR2) non-volatile memory device. A block control device for use in a semiconductor memory includes a block address comparator configured to compare a first block address with a last block address, and output a same pulse or unequal pulse according to the comparison result, a block address driver configured to output a lock state control signal for driving a block address in response to the same pulse, a block address counter configured to count block addresses from the first block address to the last block address in response to the unequal pulse, and generate a block data activation pulse, and a block address register configured to store a lock state of a corresponding block in response to the lock state control signal and the block data activation pulse.

Abstract: Non-volatile storage elements having a P?/metal floating gate are disclosed herein. The floating gate may have a P? region near the tunnel oxide, and may have a metal region near the control gate. A P? region near the tunnel oxide helps provide good data retention. A metal region near the control gate helps to achieve a good coupling ratio between the control gate and floating gate. Therefore, programming of non-volatile storage elements is efficient. Also, erasing the non-volatile storage elements may be efficient. In some embodiments, having a P? region near the tunnel oxide (as opposed to a strongly doped p-type semiconductor) may improve erase efficiency relative to P+.

Abstract: A non-volatile memory has its cells' thresholds programmed within any one of a first set of voltage bands partitioned by a first set of reference thresholds across a threshold window. Hard bits are obtained when read relative to the first set of reference thresholds. The cells are read at a higher resolution relative to a second set of reference thresholds so as to provide additional soft bits for error correction. The soft bits are generated by a combination of a first modulation of voltage on a current word line WLn and a second modulation of voltage on an adjacent word line WLn+1, as in a reading scheme known as “Direct-Lookahead (DLA)”.

Abstract: Memory cell structures and methods are described herein. One or more memory cells include a transistor having a charge storage node, a dielectric material positioned between the charge storage node and a channel region of the transistor, the channel region positioned between a source region and a drain region, and a first electrode of a diode coupled to the charge storage node.

Abstract: Techniques for providing a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a direct injection semiconductor memory device including a first region connected to a bit line extending in a first orientation and a second region connected to a source line extending in a second orientation. The direct injection semiconductor memory device may also include a body region spaced apart from and capacitively coupled to a word line extending in the second orientation, wherein the body region is electrically floating and disposed between the first region and the second region. The direct injection semiconductor memory device may further include a third region connected to a carrier injection line extending in the second orientation, wherein the first region, the second region, the body region, and the third region are disposed in sequential contiguous relationship.

Abstract: A method for data storage includes accepting data for storage in a memory that includes multiple analog memory cells. The data is stored in a first group of the memory cells by programming a second group of the memory cells so as to cause the second group to generate interference in the first group, and individually erasing the first group while verifying that analog levels of the memory cells in the first group subject to the interference are within a predefined bound following erasure. After erasing the first group, the first group of the memory cells is programmed with the data.

Abstract: A mass storage device that utilizes one or more solid-state memory components to store data for a host system, and a method for increasing the write endurance of the memory components. The memory components are periodically heated above an intrinsic operating temperature thereof to a preselected temperature that is sufficient to thermally recondition the memory component in a manner that increases the write endurance of the memory component.

Abstract: An apparatus, system, and method are disclosed for bad block remapping. A bad block identifier module identifies one or more data blocks on a solid-state storage element as bad blocks. A log update module writes at least a location of each bad block identified by the bad block identifier module into each of two or more redundant bad block logs. A bad block mapping module accesses at least one bad block log during a start-up operation to create in memory a bad block map. The bad block map includes a mapping between the bad block locations in the bad block log and a corresponding location of a replacement block for each bad block location. Data is stored in each replacement block instead of the corresponding bad block. The bad block mapping module creates the bad block map using one of a replacement block location and a bad block mapping algorithm.

Abstract: A capacitor-less memory cell, memory device, system and process of forming the capacitor-less memory cell includes forming the memory cell in an active area of a substantially physically isolated portion of the bulk semiconductor substrate. A pass transistor is formed on the active area for coupling with a word line. The capacitor-less memory cell further includes a read/write enable transistor vertically configured along at least one vertical side of the active area and operable during a reading of a logic state with the logic state being stored as charge in a floating body area of the active area, causing different determinable threshold voltages for the pass transistor.

Abstract: Methods of forming nonvolatile memory devices include forming a vertical stack of nonvolatile memory cells on a substrate. This is done by forming a vertical stack of spaced-apart gate electrodes on a first sidewall of a vertical silicon active layer and treating a second sidewall of the vertical silicon active layer in order to reduce crystalline defects within the active layer and/or reduce interface trap densities therein. This treating can include exposing the second sidewall with an oxidizing species that converts a surface of the second sidewall into a silicon dioxide passivation layer. A buried insulating pattern may also be formed directly on the silicon dioxide passivation layer.

Abstract: A semiconductor memory device, a method of manufacturing the same, and a cell array of a semiconductor memory device are provided. The semiconductor memory device includes: a first gate insulation layer and a second gate insulation layer, being spaced a predetermined distance from each other, on a portion of a semiconductor substrate; a select gate on the first gate insulation layer; a floating gate on the second gate insulation layer; a third gate insulation layer on the floating gate; a control gate on the third gate insulation layer; a first ion implantation region in the semiconductor substrate between the select gate and the floating gate; a second ion implantation region in the semiconductor substrate at a side of the select gate opposite the first ion implantation region; and a third ion implantation region in the semiconductor substrate at a side of the floating gate opposite the first ion implantation region.

Abstract: Strings of memory cells having a string select gate configured to selectively couple ends of a string to a data line and a source line concurrently, memory devices incorporating such strings and methods for accessing and forming such strings are provided. For example, non-volatile memory devices are disclosed that utilize vertical structure NAND strings of serially-connected non-volatile memory cells. One such string including two or more serially-connected non-volatile memory cells where each end of the string shares a string select gate with the other end of the string is disclosed.

Abstract: Operational information read out by a read-out sense amplifier (19) is transferred via the data line DB to a volatile memory section. The volatile memory section is configured with the volatile memory section (21) having a SRAM configuration and the second volatile memory section (23) configured with latch circuits, both sections respectively connected in parallel with the data line DB. The operational information, which may be provided depending on an operation state of the write-protect information and other information stored in the non-volatile memory cell MC selected by the word line WLWP, is written and read out with respect to the first volatile memory section (21) in response to the identification information linked with the operational information. The operational information which must be constantly accessible, is written into the second volatile memory section (23). Thus, the operational information is available in response to attributes of the operational information.

Abstract: Methods of writing data to and reading data from memory devices and systems for writing and reading data are disclosed. In a particular embodiment, a method includes writing data bits a first time into a memory. Auxiliary parity bits are written in the memory, where the auxiliary parity bits are computed based on the data bits. Subsequent to writing the data bits a first time and writing the auxiliary parity bits, the data bits are written a second time into the memory. Writing the data bits the first time and writing the data bits the second time are directed to one or more storage elements at a common physical address in the memory. Subsequent to writing the data bits the second time, the auxiliary parity bits are discarded while maintaining the data bits in the memory.

Abstract: Some embodiments include apparatuses and methods having a memory cell string including memory cells located in different levels of the apparatuses and a select transistor coupled to the memory cell string. In at least one of such apparatuses, the select transistor can include a body region including a monocrystalline semiconductor material. Other embodiments including additional apparatuses and methods are described.

Abstract: System, method, and program to perform simultaneous read and write operations in a NAND-type memory device, including: assigning a first partition in a NAND-type memory device, wherein the first partition is configured to perform read operations on high priority read content; assigning a second partition in the NAND-type memory device, wherein the second partition is configured to perform read operations and write operations, wherein the read operations are performed on non-high priority read content; and controlling the first partition and second partition to operate in a simultaneous manner.

Abstract: A method of producing nanoparticles by using chemical curing. The method includes depositing a metal thin film on a substrate, applying an insulator precursor on a metal thin film, and adding a curing agent and a catalyst to the insulator precursor to perform the chemical curing. The method also includes mixing metal powder and an insulator precursor, applying a mixture on a substrate, and adding a curing agent and a catalyst to the mixture to perform the chemical curing. Since the chemical curing process is used in the method, it is possible to form nanoparticles by using a simple process at low cost while a high temperature process such as thermal curing is not used.

Abstract: A non-volatile variable capacitive device includes a capacitor defined over a substrate, the capacitor having an upper electrode and a resistive memory cell having a first electrode, a second electrode, and a switching layer provided between the first and second electrodes. The resistive memory cell is configured to be placed in a plurality of resistive states according to an electrical signal received. The upper electrode of the capacitive device is coupled to the second electrode of the resistive memory cell. The resistive memory cell is a two-terminal device.

Abstract: A unit block circuit of a semiconductor device includes a first well, a first pickup unit configured to form a closed loop over the first well, a first transistor including a first gate and a first active region, and formed within the first pickup unit, and a first reservoir capacitor formed in a spare within the first pickup unit and arranged in a major-axis direction of the first gate of the first transistor, wherein the first reservoir capacitor comprises a second active region and a second gate, the second gate being formed over the second active region.

Abstract: A flash memory device includes a memory cell array having a set-up data region configured to store set-up data, wherein the set-up data includes first data and second data. The second data is stored in an empty cell area of the set-up data region. The flash memory also includes a page buffer and decoder configured to read the set-up data from the set-up data region, and a status detector receiving the set-up data from the page buffer and decoder and configured to discriminate the first data from the second data and generate a Pass/Fail status signal.

Abstract: A nonvolatile memory capable of acting at each 1 bit and having a high integration density. A small-sized semiconductor device of multiple high functions having such nonvolatile memory. The nonvolatile memory is constructed to have a memory cell composed of two memory transistors so that it can realize a memory capacity of two times as large for a memory area as that of the full-function EEPROM of the prior art, in which the memory cell is composed of one memory transistor and one selection transistor, while retaining functions similar to those of the EEPROM. On the other hand, the small-sized semiconductor device of high functions or multiple functions is realized by forming the nonvolatile memory of the invention integrally with another semiconductor part over a substrate having an insulating surface.

Abstract: Integrated circuits, apparatuses and methods are disclosed, such as a method that includes generating an internal clock signal, receiving an external clock signal, and providing a mixed clock signal at an output. The mixed clock signal has a frequency ranging from a defined maximum frequency of the external clock signal to a frequency margin below a frequency of the internal clock signal. Additional integrated circuits, apparatus and methods are described.

Abstract: A semiconductor memory device includes a plurality of detecting code generators configured to generate a plurality of detecting codes to detect errors in a plurality of data items, respectively, a plurality of first correcting code generators configured to generate a plurality of first correcting codes to correct errors in a plurality of first data blocks, respectively, each of the first data blocks containing one of the data items and a corresponding detecting code, a second correcting code generators configured to generate a second correcting code to correct errors in a second data block, the second data block containing the first data blocks, and a semiconductor memory configured to nonvolatilely store the second data block, the first correcting codes, and the second correcting code.

Abstract: The memory device includes a memory cell unit of the electrically erasable and programmable non-volatile type including two memory cells respectively connected to two bit lines via two bit line select transistors. The common terminal between the bit line select transistor and the floating-gate transistor of each memory cell of the memory cell unit is connected to the control gate of the floating-gate transistor of the other memory cell of the memory cell unit.

Abstract: According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.

Abstract: One embodiment in accordance with the invention can include a semiconductor device that includes: a groove that is formed in a semiconductor substrate; bottom oxide films that are formed on both side faces of the groove; two charge storage layers that are formed on side faces of the bottom oxide films; top oxide films that are formed on side faces of the two charge storage layers; and a silicon oxide layer that is formed on the bottom face of the groove, and has a smaller film thickness than the top oxide films.

Abstract: A system and method, including computer software, allows reading data from a flash memory cell. Voltages from a group of memory cells are detected. The group of memory cells have associated metadata for error detection, and each memory cell stores a voltage representing a data value selected from multiple possible data values. Each possible data value corresponds to one range of multiple non-overlapping ranges of analog voltages. Memory cells having uncertain data values are identified based on the detected voltages. Alternative data values for the memory cells having the uncertain data values are determined, and a combination of alternative data values is selected. An error detection test is performed using the metadata associated with the multiple memory cells and the selected combination of alternative data values.

Abstract: p-type wells are provided within an n-type embedded well of a semiconductor substrate lying in an area for forming a flash memory, in a state of being isolated from one another. A capacitance section, a data write/erase charge injection/discharge section and a data read MIS•FET are disposed in each of the p-type wells. The capacitance section is disposed between the data write/erase charge injection/discharge section and the data read MIS•FET. In the data write/erase charge injection/discharge section, writing and erasing of data by an FN tunnel current at a channel entire surface are performed.

Abstract: The performance of a semiconductor device including a nonvolatile memory is enhanced. Each of nonvolatile memory cells arranged over a silicon substrate includes: a first n-well; a second n-well formed in a place different from the place thereof; a selection transistor formed in the first n-well; and an electric charge storage portion having a floating gate electrode and a storage portion p-well. The floating gate electrode is so placed that it overlaps with part of the first n-well and the second n-well. The storage portion p-well is placed in the first n-well so that it partly overlaps with the floating gate electrode. In this nonvolatile memory cell, memory information is erased by applying positive voltage to the second n-well to discharge electrons in the floating gate electrode to the second n-well.

Abstract: The present invention provides a semiconductor device having a nonvolatile memory function capable of shortening an erase time and executing data access efficiently. When, under the control of a command register/control circuit, an erase voltage is applied to an embedded erase gate wiring disposed in a memory cell boundary region, and an electrical charge is transferred between a floating gate and an embedded erase gate to thereby perform an erase operation, a read selection voltage is applied to a memory gate line and an assist gate line during the application of the erase voltage to thereby carry out the reading of data.

Abstract: A discharge circuit for a floating gate type MOS memory cell transistor disposed in a memory array region of a nonvolatile semiconductor memory device, the memory cell region being formed in P-well, the P-well being formed in an N-well, and the N-well being formed in a P-type semiconductor substrate, includes a word line discharge circuit providing a word line control voltage and a bulk discharge circuit providing a voltage to the P-well during a discharge operation. Constant current transistors and switching transistors in the word line discharge circuit and the bulk discharge circuit are simultaneously turned ON during at least a portion of the discharge operation.

Abstract: A split gate memory cell. First and second well regions of respectively first and second conductivity types are formed in the substrate. A floating gate is disposed on a junction of the first and second well regions and insulated from the substrate. A control gate is disposed over the sidewall of the floating gate and insulated from the substrate and the floating gate and partially extends to the upper surface of the floating gate. A doping region of the first conductivity type is formed in the second well region. The first well region and the doping region respectively serve as source and drain regions of the split gate memory cell.

Abstract: A multi-level cell NOR flash memory device includes a plurality of gate lines, a plurality of source regions, a plurality of drain regions, a plurality of source lines, a plurality of bitlines, and a plurality of power lines. The bitlines each have a specific sheet resistance. A specific number of the bitlines are disposed between two adjacent ones of the power lines. Accordingly, the multi-level cell NOR flash memory device is of a high transconductance and uniformity and thereby features an enhanced conforming rate.

Abstract: A memory cell includes a non-volatile p-channel transistor having a source coupled to a first potential, a drain, and a gate. A non-volatile n-channel transistor has a source coupled to a second potential, a drain, and a gate. A switch transistor has a gate coupled to a switch node, a source, and a drain. A stress transistor has a source and drain coupled between the drain of the non-volatile p-channel transistor and the drain of the non-volatile n-channel transistor, the stress transistor having a gate coupled to a gate bias circuit. Where one of the first or second potentials is a bit line, an isolation transistor is coupled between the other of the second potentials and one of the non-volatile transistors.

Abstract: An electronic charge retention circuit for time measurement, implanted in an array of EEPROM memory cells, each including a selection transistor in series with a floating-gate transistor, the circuit including, on any one row of memory cells: a first subassembly of at least a first cell, the thickness of the dielectric of the tunnel window of the floating-gate transistor of which is less than that of the other cells; a second subassembly of at least a second cell, the drain and source of the floating-gate transistor of which are interconnected; a third subassembly of at least a third cell; and a fourth subassembly of at least a fourth cell, the tunnel window of which is omitted, the respective floating gates of the transistors of the cells of the four subassemblies being interconnected.

Abstract: Provided is a method of operating a nonvolatile memory device to perform a programming operation or an erase operation. The method includes applying a composite pulse including a direct current (DC) pulse and an AC perturbation pulse to the nonvolatile memory device to perform the programming operation or the erase operation.

Abstract: A nonvolatile semiconductor memory device includes a memory cell which stores data and which is capable of being rewritten electrically, a bit line which is connected electrically to one end of a current path of the memory cell, a control circuit which carries out a verify operation to check a write result after data is written to the memory cell, and a voltage setting circuit which sets a charging voltage for the bit line in a verify operation and a read operation and makes a charging voltage in a read operation higher than a charging voltage in a verify operation.

Abstract: A first terminal and a second terminal of a FinFET transistor are used as two terminals of an anti-fuse. To program the anti-fuse, a gate of the FinFET transistor is controlled, and a voltage having a predetermined amplitude and a predetermined duration is applied to the first terminal to cause the first terminal to be electrically shorted to the second terminal.

Abstract: Provided are nonvolatile memory devices and program methods thereof. A nonvolatile memory device provides a program voltage to a selected word line and performs a program verify operation. The nonvolatile memory device controls a bit line voltage of the next program loop according to the program verification result. In the program verification operation, a target verify voltage is used as a pre-verify voltage. The nonvolatile memory device controls the bit line voltage of the next program loop according to the program verification result, thus making it possible to reduce the threshold voltage distribution of a memory cell. Also, the nonvolatile memory device uses the target verify voltage as the pre-verify voltage, thus making it possible to increase the program verification speed.

Abstract: There is provided a technology which can allow a semiconductor chip formed with a nonvolatile memory to be sufficiently reduced in size. There is also provided a technology which can ensure the reliability of the nonvolatile memory. In a memory cell of the present invention, a boost gate electrode is formed over a control gate electrode via an insulating film. The boost gate electrode has the function of boosting a voltage applied to a memory gate electrode through capacitive coupling between the boost gate electrode and the memory gate electrode. That is, during a write operation or an erase operation to the memory cell, a high voltage is applied to the memory gate electrode and, to apply the high voltage to the memory gate electrode, the capacitive coupling using the boost gate electrode is subsidiarily used in the present invention.

Abstract: A flash memory integrated circuit and a method for fabricating the same. A gate stack includes an initial oxide layer directly in contact with a silicon layer, defining an oxide-silicon interface therebetween. Additional oxide material is formed substantially uniformly along the oxide-silicon interface. Polysilicon grain boundaries at the interface are thereby passivated after etching. The interface can be formed between a tunnel oxide and a floating gate, and passivating the grain boundaries reduces erase variability. Oxide in an upper storage dielectric layer is enhanced in the dilute steam oxidation. The thin oxide layers serve as diffusion paths to enhance uniform distribution of OH species across the buried interfaces being oxidized.

Abstract: A method of programming a nonvolatile memory device comprises programming memory cells connected to a first wordline, programming memory cells connected to a second wordline, programming memory cells connected to a third line between the first wordline and the second wordline, and adjusting a threshold voltage of the memory cells connected to the first wordline to compensate for interference generated by the programming of the memory cells connected to the third wordline.

Abstract: In various embodiments, the reference voltage used for read operations in a non-volatile memory may be adjusted up or down in an attempt to read data from an area that previously produced at least one uncorrectable error. The direction and amount of this adjustment may be based on the number and direction of correctable errors in surrounding data.

Abstract: A nonvolatile semiconductor memory device, includes: a stacked body including a plurality of insulating films alternately stacked with a plurality of electrode films, the electrode films being divided to form a plurality of control gate electrodes aligned in a first direction; a plurality of semiconductor pillars aligned in a stacking direction of the stacked body, the semiconductor pillars being arranged in a matrix configuration along the first direction and a second direction intersecting the first direction to pierce the control gate electrodes; and a connection member connecting a lower end portion of one of the semiconductor pillars to a lower end portion of one other of the semiconductor pillars, an upper end portion of the one of the semiconductor pillars being connected to a source line, an upper end portion of the one other of the semiconductor pillars being connected to a bit line.

Abstract: A flash memory storage apparatus is provided. The flash memory storage apparatus includes a substrate, a control and storage circuit unit, a ground lead, at least a signal lead, and a power lead. The control and storage circuit unit, the power lead, the signal lead, and the ground lead are disposed on the substrate, in which the power lead, the signal lead, and the ground lead respectively electrically connect to the control and storage circuit unit. Moreover, the flash memory storage apparatus further includes an extra ground lead electrically connected to the ground lead or a protrusion on the substrate, such that the ground lead first electrically connects to a host when the flash memory storage apparatus is plugged into the host.

Abstract: A method is provided for enhancing charge storage in an E2PROM cell structure that includes a read transistor having spaced apart source an drain diffusion regions formed in a semiconductor substrate to define a substrate channel region therebetween, a conductive charge storage element formed over the substrate channel region and separated therefrom by gate dielectric material, a conductive control gate that is separated from the charge storage element by intervening dielectric material, and a conductive heating element disposed in proximity to the charge storage element. The method comprises performing a programming operation that causes charge to be placed on the charge storage element and, during the programming operation, heating the heating element to a temperature such that heat is provided to the charge storage element.

Abstract: According to one exemplary embodiment, a memory cell in a semiconductor chip includes a non-volatile memory transistor, a control gate, and a floating gate. The control gate is capacitively coupled to the floating gate of the non-volatile memory transistor by a metal capacitor. The metal capacitor can be formed in one or more metal levels and in one embodiment is in a shape of a comb with multiple fingers. In one embodiment, the non-volatile memory transistor is an NMOS non-volatile memory transistor.

Abstract: An apparatus, system, and method are disclosed for bad block remapping. A bad block identifier module identifies one or more data blocks on a solid-state storage element as bad blocks. A log update module writes at least a location of each bad block identified by the bad block identifier module into each of two or more redundant bad block logs. A bad block mapping module accesses at least one bad block log during a start-up operation to create in memory a bad block map. The bad block map includes a mapping between the bad block locations in the bad block log and a corresponding location of a replacement block for each bad block location. Data is stored in each replacement block instead of the corresponding bad block. The bad block mapping module creates the bad block map using one of a replacement block location and a bad block mapping algorithm.

Abstract: According to one embodiment, a method is disclosed for manufacturing a nonvolatile memory device. The method can include forming a second stacked body, removing the second stacked body formed in a region where a first memory unit will be formed, forming a first stacked body, and removing the first stacked body formed in a region where a second memory unit will be formed. The method can include simultaneously processing the first stacked body formed in a region where the first memory unit will be formed and the second stacked body formed in a region where the second memory unit will be formed to form a memory cell of the first memory unit from the first stacked body and form a memory cell of the second memory unit from the second stacked body.

Abstract: In a nonvolatile semiconductor memory device wherein a plurality of threshold voltages are set so as to store multi-valued information in one memory cell, data is first written into the memory cell whose threshold voltage is the lowest as a written state from the erase level, and data is successively written into memory cells whose threshold voltages are higher.