Abstract: A semiconductor memory device includes first and second memory chips and a control logic configured to execute an interleave program between the first and second memory chips. The control logic receives write data to be written into first and second memory blocks of the first memory chip. If the first and second memory blocks are normal blocks, the control logic simultaneously performs a program operation for the first and second memory blocks. If one memory block of the first and second memory blocks is a bad block, the control logic writes the received write data corresponding to the one memory block into a storage circuit.

Abstract: Systems and methods for reducing delays between successive write and read accesses in multi-bank memory devices are provided. Computer circuits modify the relative timing between addresses and data of write accesses, reducing delays between successive write and read accesses. Memory devices that interface with these computer circuits use posted write accesses to effectively return the modified relative timing to its original timing before processing the write access.

Abstract: A memory device comprises a memory array and error correction circuitry coupled to the memory array. The memory device is configured to perform at least a partial word write operation and a read operation, with the partial word write operation comprising a read phase and a write phase. The write phase of the partial word write operation occurs in the same clock cycle of the memory device as the read operation by, for example, time multiplexing bitlines of the memory array within the clock cycle between the write phase of the partial word write operation and the read operation. Thus, the partial word write operation appears to a higher-level system incorporating or otherwise utilizing the memory device as if that operation requires only a single clock cycle of the memory device.

Abstract: A process is performed periodically or in response to an error in order to dynamically and adaptively optimize read compare levels based on memory cell threshold voltage distribution. One embodiment of the process includes determining threshold voltage distribution data for a population of non-volatile storage elements, smoothing the threshold voltage distribution data using a weighting function to create an interim set of data, determining a derivative of the interim set of data, and identifying and storing negative to positive zero crossings of the derivative as read compare points.

Abstract: A method and system for determining a respective threshold voltage of each of a plurality of transistors in a memory array. The method includes: applying a ramp voltage to gates of the plurality of transistors, wherein the ramp voltage is configured to increase based on an incrementing digital code; as the ramp voltage is being applied, generating a respective control signal in response to sensing a predetermined threshold current along a respective bitline in the memory array, wherein each transistor in the memory array is in communication with a respective bitline in the memory array; and for each transistor in the memory array, latching a current value of the incrementing digital code in response to the respective control signal corresponding to the transistor being generated. The current value of the incrementing digital code latched by each register corresponds to the threshold voltage of the corresponding transistor.

Abstract: Memory devices comprise a plurality of memory cells, each memory cell including a memory element and a selection device. A plurality of first (e.g., row) address lines can be adjacent (e.g., under) a first side of at least some cells of the plurality. A plurality of second (e.g., column) address lines extend across the plurality of row address lines, each column address line being adjacent (e.g., over) a second, opposing side of at least some of the cells. Control circuitry can be configured to selectively apply a read voltage or a write voltage substantially simultaneously to the address lines. Systems including such memory devices and methods of accessing a plurality of cells at least substantially simultaneously are also disclosed.

Abstract: The semiconductor memory device includes a control circuit that performs control of reading data from and writing data into each memory cell. The control circuit includes a flip-flop circuit that stores the data read from the memory cell and stores the data to be written into the memory cell and a dynamic type holding circuit connected to the flip-flop circuit through a switch. The dynamic-type holding circuit temporarily stores the data read from the memory cell. When the data read from the memory cell and then held in the holding circuit is different from the data in the flip-flop circuit to be written, supplied from an outside at a time of writing into the memory cell, control is performed so that the data in the flip-flop circuit is written into the memory cell.

Abstract: A semiconductor device has a hierarchical bit line structure and comprises first and second local bit lines transmitting first and second signals of first and second memory cells corresponding to a selected word line, and first and second global bit lines electrically connected to the first and second local bit lines through first and second switches, first and second sense amplifiers connected to the first and second global bit lines, and a control circuit. During a first period after the first and second memory cells are simultaneously accessed, the control circuit controls the first switch to conduction state so that the first sense amplifier amplifies the first signal and controls the second switch to non conduction state. During a second period after sensing of the first sense amplifier finishes, the control circuit controls the second switch to conduction state so that the second sense amplifier amplifies the second signal.

Abstract: System and method for a four-slot asynchronous communication mechanism with increased throughput. The system may include a host system and a client device. The host may comprise a data structure with four (two pairs of) slots and first information indicating a status of read operations from the data structure by the host. The client may read the first information from the host. The client may read second information from a local memory. The second information may indicate a status of write operations to the data structure by the client. The client may determine a slot of the data structure to be written. The slot may be determined based on the first information and the second information and may be the slot which has not been written to more recently of the pair of slots which has not been read from most recently. The client may increment a value of a counter. The value of the counter may be useable to indicate which slot has been written to most recently.

Abstract: A memory system includes a nonvolatile semiconductor memory which includes a first original block composed of n (n being natural number) write unit areas and a first subblock composed of a plurality of write unit areas. A controller writes data having one of first to p-th (p being natural number smaller than n) addresses into the first original block. The controller writes data which has a first write address of one of the first to p-th addresses into the first subblock when the controller receives request to write data having the first write address and data having the first write address exists in the first original block.

Abstract: A hardware arrangement for a memory bitcell, including a primary decoder for decoding a common memory address portion among a plurality of memory addresses, and a plurality of secondary decoders each for decoding an uncommon memory address portion of each of the plurality of memory addresses. The memory bitcell is configured to receive the decoded common memory address portion and output data from a memory entry corresponding to the decoded common memory address portion, and includes a single read port for outputting the data. The hardware arrangement includes a modified sense amplifier (SA) configured to receive the data output on the single read port, and directly receive the plurality of decoded uncommon memory address portions. The plurality of decoded uncommon memory address portions is used to determine whether to enable the modified SA. Data output from the memory bitcell is forwarded when the modified SA is enabled.

Abstract: Subject matter disclosed herein relates to a read operation process for a nonvolatile memory.

Abstract: A memory includes a memory cell, two word lines coupled to the memory cell, two bit lines coupled to the memory cell, and a write assist cell. The write assist cell is configured to transfer data of one bit line in a write operation to the other bit line in a read operation when one word line is used for the write operation, the other word line is used for the read operation, and the two word lines are asserted simultaneously.

Abstract: Systems and methods for controlling memory devices are disclosed. In one embodiment, a memory system comprises a memory controller for forwarding a command signal and an address signal and for receiving and forwarding a data signal, and a first memory device for receiving the command signal and the address signal from the memory controller, where the first memory device comprises a first command judging circuit for receiving and forwarding the data signal and for decoding the command signal. The memory system further comprises a second memory device for receiving the command signal and the address signal from the memory controller, where the second memory device comprises a second command judging circuit for receiving and generating the data signal and for decoding the command signal. The command signal, the address signal and the data signal are commonly connected to the first memory device and the second memory device.

Abstract: In one embodiment, a memory device includes a plurality of unit cell arrays. Each unit cell array includes an array of memory cells arranged in a plurality of columns, and each column is associated with a bit line. The memory device further includes a program control circuit configured to program cells in the plurality of unit cell arrays based on program bits associated with the plurality of unit cell arrays. For example, the program control unit is configured to simultaneously program one memory cell in each unit cell array having at least one associated program bit.

Abstract: A design structure embodied in a machine readable medium used in a design process includes computational memory device having an array of memory cells arranged in rows and columns, and a pair of read word lines associated with each row of the array. The array is configured to implement, for a given cycle, either a read operation of data contained in a single selected row, or one of a plurality of different bit wise logical operations on data contained in multiple selected rows.

Abstract: A semiconductor memory device includes a plurality of banks; a peripheral circuit configured to send data to and receive data from the plurality of banks; and data lines configured to connect the plurality of banks and the peripheral circuit, wherein the plurality of banks are disposed such that a sum of lengths of data transfer paths of the data lines connecting the peripheral circuit and at least two banks, among the plurality of banks, activated at a same time is uniformly maintained.

Abstract: A method of reading a nonvolatile memory device may include, after an nth erase operation is performed, reading dummy cells on which a program operation has been performed based on a first read voltage, where n is an integer greater than zero, counting a number of dummy cells that are read as having a threshold voltage lower than the first read voltage, when the number is a critical value or more, resetting a read voltage, and performing, based on the reset read voltage, a read operation on memory cells that belong to the same memory cell block as the dummy cells and on which a program operation has been performed on the memory cells after the nth erase operation has been performed.

Abstract: A Static Random Access Memory (SRAM) includes at least two memory cells sharing a read bit line (RBL) and a write bit line (WBL). Each memory cell is coupled to a respective read word line (RWL) and a respective write word line (WWL). A write tracking control circuit is coupled to the memory cells for determining a write time of the memory cells. The write tracking control circuit is capable of receiving an input voltage and providing an output voltage. The respective RWL and the respective WWL of each memory cell are asserted during a write tracking operation.

Abstract: In a particular embodiment, a device includes a reference voltage circuit to generate a controlled voltage. The device includes a frequency circuit configured to generate a frequency output signal having a pre-set frequency and a counter to generate a count signal based on the pre-set frequency. The device also includes a delay circuit coupled to receive the count signal and to produce a delayed digital output signal and a latch to generate a pulse. The pulse has a first edge responsive to a write command and a trailing edge formed in response to the delayed digital output signal. In a particular embodiment, the pulse width of the pulse corresponds to an applied current level that exceeds a critical current to enable data to be written to an element of the memory but does not exceed a predetermined threshold.

Abstract: Disclosed is a method of preventing coupling noises for a non-volatile semiconductor memory device. According to the method, if an edge of a write operation signal overlaps an activated period of a read operation signal a check result is generated. The write operation signal is modified based on the check result.

Abstract: Methods of maintaining a state of a memory cell without interrupting access to the memory cell are provided, including applying a back bias to the cell to offset charge leakage out of a floating body of the cell, wherein a charge level of the floating body indicates a state of the memory cell; and accessing the cell.

Abstract: The present disclosure relates to memory arrays with read reference voltage cells. In particular the present disclosure relates to variable resistive memory cell apparatus and arrays that include a high resistance state reference memory cell and a low resistance state reference memory cell that provides a reliable average reference voltage on chip to compare to a read voltage of a selected memory cell and determine if the selected memory cell is in the high resistance state or low resistance state. These memory arrays are particularly suitable for use with spin-transfer torque memory cells and resolves many systematic issues related to generation of a reliable reference voltage.

Abstract: A nonvolatile ferroelectric memory immediately outputs data stored in a page buffer without performing a cell access operation when a page buffer is accessed. Since a block page address region and a column page address region are arranged in less significant bit region, and a row address region is arranged in more significant bit region, the cell operation is not performed in the access of the page address buffer, thereby improving reliability of the cell and reducing power consumption.

Abstract: A high-density dynamic memory device with compact sense amplifier circuit is described. The memory device achieves high density through the use of a compact sense amplifier circuit that employs a single transistor to sense stored dynamic data. Functionality of the device is enabled by an architecture and method of operation that support a compact sense amplifier circuit. Enabling techniques include sequential sensing of memory columns, a two-pass write operation, a two-step refresh operation, a reference scheme that uses reference data stored in regular memory cells, and the application of digital signal processing to determine sensed data and cancel crosstalk noise.

Abstract: A semiconductor memory device includes output enable signal generation means configured to be reset in response to an output enable reset signal, count a DLL clock signal and an external clock signal, and generate an output enable signal in correspondence to a read command and an operating frequency; and activation signal generation means configured to generate an activation signal for inactivating the output enable signal generation means during a write operation interval.

Abstract: Methods for programming a memory array, memory devices, and memory systems are disclosed. In one such method, the target reliability of the data to be programmed is determined. The relative reliability of different groups of memory cells of the memory array is determined. The data is programmed into the group of memory cells of the array having a relative reliability corresponding to the target reliability.

Abstract: To provide an input/output circuit that includes a write path to which write data is supplied and a read path to which read data is supplied and first and second data lines that connect the input/output circuit to a memory cell array. The input/output circuit includes a write buffer that supplies the write data on the write path to the first data line, a read amplifier that supplies the read data supplied to the read path through the second data line, and a bypass circuit that supplies the write data on the write path to the read path in response to detection of matching between a write address and a read address. Thus, data collisions can be avoided.

Abstract: Methods and systems to dynamically control state-retention strengths of a plurality of memory cells during a write operation to a subset of the memory cells. Dynamic control may include weakening state-retention strengths of the plurality of memory cells during a write operation to a subset of the memory cells, while preserving state-retention abilities of remaining ones of the plurality of memory cells. Weakening may include adjusting one or more resistances between one or more power supplies and the plurality of memory cells. Dynamic control may be selectively performed on portions of each of the memory cells in response to an input data logic state. Dynamic control may reduce a write contention within the subset of memory cells without disabling state-retention abilities of remaining ones of the plurality of memory cells, and may improve write response times of the memory cells.

Abstract: A control device of an adjustment apparatus of a motor vehicle for controlling a driven adjustment element of the motor vehicle in an adjustment movement along an adjustment path includes a memory unit with a non-volatile digital memory with more than 108 writing cycles and is configured to acquire a plurality of adjustment data items which are assigned to a position or a speed of the adjustment element along the adjustment path. The control device continuously stores the acquired adjustment data items in the non volatile digital memory when triggered by a triggering process.

Abstract: Electronic apparatus and fabrication of the electronic apparatus that includes detection of the majority of values in a plurality of data bits may be used in a variety of applications. Embodiments include application of majority bit detection to process data bits in a device for further analysis in the device based on the results of the majority bit detection. In an embodiment, such further processing in a memory device after majority bit detection may include data bit inversion prior to outputting the data from the memory device.

Abstract: An integrated circuit device includes a serial peripheral interface adapted for receiving a first command supporting an address of a first configuration, wherein the serial peripheral interface supports an address of a second configuration upon receipt of a second command, the second configuration being different from the first configuration. In a specific embodiment, the first and the second configurations are different in address length. In another embodiment, a second address cooperated with the second command has a first part and a second part, the second part comprising a plurality of byte addresses, each of the byte addresses being associated with a corresponding byte of data. In another embodiment, integrated circuit device also includes a mode logic circuit for controlling operations of the first command and the second command. Various other embodiments are also described.

Abstract: A control circuit for a read operation of a SERDES (SERializer and DESeriallizer) type semiconductor memory apparatus is disclosed that includes a first delay unit that is configured to generate and output a first delay signal to a first global input/output line driver by receiving a sensing-enable signal ‘IOSTB’, and to generate and output a second delay signal to a second global input/output line driver by receiving the sensing-enable signal. The first delay unit generates the second delay signal by delaying the sensing-enable signal in synchronization with a clock. The semiconductor memory apparatus also includes a second delay unit configured to generate a pipe latch control signal in response to the first delay signal and the second delay signal.

Abstract: Information stored as physical states of cells of a memory is read first by setting each of one or more references to a respective member of a first set of values and reading the physical states of the cells relative to the values of the first set. Subsequently, the references are set to respective members of a second set of values, and the physical states of the cells are read again relative to the values of the second set. The second set is different from the first set, so that the two readings together read the physical states of the cells with higher resolution than the first reading alone.

Abstract: Provided is a destructive readout semiconductor memory device capable of avoiding concentration of a writeback current, in which a switch circuit (24) is provided between each bit line (21) and each sense amplifier (26). In writeback, the switch circuits are turned on at staggered time points. In readout, the switch circuits are turned on to read memory cell data to the sense amplifiers while the sense amplifiers are turned off, and the switch circuits are then turned off once. After that, the sense amplifiers are turned on to amplify the read data. The switch circuits are subsequently divided into groups and turned on again to write back the data amplified by the sense amplifiers to the memory cells. The switch circuits are divided into groups to be turned on at staggered time points during the writeback, to thereby avoid concentration of the writeback current in one time period.

Abstract: A memory system includes a master device, such as a graphics controller or processor, and an integrated circuit memory device operable in a dual column addressing mode. The integrated circuit memory device includes an interface and column decoder to access a row of storage cells or a page in a memory bank. During a first mode of operation, a first row of storage cells in a first memory bank is accessible in response to a first column address. During a second mode of operation, a first plurality of storage cells in the first row of storage cells is accessible in response to a second column address during a column cycle time interval. A second plurality of storage cells in the first row of storage cells is accessible in response to a third column address during the column cycle time interval. The first and second pluralities of storage cells are concurrently accessible from the interface.

Abstract: A semiconductor processing device according to the invention includes a first non-volatile memory (21) for erasing stored information on a first data length unit, a second non-volatile memory (22) for erasing stored information on a second data length unit, and a central processing unit (2), and capable of inputting/outputting encrypted data from/to an outside. The first non-volatile memory is used for storing an encryption key to be utilized for encrypting the data. The second non-volatile memory is used for storing a program to be processed by the central processing unit. The non-volatile memories to be utilized for storing the program and for storing the encryption key are separated from each other, and the data lengths of the erase units of information to be stored in the non-volatile memories are defined separately.

Abstract: A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory operations in memory planes. The memory operations are sequentially initiated and the memory operation for at least one of the memory planes is initiated during the memory operation for another memory plane. In one embodiment, each of a plurality of programming circuits is associated with a respective memory plane and is operable to program data to the respective memory plane in response to programming signals and when it is enabled. Control logic coupled to the plurality of programming circuits generates programming signals in response to the memory receiving program commands and further generates programming enable signals to individually enable each of the programming circuits to respond to the programming signals and stagger programming of data to each of the memory planes.

Abstract: A Dynamic Random Access Memory (DRAM) performs read, write, and refresh operations. The DRAM includes a plurality of sub-arrays, each having a plurality of memory cells, each of which is coupled with a complementary bit line pair and a word line. The DRAM further includes a word line enable device for asserting a selected one of the word lines and a column select device for asserting a selected one of the bit line pairs. A timing circuit is provided for controlling the word line enable device, the column select device, and the read, write, and refresh operations in response to a word line timing pulse. The read, write, and refresh operation are performed in the same amount of time.

Abstract: An apparatus, system, and method are disclosed for detecting the formation of a short between a magnetoresistive (“MR”) head and a head substrate. The apparatus is presented with a logic unit containing a plurality of modules configured to functionally execute the necessary steps of generating a baseline electric potential level between a head substrate and ground, monitoring the level of the electric potential between the head substrate and ground, and detecting the formation of a short circuit between the MR head and the head substrate by detecting a change in the electric potential level monitored by the monitoring module from the baseline level to a predetermined threshold level. Beneficially, such an apparatus, system, and method would reduce read errors on the magnetic tape storage system, the time and resources required to recover from such errors, and allow for preventative measures to obviate contamination short related failures of tape drive systems.

Abstract: A semiconductor memory device includes a memory cell array and an input/output path circuit. The input/output path circuit performs an input/output line pre-charge operation at a write end time point and outputs data stored in the memory cell array when the semiconductor memory device is operated in a read mode.

Abstract: The present invention is a method of writing information to a synchronous memory device by examining a present word of N bits to be written, where each bit has a high or low value. The present word is compared to a previous word also having N bits to identify the number of bit transitions from a low value to a high value of vice versa. The present bit is inverted when the number of transitions is greater than N/2. To avoid the need for having an extra bit accompany data bytes to indicate the presence or absence of inversion, the present invention takes advantage of a data mask pin that is normally unused during writing operations to carry the inversion bit. Non-inverted data is written directly into the memory device while inverted data is first inverted again before writing to storage locations, so that true data is stored in the memory device.

Abstract: In one embodiment of the invention, a memory integrated circuit is provided including an address decoder to selectively access memory cells within a memory array; a mode register with bit storage circuits to store an enable bit and at least one sub-channel select bit; and control logic. The control logic is coupled to a plurality of address signal lines, the address decoder, and the mode register. In response to the enable bit and the at least one sub-channel select bit, the control logic selects one or more of the address signal lines to capture independent address information to support independent sub-channel memory accesses into the memory array. The control logic couples the independent address information into the address decoder.

Abstract: A method is provided for achieving SRAM output characteristics from DRAMs, in which a plurality of DRAMs are arranged connected in parallel to a controller in such a way as to be able to obtain SRAM output characteristics using the DRAMs, comprising a process in which data is output to an external device when a control signal for data reading has been input from the external device, by sequentially repeating a step in which the controller sends a data output state control signal to one DRAM and sends a refresh standby state control signal to the other DRAMs, the data is read and sent to the external device from the DRAM in the output state, and a refresh standby state control signal is sent to the DRAM which was in the output state while an output state control signal is sent to another DRAM and data is read out from the DRAM in the output state, and a step in which the controller sends a control signal for changing the output state to the refresh standby state.

Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device.

Abstract: According to the embodiments, a read circuit is connected to the other end of the bit line for reading out data from read data storing memory cells and test data storing memory cells via the bit line, and a read control circuit makes data to be read out from the test data storing memory cells when testing the bit line and makes data to be read out from the read data storing memory cells when reading out the read data.

Abstract: A memory controller and method that provide a read-refresh (also called “distributed-refresh”) mode of operation, in which every row of memory is read within the refresh-rate requirements of the memory parts, with data from different columns within the rows being read on subsequent read-refresh cycles until all rows for each and every column address have been read, scrubbing errors if found, thus providing a scrubbing function that is integrated into the read-refresh operation, rather than being an independent operation. For scrubbing, an atomic read-correct-write operation is scheduled. A variable-priority, variable-timing refresh interval is described. An integrated card self-tester and/or card reciprocal-tester is described. A memory bit-swapping-within-address-range circuit, and a method and apparatus for bit swapping on the fly and testing are described.

Abstract: Some embodiments include first memory cells and a first line used to access the first memory cells, second memory cells and at least one second line used to access the second memory cells. The first and second memory cells have a number of threshold voltage values corresponding to a number of states. The states represent values of information stored in the memory cells. During a read operation to read the first memory cells, a first voltage may be applied to the first line and a second voltage may be applied to the second line. At least one of the first and second voltages may include a value based on a change of at least one of the threshold voltage values changing from a first value to a second value. The first and second values may correspond to a unique state selected from all of the states. Other embodiments including additional apparatus, systems, and methods are disclosed.

Abstract: A memory device includes at least two cell blocks connected to a global bit line for outputting data in response to an instruction; at least one global bit line connection unit for selectively connecting the global bit line to each cell block under control of a control block, one global bit line connection unit being allocated between the two cell blocks; and said control block for controlling output of data stored in each cell block to the global bit line and restoration of the outputted data of the global bit line to the original cell block or another cell block which is determined by depending upon whether data in response to a next instruction is outputted from the original cell block or another cell block.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.