Abstract: A dynamic wordline assist circuit for improving performance of an SRAM. An SRAM is disclosed that includes a plurality of memory cells, wherein each memory cell is coupled to a wordline and a pair of bitlines; and a wordline assist circuit coupled to the wordline, wherein the wordline assist circuit includes a first input for activating the wordline assist circuit during a read or write cycle and includes a second input for deactivating the wordline assist circuit during the read or write cycle after a delay.

Abstract: A reading device for a memory array is provided. The memory array comprises memory cell columns. The reading device comprises first sensing amplifier groups, a second sensing amplifier group, and an output unit. Each first sensing amplifier groups selectively generates a first sensing output signal. The second sensing amplifier group generates a second sensing output signal. The output unit selectively outputs one of the second sensing output signal and the first sensing output signals according to a page address signal. In a reading operation period, the reading device reads data from a column group to the first sensing amplifier groups. In the reading operation period, when the page address signal indicates an initial input address, initial address data read from the specific column set corresponding to the initial input address among the column group is transmitted to the second sensing amplifier group to generate the second sensing output signal.

Abstract: A storage device includes a storage array having a group of storage elements. Each storage element can written to a discrete set of physical states. A read circuit selects one or more storage elements and generates, for each selected storage element, an analog signal representative of the physical state of the selected storage element. A signal processing circuit processes the analog signal to generate a plurality of outputs, with each output representing a degree of an association of the selected storage element with a different subset of one or more of the discrete set of physical states.

Abstract: A semiconductor device comprises a bit line transmitting a signal to be sensed, a single-ended sense amplifier sensing and amplifying the signal transmitted from the bit line to the input node, and a reference voltage supplying circuit outputting a reference voltage. The sense amplifier includes a first transistor for charge transfer between the bit line and an input node, and the voltage value of the reference voltage is controlled in association with a threshold voltage of the first transistor. The reference voltage is set to a first logical value of the transfer control signal which controlled to be first and second logical values.

Abstract: Methods for sensing, memory devices, and memory systems are disclosed. In one such memory device, a local sense circuit provides sensing of an upper group of memory cells while a global sense circuit provides sensing of a lower group of memory cells. Data sensed by the local sense circuit is transferred to the global sense circuit over local data lines or a global transfer line that is multiplexed to the local data lines. An alternate embodiment uses the local sense circuit to sense both upper and lower groups of memory cells.

Abstract: A semiconductor memory apparatus includes: a memory cell array including a plurality of memory cells; a bit line sense amplifier (BLSA) coupled to the memory cells in the memory cell array through a bit line; a plurality of local input/output lines coupled to the BLSA; and a switching unit coupled to the local input/output lines and configured to select a part of the local input/output lines.

Abstract: A memory device includes an array of memory cells arranged in rows and columns, each memory cell being configured to connect to separate write and read paths. The memory cells within each column form a plurality of memory cell groups and are coupled to the read data output circuitry by an associated read path. For each column, the associated read path comprises both a local path portion provided for each memory cell group and a global path portion shared by all memory cells within the column. The global path portion is then connected to the read data output circuitry. Each local path portion is coupled to an associated global path control circuit which is configured during the read operation to control a signal level of the associated global path portion in dependence on a signal level present on the associated local path portion.

Abstract: An apparatus and method for combating the effects of bias temperature instability (BTI) in a memory cell. Bit lines connecting to a memory cell contain two alternate paths criss-crossing to connect a lower portion of a first bit line to an upper portion of a second bit line, and to connect a lower portion of the second bit line to an upper portion of the first bit line. Alternative to activating transistors on the bit lines to read and write to the memory cell, transistors on the alternative paths may be activated to read and write to the memory cell from the opposite bit lines. The memory cell may be read through the bit lines to a sense amplifier, the transistors on the bit lines are subsequently deactivated and the transistors on the alternate paths are activated to write transposed bit values to the memory cell, thereby reversing the biases.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell transistor, a word line, a row decoder, a sense amplifier which determines the data in the memory cell transistor via the bit line, a first bit line clamp transistor connected in series between the bit line and the sense amplifier, a second bit line clamp transistor connected in parallel to the first bit line clamp transistor and having a current driving capability higher than that of the first bit line clamp transistor, and a bit line control circuit which turns on the first bit line clamp transistor and the second bit line clamp transistor using a common gate voltage during a predetermined period from a start of charge of the bit line, and turns off only the second bit line clamp transistor when the predetermined period has elapsed.

Abstract: A semiconductor memory device according to an embodiment includes a memory cell array including memory cells each formed from a transistor formed over an active area of a well and disposed at intersections of a word line and a bit line group, the memory cell having different connection states including a state in which a source or a drain of the transistor is not electrically connected to any one of bit lines belonging to the bit line group and states in which the source or the drain is electrically connected only to a specific one of the bit lines, and an active area serving as a gate of the transistor being continuously formed in arrangement areas of the bit lines of the bit line group and spaces between the bit lines.

Abstract: A circuit comprises a first driver, a second driver, and a remote sense amplifier. The first driver is configured to generate a first data signal on a first data line. The second driver is configured to generate a control signal on a control signal line. An RC delay of the control signal line is less than an RC delay of the first data line. The remote sense amplifier is configured to receive the first data signal, a second data signal on a second data line, and the control signal. The control signal line is configured for the control signal to enable the remote sense amplifier to amplify the voltage difference between the first data signal and the second data signal at inputs of the remote sense amplifier, if the voltage difference reaches a predetermined value.

Abstract: According to one embodiment, a bit line negative potential circuit includes a bit line capacitance compensation capacitor which compensates the capacitance of a bit line and a peripheral capacitance compensation capacitor which compensates the peripheral capacitance of the bit line. After the bit line is switched to a low potential, the bit line is driven based on a charging voltage of the bit line capacitance compensation capacitor and the peripheral capacitance compensation capacitor.

Abstract: A method for data storage includes providing at least first and second readout configurations for reading storage values from analog memory cells, such that the first readout configuration reads the storage values with a first sense time and the second readout configuration reads the storage values with a second sense time, shorter than the first sense time. A condition is evaluated with respect to a read operation that is to be performed over a group of the memory cells. One of the first and second readout configurations is selected responsively to the evaluated condition. The storage values are read from the group of the memory cells using the selected readout configuration.

Abstract: A semiconductor storage device in accordance with the present invention includes a first SRAM cell that stores data, and a word line circuit that outputs a first control signal used to activate the first SRAM cell. The word line control circuit gradually raises the voltage level of the first control signal from a substrate potential to a first power supply potential in a first activation period, maintains the voltage level of the first control signal at the first power supply potential in a second activation period subsequent to the first activation period, and raises the voltage level of the first control signal from the first power supply potential to a second power supply potential in a third activation period subsequent to the second activation period.

Abstract: A memory access circuit includes a write data circuit and a first write switch circuit. The write data circuit is used for receiving double data rate data or single data rate data, and outputting odd term data and even term data of adjusted double data rate data or adjusted single data rate data. The first write switch circuit is used for outputting the odd term data of the adjusted double data rate data to an odd block of a memory and outputting the even term data of the adjusted double data rate data to an even block of the memory when the write data circuit receives the double data rate data, and outputting the adjusted single data rate data to the even block or the odd block of the memory when the write data circuit receives the single data rate data.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a plurality of memory cells provided in a matrix and having a charge storage layer, a plurality of word lines provided on the charge storage layer, and an application section. When reading data from a selected memory cell selected from the plurality of memory cells, the application section applies a voltage having an opposite polarity to the voltage applied to a selected word line to non-selected word lines arranged on both adjacent sides of the selected word line.

Abstract: The data access apparatus comprises a phase locked loop (PLL) and a data receiving circuit. The PLL provides a plurality of internal clocks and selecting a strobe clock from the plurality of internal clocks according to a phase selection signal. The data receiving circuit comprises a latching module, for latching of the data signal according to trigger of the strobe clock and a calibrating circuit, for generating the phase selection signal for matching the data with a predetermined data according to the plurality of internal clocks in a training mode and finally determining the phase selection signal corresponding to a preferred clock used in a normal mode.

Abstract: A memory device with increased communication bandwidth is described. In this memory device, control logic routes data signals from a memory array using inactive bitlines in response to a read command. These data signals are then placed on an adjacent unused input/output (I/O) line or routing channel, as opposed to a proximate I/O line that is in use. For example, unused bitlines located on the top and bottom of the memory array may be used to route data signals to adjacent local I/O lines. In particular, the data signals can be placed on unused local I/O lines which are associated with adjacent bitline sense amplifiers. The resulting increased communication bandwidth can overcome the constraints imposed by the limited number of local I/O lines in the memory device without appreciably increasing the chip size, power consumption, or cost.

Abstract: The data transmission circuit includes: a plurality of local bit line pairs through which data is read simultaneously; a plurality of voltage change detection circuits provided for the plurality of local bit line pairs; a global bit line pair; a plurality of column selection circuits configured to select one of the local bit line pairs and connect the selected local bit line pair to the global bit line pair; and a sense amplifier connected to the global bit line pair. The sense amplifier is controlled by a sense amplifier activation signal to which the outputs of the plurality of voltage change detection circuits are connected, whereby the voltage of a selected read data line pair is amplified using discharge of a non-selected read data line pair, to achieve high-speed read.

Abstract: A method of reading a memory cell is disclosed. The method includes the step of connecting (708) a reference voltage generator (600) to a first bitline (/BL). The first bitline is charged to a reference voltage (VREF) from the reference voltage generator. The reference voltage generator is disconnected (RFWL_A/B low at t4, FIG. 10B) from the first bitline. A signal voltage (PL high at t4, FIG. 10B) from the memory cell is applied to a second bitline (BL) after the step of disconnecting. A difference voltage between the first and second bitlines is amplified (SAEN high at t7, FIGS. 8A and 10B).

Abstract: A semiconductor memory apparatus includes: a read/write control unit configured to generate a write control signal and a read control signal using internal signals generated through separate signal paths in response to a write command and a read command respectively; and a plurality of ranks configured to perform a write operation or read operation according to the write control signal or the read control signal.

Abstract: Apparatus are provided for memory elements and related computing modules. An exemplary memory element includes a first array of one or more memory cells, a second array of one or more memory cells, write selection circuitry associated with the first array, and read selection circuitry associated with the second array. The write selection circuitry and the read selection circuitry are configured to be activated concurrently.

Abstract: A nonvolatile semiconductor storage device includes a plurality of cells for storing data on a basis of charges stored nonvolatilly, a write unit for writing and erasing data on the cell by injecting or extracting charges into or from the cell, a comparator for comparing the voltage produced by a selected cell to be read out with a threshold, a read unit for outputting read data on the basis of the comparison result by the comparator, and a threshold update unit for updating the threshold of the comparator according to the voltage produced by the selected cell.

Abstract: A flash memory controller includes a controllable delay circuit configured to receive a read strobe signal from a flash memory device and to delay the read strobe signal, a data latch, coupled to the controllable delay circuit, configured to receive the delayed read strobe signal, and to capture data from the flash memory device using the delayed read strobe signal, and a calibration circuit coupled to the controllable delay circuit, configured to instruct the controllable delay circuit to delay the read strobe signal at one of a plurality of delay settings, to receive the captured data from the data latch, to determine an accuracy of the captured data, and to determine an adjustment factor for the controllable delay circuit based on the accuracy of the data captured at the data latch.

Abstract: A semiconductor memory apparatus includes a memory cell, a data transfer unit configured to adjust an access to the memory cell according to a voltage level of a selection signal, a selection signal output unit configured to output the selection signal having a first control voltage level in a data write mode and a second control voltage level in a data read mode. A data detection unit may also be configured to detect a voltage formed by a sensing current supplied to the memory cell through the data transfer unit in the data read mode, and output read data according to the detection result, wherein the second control voltage level is lower than the first control voltage level.

Abstract: A semiconductor device includes an insulation layer (14) provided on a semiconductor substrate (12), a p-type semiconductor region (16) provided on the insulation layer, an isolation region (18) provided that surrounds the p-type semiconductor region to reach the insulation layer, an n-type source region (20) and an n-type drain region (22) provided on the p-type semiconductor region, a charge storage region (30) provided above the p-type semiconductor region between the n-type source region and the n-type drain region, and an voltage applying portion that applies a different voltage to the p-type semiconductor region while any of programming, erasing and reading a different data of a memory cell that has the charge storage region is being preformed.

Abstract: A semiconductor device includes the following elements. A sense amplifier amplifies signal on a bit line. A column switch is between the bit line and a local input-output line. A sub-amplifier amplifies signal on the local input-output line. A write switch is between the local input-output line and a main input-output line. A write amplifier amplifies write data and supplies the amplified write data to the main input-output line when data write operation is performed. A test circuit activates the sense amplifier while the test circuit deactivating the sub-amplifier and the write amplifier when a data read operation is performed in test mode. The test circuit places the column switch and the write switch in conductive state.

Abstract: A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.

Abstract: An input-output line sense amplifier configured to drive input data signals over an input-output signal line to an output driver circuit, the input-output line sense amplifier having an output driver stage having a plurality of different programmable output drive capacities to tailor the output drive of the sense amplifier.

Abstract: Integrated circuits may include memory elements that are provided with voltage overstress protection. One suitable arrangement of a memory cell may include a latch with two cross-coupled inverters. Each of the two cross-coupled inverters may be coupled between first and second power supply lines and may include a transistor with a gate that is connected to a separate power supply line. Another suitable memory cell arrangement may include three cross-coupled circuits. Two of the three circuits may be powered by a first positive power supply line, while the remaining circuit may be powered by a second positive power supply line. These memory cells may be used to provide an elevated positive static control signal and a lowered ground static control signal to a corresponding pass gate. These memory cells may include access transistors and read buffer circuits that are used during read/write operations.

Abstract: Various embodiments of a data output circuit of a semiconductor memory and related method are disclosed. In one exemplary embodiment, a data output circuit may include a plurality of global lines, a sense amplifier block configured to output a plurality of data to the plurality of global lines at different timings, a pipe latch block configured to latch the plurality of data transmitted through the plurality of global lines at different timings, and a control unit configured to control output timings of the plurality of data from the sense amplifier block and latch timings of the pipe latch block using an address signal.

Abstract: A first write transistor has a source connected to a power-supply node, a drain connected to a first local bit line, and a gate connected to a second write global bit line. A second write transistor has a source connected to the power-supply node, a drain connected to a second local bit line, and a gate connected to a first write global bit line. A third write transistor has a source connected to the first write global bit line, a drain connected to the first local bit line, and a gate receiving a first control signal. A fourth write transistor has a source connected to the second write global bit line, a drain connected to the second local bit line, and a gate receiving the first control signal. A read circuit is connected to the first and second local bit lines and first and second read global bit lines.

Abstract: Provided is a delay adjustment device for adjusting delay of a strobe signal, which specifies when to read a data signal on a data line, with respect to the data signal in order to perform data transfer with an external memory. A testing unit 150 included in a delay adjustment unit is provided with a memory bandwidth monitoring unit 212 that monitors memory bandwidth in use on the data line used for data transfer with a memory circuit. The testing unit 150 performs delay adjustment when the memory bandwidth in use is lower than a predetermined threshold. Delay adjustment is performed by delaying the strobe signal from the data signal by a variety of predetermined delays and determining whether data transfer is successful at each delay, calculating an optimal delay, and thereafter delaying the strobe signal by the calculated delay.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a power supply circuit, an interconnection and a discharging circuit. The memory cell includes a variable resistance element whose resistance varies by application of a voltage. The power supply circuit outputs the voltage to be applied to the memory cell. The interconnection is formed between the power supply circuit and the memory cell and supplies the voltage output from the power supply circuit to the memory cell. The discharging circuit is connected to the interconnection. The discharging circuit discharges electric charge accumulated in the interconnection after a first operation of applying the voltage to the memory cell is ended and before a second operation of applying the voltage to the memory cell next is started.

Abstract: A memory arrangement including a memory block and a controller. The memory block comprises a plurality of memory cells, wherein each memory cell operable to store one of a plurality of different levels of charge. The controller is configured to write (i) a first reference signal threshold into a first memory cell and (ii) a second reference signal threshold into a second memory cell. The first reference signal threshold corresponds to a first level of charge of the plurality of different levels of charge, and the second reference signal threshold corresponds to a second level of charge of the plurality of different levels of charge. Each of the first level of charge and the second level of charge is used to calibrate a read back of any of the one of the plurality of different levels of charge stored among the plurality of memory cells in the memory block.

Abstract: A latching element latches incoming data into an integrated circuit. The latching element (for example, a latch or flip-flop) can be considered to include a data path portion, a clock path portion, and an ideal latching element. In one embodiment, an open-loop replica of the data path portion is disposed in a clock signal path between a clock input terminal of the integrated circuit and a clock input lead of the latching element. In a second embodiment, an additional replica of the clock path portion is disposed in a data signal path between a data terminal of the integrated circuit and a data input lead of the latching element. The replica circuits help prevent changes in skew between a data path propagation time to the ideal latching element and clock path propagation time to the ideal latching element. Setup times remain substantially constant over PVT (process, supply voltage, temperature).

Abstract: Methods for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays.

Abstract: A memory device and method are provided incorporating a technique for controlling a write operation within the memory device. The memory device has an array of memory cells, each memory cell supporting writing and simultaneous reading of that memory cell. Write circuitry is arranged, during a write operation, to provide write data to a number of addressed memory cells within the array, whilst word line select circuitry is responsive to the start of the write operation to assert a write word line signal that enables those addressed memory cells to store the write data. Comparing circuitry is arranged, during the write operation, to compare the write data with data currently stored in the addressed memory cells. On detecting that the write data matches the data currently stored in the addressed memory cells, the comparing circuitry asserts a control signal to the word line select circuitry to cause the word line select circuitry to de-assert the write word line signal.

Abstract: A sense amplifier for a series of cells of a memory, including a writing stage comprising a CMOS inverter, the input of which is directly or indirectly connected to an input terminal of the sense amplifier, and the output of which is connected to an output terminal of the sense amplifier intended to be connected to a local bitline addressing the cells of the series, and a reading stage that includes a sense transistor, the gate of which is connected to the output of the inverter and the drain of which is connected to the input of the inverter.

Abstract: Methods, and circuits, are disclosed for operating a programmable memory device. One method embodiment includes storing a value as a state in a first memory cell and as a complementary state in a second memory cell. Such a method further includes determining the state of the first memory cell using a first self-biased sensing circuit and the complementary state of the second memory cell using a second self-biased sensing circuit, and comparing in a differential manner an indication of the state of the first memory cell to a reference indication of the complementary state of the second memory cell to determine the value.

Abstract: A nonvolatile memory device is provided, which includes a memory core including a plurality of nonvolatile memory cells, a first read circuit that reads a first codeword from the memory core during a Read While Write (RWW) operation, a second read circuit that reads a second codeword from the memory core during a Read Modification Write (RMW) operation, and a common decoder that is shared by the first read circuit and the second read circuit and selectively decodes the first codeword or the second codeword.

Abstract: A memory device, system and method for allowing an early read operation after one or more write operations is provided according to an embodiment of the present invention. The memory device comprises an interface for providing a first write address, a first write data, and a read address. A memory core is coupled to the interface and includes a first memory section having a first data path and a first address path and a second memory section having a second data path and a second address path. In an embodiment of the present invention, the first data and first address path is independent of the second data and second address path. The first write data is provided on the first data path responsive to the first write address being provided on the first address path while a read data is provided on the second data path responsive to the read address being provided on the second address path.

Abstract: The data read circuit includes a variable current generation circuit and a data sensing circuit. The variable current generation circuit is configured to generate a variable current that varies in response to an external temperature. The data sensing circuit is configured to sense and amplify data on a bit line connected to a non-volatile memory cell according to the variable current and to configured to output the sensed and amplified data. The data sensing circuit controls a margin for sensing the data according to the variable current.

Abstract: A method setting a read voltage to minimize data read errors in a semiconductor memory device including multi-bit memory cells. In the method, a read voltage associated with a minimal number of read data error is set based on a statistic value of a voltage distribution corresponding to each one of a plurality of voltage states.

Abstract: A static random access memory (SRAM) cell includes a first read port, the first read port having a first beta ratio; and a write port, the write port having a second beta ratio that is substantially lower than the first beta ratio. A static random access memory (SRAM) array includes a plurality of SRAM cells, an SRAM cell including a first read port, the first read port having a first beta ratio; and a write port, the write port having a second beta ratio that is substantially lower than the first beta ratio.

Abstract: Herein, a voltage sensing circuit, which is capable of controlling a pumping voltage to be stably generated in a low voltage environment, is provided. The voltage sensing circuit includes a current mirror having first and second terminals, a first switching element configured to control current on the first terminal of the current mirror by a reference voltage, a second switching element configured to control current from the second terminal of the current mirror in response to a pumping voltage, and a third switching element configured to control current sources of the first and second switching elements to receive a negative voltage.

Abstract: A first input of a sense amplifier is connected to a first bitline, a second input of the sense amplifier is connected to a second bitline, a third input of the sense amplifier is coupled to a third bitline. The sense amplifier provides at an output an indicator of a storage state of a memory cell connected to the first bitline based upon information provided to the sense amplifier via the first, second, and third bitlines.

Abstract: A one-time-programmable memory device comprises a one-time-programmable memory cell array, a voltage pumping circuit, and a programming verification circuit. The one-time-programmable memory cell array comprises a plurality of memory cells. Each memory cell is arranged at an intersection of a bit line and a word line. The voltage pumping circuit comprises a plurality of local voltage boost circuits. Each local voltage boost circuit is shared by a corresponding memory cell of the plurality of memory cells. The programming verification circuit is coupled to the one-time-programmable memory cell array for verifying that conduction current of programmed memory cells of the plurality of memory cells is greater than a predetermined current level after programming. Each local boost circuit isolates leakage current of a corresponding programmed memory cell, and prevents programming voltage failure due to current overloading at a corresponding voltage pumping circuit.

Abstract: A method for alleviating burn-in effect and enabling performing a start-up process in respect of a device comprising a plurality of challengeable memory elements, wherein the memory elements are able to, upon start-up, generate a response pattern of start-up values useful for identification as the response pattern depends on physical characteristics of the memory elements, the method comprising the step of, after start-up of the memory elements, writing a data pattern to the memory elements which is inverse to a response pattern that was previously read from the same memory elements. Thus, degradation of the PMOS transistors due to NBTI can be alleviated.

Abstract: An object of the present invention is to provide a semiconductor device combining transistors integrating on a same substrate transistors including an oxide semiconductor in their channel formation region and transistors including non-oxide semiconductor in their channel formation region. An application of the present invention is to realize substantially non-volatile semiconductor memories which do not require specific erasing operation and do not suffer from damages due to repeated writing operation. Furthermore, the semiconductor device is well adapted to store multivalued data. Manufacturing methods, application circuits and driving/reading methods are explained in details in the description.