Abstract: High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 ?m or more and 20 ?m or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, O-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.

Abstract: Methods are disclosed for preparing copper nanowires that do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.

Abstract: A metal particle which is a non-nucleated, spherical porous material having continuous open pores, and which is formed from dendritic crystals which have grown uniformly outward from the center without requiring a nucleating agent. A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles. The metal particle produced by the method, which is a non-nucleated, spherical porous material having continuous open pores, is unlikely to suffer bonding or aggregation of the metal particles and exhibits excellent dispersibility, and, when the metal particle is used in a conductive composition, such as a conductive paste, a cured product having satisfactory conduction properties can be obtained at a relatively low temperature, making it possible to easily control the specific gravity or resistance.

Abstract: There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.

Abstract: A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.

Abstract: A plumbing fixture includes a plumbing fixture body having a composition of, by weight percentage, 58-63 of copper, 0.8-1.5 of bismuth, 0.05-0.15 of phosphorous, and a remainder of zinc and any impurities. The plumbing fixture body includes a first opening and a second opening that are arranged to communicate a fluid there through. The first opening defines a first inner diameter D1 and the second opening defines a second inner diameter D2 such that a ratio of D1/D2 is 1.05-2.3.

Abstract: A process is disclosed for making 1,1,1,4,4,4-hexafluoro-2-butene. The process involves reacting 2,2-dichloro-1,1,1-trifluoroethane with copper in the presence of an amide solvent and 2,2?-bipyridine. A process is also disclosed for making 1,1,1,4,4,4-hexafluoro-2-butene. The process involves reacting 2,2-dichloro-1,1,1-trifluoroethane with copper in the presence of an amide solvent and a Cu(I) salt. A process is further disclosed for making 1,1,1,4,4,4-hexafluoro-2-butene. The process involves reacting 2,2-dichloro-1,1,1-trifluoroethane with copper in the presence of an amide solvent, 2,2?-bipyridine and a Cu(I) salt.

Abstract: Metal nanowires with high linearity can be produced using metal salts at a relatively low temperature. A transparent conductive film can be formed using the metal nanowires. Particularly, the transparent conductive film has high transmittance, low sheet resistance, and good thermal, chemical and mechanical stability. The transparent conductive film has a high electrical conductivity due to the high linearity of the metal nanowires. The metal nanowires take up 5% or less of the volume of the transparent conductive film, ensuring high transmittance of the transparent conductive film. Furthermore, the metal nanowires are useful as replacements for existing conductive materials, such as ITO, conductive polymers, carbon nanotubes and graphene. The metal nanowires can be applied to flexible substrates and other various substrates due to their good adhesion and high applicability to the substrates. Moreover, the metal nanowires can find application in various fields, such as displays and solar cell devices.

Abstract: Provided are a metal tape material improved in characteristics to be low in Young's modulus, low in yield stress and high in break elongation and a metal tape material for semiconductor packaging, such as a current-collection interconnector, comprising the same.

Abstract: A method of synthesis to produce gram-scale quantities of copper nanowires in an aqueous solution, wherein the copper nanowires are dispersed in said solution. Copper nanowires grow from spherical copper nanoparticles within the first 5 minutes of the reaction. Copper nanowires can be collected from solution and printed to make conductive films (preferably <10,000 ?/sq) that preferably transmit greater than 60% of visible light.

Abstract: This worked high-purity copper material includes Cu having a purity of 99.9999% by mass or more, wherein an average crystal grain size is in a range of 20 ?m or less, and in a grain size distribution of crystal grains, an area ratio of crystal grains having grain sizes that exceed 2.5 times the average crystal grain size is in a range of less than 10% of an area of the entire crystal grains. This method for producing a worked high-purity copper material includes: subjecting an ingot composed of high-purity copper having a Cu purity of 99.9999% by mass or more to hot forging at an initial temperature of 550° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to warm forging at an initial temperature of 350° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to cold cross-rolling at a total reduction ratio of 50% or more; and subsequently, subjecting the ingot to stress relief annealing at a temperature of 200° C. or higher.

Abstract: Methods of preparing nanowires having small diameters and large lengths are disclosed. Such nanowires are useful in electronics applications.

Abstract: Methods of preparing metal nanowire are disclosed that employ quaternary phosphonium salts. Such processes can produce long and thin nanowires. Compositions and articles comprising such nanowires are useful in electronics applications.

Abstract: Methods employing novel solvents are disclosed for making metal nanostructures including metal nanowires. Such methods can be carried out at lower temperatures and higher production rates than those employing ethylene glycol. The products of these methods are useful for electronics applications.

Abstract: Methods of the invention allow rapid production of high-porous, large-surface-area nanostructured metal and/or metal oxide at attractive low cost applicable to a wide variety of commercial applications such as sensors, catalysts and photovoltaics.

Abstract: The instant invention relates to shaped transition metal particles, in particular in the form of a dispersion in an aqueous and/or organic medium, the manufacture thereof and their use as an infrared (IR) absorbing agent, an IR curing agent for coatings, an additive in conductive formulations, an antimicrobial agent or for sensoring organic and/or inorganic compounds. Further, the invention relates to dispersions comprising said shaped particles and an aqueous and/or organic medium, such as a thermoplastic or crosslinkable polymer, as well as to antimicrobial compositions and products.

Abstract: Disclosed herein is a connection means 58 made from metal, and in particular Al, Mg, Cu or Ti, or an alloy comprising one or more thereof. The connection means 58 is made from a compound material of said metal reinforced by nanoparticles, in particular CNT, wherein the reinforced metal has a microstructure comprising metal crystallites at least partly separated by said nanoparticles.

Abstract: Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.

Abstract: A copper alloy having an electrical resistivity lower than those of current copper alloys and a tensile strength higher than those of current copper alloys and a method of manufacturing such a copper alloy are provided. The copper alloy is produced by adding a predetermined amount of carbon to a molten copper in a high-temperature environment of a temperature in the range of 1200° C. to 1250° C. such that the copper alloy has a carbon content in the range of 0.01% to 0.6% by weight.

Abstract: A copper electrolytic solution containing chloride ions, a sulfur organic compound and polyethylene glycol as additives, and the copper electrolytic solution preferably contains 5 to 200 ppm of chloride ions, 2 to 1000 ppm of a sulfur organic compound and 5 to 1500 ppm of polyethylene glycol. A two-layer flexible substrate having a copper layer is formed using the copper electrolytic solution, wherein the MIT folding endurance is 100 or more, and the surface roughness (Rz) of the copper layer is 1.4 to 3.0 ?m.

Abstract: A rolled copper foil according to the present invention includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle ?, the normalized intensity being obtained during a ? scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle ? in a range of 40° to 60° to a maximum value B of the normalized intensity with angle ? in a range of 80° to 90° is equal to or greater than 4; and when the normalized intensity increases with increasing angle ? in a range of 25° to 45°, there is essentially no area in which the normalized intensity increases stepwise.

Abstract: The present disclosure relates to shims 10, 24 adapted for placement between a rocker shaft 42 and rocker shaft mounts 62, 64. The rocker shaft mounts 62, 64 project from the cylinder head 60 of an internal combustion engine. The shims 10, 24 are composed of a copper alloy, preferably bronze.

Abstract: Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.

Abstract: Ultrahigh purity copper having a residual resistance ratio of 38,000 or greater and a purity of 8N or higher (excluding gas components), and in particular ultrahigh purity copper wherein the respective elements of O, C, N, H, S and P as gas components are 1 ppm or less. Further provided is a method of subjecting copper to high purification. An anode and a cathode are partitioned with an anion exchange membrane, an anolyte is intermittently or continuously extracted and introduced into an active carbon treatment vessel, a chlorine-containing material is added to the active carbon treatment vessel so as to precipitate impurities as chloride, active carbon is subsequently poured in and agitated so as to adsorb the precipitated impurities, the adsorbed impurities are removed by filtration, and the obtained high purity copper electrolytic solution is intermittently or continuously introduced into the cathode side and electrolyzed.

Abstract: Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing.

Abstract: Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower.

Abstract: The method for obtaining copper powders and nanopowders from industrial electrolytes including waste industrial electrolytes through electrochemical deposition of metallic copper on a cathode consists in using potentiostatic pulse electrolysis without the current direction change or with the current direction change, using the cathode potential value close to the plateau or on the plateau of the current voltage curve on which the plateau of the current potential range is from ?0.2 V÷?1 V, and a moveable or static ultramicroelectrode or an array of ultramicroelectrodes made of gold, platinum or stainless steel wire or foil is used as a cathode, whereas metallic copper is used as an anode and the process is carried out at temperature from 18-60° C., and the electrolysis lasts from 0.005 to 60 s. Said method can be used to obtain nanopowders and powders characterised by particle structure and dimension repeatability and purity from 99%+ to 99.

Abstract: The present invention provides method of identifying molecules that cooperatively and positively interact with either a ligand or a target molecule of a ligand/target molecule pair, or molecules that interact with a ligand/target molecule complex.

Abstract: The present invention relates to an electrode composed of an Al-M-Cu based alloy, to a process for preparing the Al-M-Cu based alloy, to an electrolytic cell comprising the electrode the use of an Al-M-Cu based alloy as an anode and to a method for extracting a reactive metal from a reactive metal-containing source using an Al-M-Cu based alloy as an anode.

Abstract: The present invention relates to methods of making and using and compositions of metal nanoparticles formed by green chemistry synthetic techniques. For example, the present invention relates to metal nanoparticles formed with solutions of plant extracts and use of these metal nanoparticles in removing contaminants from soil and groundwater and other contaminated sites. In some embodiments, the invention comprises methods of making and using compositions of metal nanoparticles formed using green chemistry techniques.

Abstract: The presence of mycotoxins in agricultural products necessitates large scale testing of a wide range of sample material to ensure the safety of food and feed. The mycotoxin ochratoxin A represents an enablement for all mycotoxins as the level of sensitivity necessary for regulatory requirements for this compound at the part per billion level are as low or lower than any other mycotoxin. This invention describes the identification of a set of DNA ligands with sufficiently high binding affinity and specificity for ochratoxin A to enable an improvement over existing methods for the separation, concentration and quantitative determination of ochratoxin A in sample material.

Abstract: The present invention relates to a method of recovering rhenium (Re) and other metals from Re-bearing materials.

Abstract: Provided is a high-purity copper or high-purity copper alloy sputtering target of which the purity is 6N or higher and in which the content of the respective components of P, S, O and C is 1 ppm or less, wherein the number of nonmetal inclusions having a particle size of 0.5 ?m or more and 20 ?m or less is 30,000 inclusions/g or less. As a result of using high-purity copper or high-purity copper alloy from which harmful inclusions of P, S, C and O system have been reduced as the raw material and controlling the existence form of nonmetal inclusions, the present invention addresses a reduction in the percent defect of wirings of semiconductor device formed by sputtering a high-purity copper target so as to ensure favorable repeatability.

Abstract: A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; heating a reducing agent solution that includes a reducing agent, an N,N-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30° C. to about 50° C.; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N?-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100° C. to about 200° C. A surfactant system for the stabilizing copper nanoparticles includes an N,N?-dialkylethylenediamine and a C6-C18 alkylamine.

Abstract: High purity copper having a purity of 6N or higher, wherein content of each of the respective components of P, S, 0, and C is 1 ppm or less, and nonmetal inclusions having a particle size of 0.5 ?m or more and 20 ?m or less contained in the copper are 10,000 inclusions/g or less. As a result of using high purity copper or high purity copper alloy as the raw material from which harmful P, S, C, 0-based inclusions have been reduced and controlling the existence form of nonmetal inclusions, it is possible to reduce the occurrence of rupture of a bonding wire and improve the reproducibility of mechanical properties, or reduce the percent defect of a semiconductor device wiring formed by sputtering a high purity copper target with favorable reproducibility.

Abstract: Provided are a method for forming a metal coating at high speed by using a simple cold spray apparatus, and an aerospace structural member on which a metal coating is formed by the cold spray method. In the metal coating forming method, nonspherical heteromorphous particles made of metal are projected onto a base material surface by the cold spray method to form a metal coating on the base material surface.

Abstract: To provide a production process of an electrode catalyst for fuel cell whose initial voltage is high and whose endurance characteristics, especially, whose voltage drop being caused by high-potential application is less. A production process according to the present invention of an electrode catalyst for fuel cell is characterized in that: it includes: a dispersing step of dispersing a conductive support in a solution; a loading step of dropping a platinum-salt solution, a base-metal-salt solution and an iridium-salt solution to the resulting dispersion liquid, thereby loading respective metallic salts on the conductive support as hydroxides under an alkaline condition; and an alloying step of heating the conductive support with metallic hydroxides loaded in a reducing atmosphere to reduce them, thereby alloying them.

Abstract: The present invention is a method and material for using a sorbent material to capture and stabilize mercury. The method for using sorbent material to capture and stabilize mercury contains the following steps. First, the sorbent material is provided. The sorbent material, in one embodiment, is nano-particles. In a preferred embodiment, the nano-particles are unstabilized nano-Se. Next, the sorbent material is exposed to mercury in an environment. As a result, the sorbent material captures and stabilizes mercury from the environment. In the preferred embodiment, the environment is an indoor space in which a fluorescent has broken.

Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.

Abstract: Equestrian bits are manufactured with the mouthpiece component comprising a copper alloy with composition; 65-80% by weight copper, 0-2% tin and the remainder being zinc including other elements. In a further embodiment, the copper alloy comprises 70-73% copper, 0.9-1.2% tin, 28% zinc the remainder being other elements at a %, by weight, of less than 1%. The alloy of the invention provides a horse bit mouthpiece which rapidly achieves thermal equilibration when placed in, or moved within, the mouth and has characteristic strength sufficient for the intended use.

Abstract: In various embodiments, methods for synthesizing single-crystalline zero-valent metal nanorings, such as single-crystalline copper nanorings, are described herein. The methods include providing a solution containing a metal cation, a complexing agent bound to the metal cation, thereby forming a metal complex that is at least partially soluble in the solution, and a reducing agent operable for reducing the metal complex to a zero-valent metal and then heating the solution for a sufficient time and at a sufficient temperature until zero-valent metal nanorings form. The solution may be an aqueous solution in an embodiment. Single-crystalline metal nanorings produced by the methods described herein may have a diameter less than about 100 ?m and a wall thickness between about 10 nm and about 500 nm.

Abstract: Particles and manufacturing methods thereof are provided. The manufacturing method of the particle includes providing a precursor solution containing a precursor dissolved in a solution, and irradiating the precursor solution with a high energy and high flux radiation beam to convert the precursor to nano-particles. Particles with desired dispersion, shape, and size are manufactured without adding a stabilizer or surfactant to the precursor solution.

Abstract: A method of fractionating biomass, by permeability conditioning biomass suspended in a pH adjusted solution of at least one water-based polar solvent to form a conditioned biomass, intimately contacting the pH adjusted solution with at least one non-polar solvent, partitioning to obtain an non-polar solvent solution and a polar biomass solution, and recovering cell and cell derived products from the non-polar solvent solution and polar biomass solution. Products recovered from the above method. A method of operating a renewable and sustainable plant for growing and processing algae.

Abstract: It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.

Abstract: Various embodiments include a method of producing chemically pure and stably dispersed metal and metal-alloy nanoparticle colloids with ultrafast pulsed laser ablation. A method comprises irradiating a metal or metal alloy target submerged in a liquid with ultrashort laser pulses at a high repetition rate, cooling a portion of the liquid that includes an irradiated region, and collecting nanoparticles produced with the laser irradiation and liquid cooling. The method may be implemented with a high repetition rate ultrafast pulsed laser source, an optical system for focusing and moving the pulsed laser beams, a metal or metal alloy target submerged in a liquid, and a liquid circulating system to cool the laser focal volume and collect the nanoparticle products. By controlling various laser parameters, and with optional liquid flow movement, the method provides stable colloids of dispersed metal and metal-alloy nanoparticles. In various embodiments additional stabilizing chemical agents are not required.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: The present invention relates to tailored materials, particularly metals and alloys, and methods of making such materials. The new compositions of matter exhibit long-range ordering and unique electronic character.

Abstract: Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance copper in the alloy may further contain at least one of: up to 0.5% of at least one of the group which consists of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr, and Ag; and up to 0.1% of at least one of the group which consists of P, B, Ca, Ge, Se, Te. It may also contain up to 0.3% Zr by weight. The alloy may have an electrical conductivity greater than 2.5% IACS at eddy current gauge exciting frequencies between 60 kHz and 480 kHz.

Abstract: A fuel cell catalyst comprising platinum, chromium, and copper, nickel or a combination thereof. In one or more embodiments, the concentration of platinum is less than 50 atomic percent, and/or the concentration of chromium is less than 30 atomic percent, and/or the concentration of copper, nickel, or a combination thereof is at least 35 atomic percent.

Abstract: A method of electrowinning or electrorefining copper from a copper electrolyte solution which contains chloride ions, the method comprising the steps of: (a) forming a polyacrylamide solution by dissolving polyacrylamide, having a molecular weight range of 5,000 to 20,000,000 Daltons, in an acidic medium and under conditions to form a polyacrylamide block copolymer having blocks of carboxyl groups dispersed along the polymer backbone; (b) introducing the polyacrylamide solution into an electrolytic cell containing the copper electrolyte solution at a polyacrylamide concentration of 0.01-10 mg/L; and (c) electroplating copper from the copper electrolyte solution to form a copper cathode.