Abstract: According to one embodiment, an arrayed structure includes a cylindrical-shaped conductor layer and a cylindrical-shaped layer stack. The cylindrical-shaped layer stack is arranged on an inner periphery of the conductor layer and a plurality of frequency selective surfaces are arranged in layers and stacked. Each of the frequency selective surfaces has a plurality of elements which are periodically arranged. Each element of the plurality of elements is formed in such a manner that at least a portion of an edge of a first element that faces an adjacent element in the same layer is closer to a center of the first element than another portion of edge.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a resistive element over the substrate. The semiconductor device structure also includes a thermal conductive element over the substrate. A direct projection of the thermal conductive element on a main surface of the resistive element extends across a portion of a first imaginary line and a portion of a second imaginary line of the main surface. The first imaginary line is perpendicular to the second imaginary line, and the first imaginary line and the second imaginary line intersect at a center of the main surface.

Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate, a first resistive element and a second resistive element over the semiconductor substrate. A topmost surface of the second resistive element is higher than a topmost surface of the first resistive element. The semiconductor device structure also includes a first conductive feature and a second conductive feature electrically connected to the first resistive element. The second resistive element is between and electrically isolated from the first conductive feature and the second conductive feature. The semiconductor device structure further includes a first dielectric layer surrounding the first conductive feature and the second conductive feature.

Abstract: A platinum resistance temperature sensor having a housing that contains a platinum member. The housing includes a first substrate having a first support and a second support spaced apart from an upper surface of the first substrate. The first support of the first substrate supports a first portion of the platinum member and the second support supports a second portion of the platinum member. Medial portions of the platinum member are suspended over the upper surface of the first substrate between the first support and the second support.

Abstract: A curved printed circuit board (PCB) of a computing device is described herein. The computing device includes a housing and a PCB positioned in or on the housing. The computing device also includes a plurality of connectors physically connecting the PCB to a surface of the housing or another surface, such that at least a portion of the PCB is bent.

Abstract: Transparent conductive coatings are polished using particle slurries in combination with mechanical shearing force, such as a polishing pad. Substrates having transparent conductive coatings that are too rough and/or have too much haze, such that the substrate would not produce a suitable optical device, are polished using methods described herein. The substrate may be tempered prior to, or after, polishing. The polished substrates have low haze and sufficient smoothness to make high-quality optical devices.

Abstract: The present invention relate to a methane synthesis catalyst preparation method, comprising a preparation step for a catalytic body and a prereduction step. The prereduction step comprises: calcining the catalytic body to form a nickel aluminate spinel-containing catalyst precursor; and prereducing the catalyst precursor to acquire the methane synthesis catalyst. The catalyst prepared in the preparation method can be used in high-temperature and high liquid-to-gas ratio conditions, shows performance stability, and obviates the need for a further step of high-temperature reduction during vehicle operation. Also provided is the methane synthesis catalyst precursor. The catalyst precursor contains nickel aluminate spinel.

Abstract: Provided are a method and device for marking an article for security, tracking or authentication. The method includes depositing a solution comprising a nucleic acid marker onto at least a portion of the article. The nucleic acid marker may be activated, for example, by adding a functional group to the nucleic acid marker. The activation of the nucleic acid marker may be performed by exposure to alkaline conditions. The method is well suited for marking fibers and textiles, as well as many other items.

Abstract: The present invention relates to a component comprising a tubular structure having interior and exterior surfaces with the interior surface defining an interior passage through the tubular structure, said tubular structure extending longitudinally between opposed ends. The component also includes a resistive film bound to the interior surface of the tubular structure having a pattern configured so that when the resistive film is connected to an electrical source, an electric field is established within the interior passage with an electrical potential that differs along the length of the interior passage while each plane perpendicular to the length of the interior passage is equipotential. Also disclosed are a method of making the component, a charged particle transportation chamber system comprising the component, and a method of identifying and/or separating charged particles.

Abstract: A roofing product can include a heater. In an embodiment, the heater can have different areas that have different heat flux capacities, different portions having heater elements of different lengths or a combination thereof. The roofing product can be installed so that an area of the roof that has a higher heat load, such as near an eave and a valley of the roof, can receive more heat. In another embodiment, the roofing product includes an overhang section that includes at least a portion of the heater. The roofing product can be installed, and the overhang section can be coupled to an object that extends beyond an edge of the roof or over a plane defined by a roof. Many different manufacturing techniques can be used to form the heaters.

Abstract: The invention provides a method of marking an item with a naturally-derived or synthetic non-natural polymeric marker molecules, such as a DNA or Peptide marker in conjunction with optional visible or rapid scan reporters for authenticating or tracking, in which the method includes providing an item for marking, and applying a medium including a DNA marker to the item. The invention also provides a method of marking an item with a DNA marker for authenticating or tracking, in which the method includes providing a medium including a DNA marker, and molding the medium including the DNA marker to provide all or part of the item. The DNA marker encodes information unique to the item and/or the model of the item as desired.

Abstract: An integrated magnetoresistive sensor, formed in a chip including a substrate having a surface and an insulating region covering the surface of the substrate. A magnetoresistor, of a first ferromagnetic material, is formed in the insulating region and has a sensitivity plane parallel to the surface. A concentrator of a second ferromagnetic material is formed in the substrate and has at least one arm extending in a transverse direction to the sensitivity plane. The arm has one end in contact with the magnetoresistor.

Abstract: The invention relates to a surface-modified RuO2 conductive and a lead-free powdered glass material formulated to make a paste suitable for application to the manufacture of a thick film resistor material. The resistance range that is most suitable to this invention is a resistor having 10 kilo-ohms to 10 mega-ohms per square of sheet resistance. The resulting resistors have ±100 ppm/° C. TCRs.

Abstract: The invention relates to a method for producing a plastic molded part (9) comprising an integrated conductor path (3), which plastic molded part is used in particular as an intermediate product to be further processed into an electrically heatable mirror (1). The method steps are: a) producing a substrate (7) from a carrier body (2) made of an electrically insulating plastic material having a conductor path (3) made of an electrically conductive material on or in a surface (8) of the carrier body (2), b) flooding the surface (8) of the substrate (7) equipped with the conductor path (3) or the surface (11) of the substrate (7) opposite said surface with a liquid, electrically insulating coating material. The flooding evens out depressions due to uneven shrinkage in the thick and thin areas of the carrier body and a smooth surface can be produced, which can subsequently be covered with a reflective layer.

Abstract: The present invention relates to method for preparing a metal nanoparticle organic composite film, preferably a metal nanoparticle organic composite film of a chemical sensing device, to a metal nanoparticle organic composite film obtained by said method, and to a chemical sensing device comprising a metal nanoparticle organic composite film or an array of different metal nanoparticle organic composite films obtained by said method.

Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Abstract: In a structure or device having a pair of electrical conductors separated by an insulator across which a voltage is placed, resistive layers are formed around the conductors to force the electric potential within the insulator to distribute more uniformly so as to decrease or eliminate electric field enhancement at the conductor edges. This is done by utilizing the properties of resistive layers to allow the voltage on the electrode to diffuse outwards, reducing the field stress at the conductor edge. Preferably, the resistive layer has a tapered resistivity, with a lower resistivity adjacent to the conductor and a higher resistivity away from the conductor. Generally, a resistive path across the insulator is provided, preferably by providing a resistive region in the bulk of the insulator, with the resistive layer extending over the resistive region.

Abstract: Systems and methods for manufacturing a display panel or other patterned device using outer resistive trace(s) patterned on the display panel or other patterned device are provided. Such a system, for example, may include resistance detection circuitry, a grinder, and data processing circuitry. The resistance detection circuitry may detect a resistance of a resistive trace disposed around a display panel. The grinder may grind a first edge of the display panel such that at least part of the resistive trace is grinded away as the first edge of the display panel is grinded. The data processing circuitry may control the grinder to stop grinding the first edge of the display panel when the resistance of the at least one resistive trace increases to a particular resistance value.

Abstract: A film can be patterned with a nanomaterial. Such patterning can, in various embodiments, be performed by applying a uniform mixture of a solute in a solvent to a surface of the film to form a coating of a soluble material on the surface of the film in a pre-defined pattern that defines coated parts of the film and uncoated parts of the film, depositing an aqueous dispersion, including the nanomaterial and a surfactant, on the defined coated and uncoated parts of the film, washing the film to remove the coating of the soluble material and the nanomaterial from the defined coated parts of the film, but not removing the nanomaterial from the defined uncoated parts of the film, along with removing the surfactant from the defined coated and uncoated parts of the film, and leaving a pattern of the nanomaterial on the defined uncoated parts of the film.

Abstract: A heater design for post-process trimming of thin-film transistors is described. The heater incorporates low sheet-resistance material deposited in non-active connecting regions of the heater to reduce heat generation and power consumption in areas distant from active heating members of the heater. The heating members are proximal to a thin-film resistor. The resistance of the thin-film resistor can be trimmed permanently to a desired value by applying short current pulses to the heater. Optimization of a heater design is described. Trimming currents can be as low as 20 mA.

Abstract: A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

Abstract: A manufacturing method for a nozzle plate including a plurality of nozzle holes may include the step of forming a plurality of through-holes extending through a plate member in a thickness direction of the plate member. The manufacturing method may also include the step of forming a water repellant film in a region of one surface of the plate member where apertures of the through-holes are not positioned. The manufacturing method may further include the step of pressing individual regions on the one surface of the plate member, the individual regions respectively including the apertures of the through holes, to separate at least portions of the water repellant film formed in the individual regions from the water repellant film formed on the one surface.

Abstract: A multi-directional resonant-type electromagnetic wave absorber includes: at least one ground layer; a first dielectric layer and a second dielectric layer respectively formed on different outer surfaces of the ground layer; a first resistive pattern layer formed on an outer surface of the first dielectric layer; and a second resistive pattern layer formed on an outer surface of the second dielectric layer. Herein, the electromagnetic absorption performance is adjusted by changing one or more of thicknesses, permittivities, and permeabilities of the dielectric layers, thicknesses of the resistive pattern layers, and a reflection coefficient of the ground layer.

Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.

Abstract: A method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste, to a substrate by a dispensing operation, wherein the paste is applied in at least one strand.

Abstract: A damage sensor, for example a crack gauge, a method of providing the same, and a method of sensing damage using the same, are described. The damage sensor comprises at least one direct write resistive element applied to an area of a substrate by a direct write process. Conductive tracks may be connected along two separated portions of the perimeter of the area of the direct write resistive element. The damage sensor may comprise plural direct write resistive elements, for example rectangular-shaped elements, each extending between and connected to two conducting tracks. In a further damage sensor, plural annular resistive elements are positioned in an annular arrangement with respect to each other. In all the damage sensors, the resistive elements may be applied around a hole in a substrate, or extending over a bonded edge between two substrates.

Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

Abstract: The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

Abstract: A method (1) of manufacturing an electronic component comprising an electro-ceramic body and conductive terminations is disclosed. The method (1) includes the steps of providing (10) an electro-ceramic body, applying (11) a termination material to the body, applying a passivation material, firing to cure the termination material to provide terminations and plating (15) the terminations. The component is fired (12) before application of the passivation material in a first stage to achieve a porous termination material of sufficient strength for subsequent processing. The passivation material is applied (13) to the porous passivation material and the body after said first stage firing.

Abstract: A method of forming a patterned thin film comprises the step of forming a frame having an undercut near the bottom thereof on an electrode film, and the plating step of forming the patterned thin film by plating through the use of the frame. The patterned thin film includes a plurality of linear portions disposed side by side. Each of the linear portions has a portion close to the electrode film. This portion has a width greater than the width of the remaining portion of each of the linear portions.

Abstract: A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.

Abstract: The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said connection structure having (A) a PTC device (10) including (i) a laminar polymer PTC element (12) and (ii) a metal foil electrode (14) disposed on a main surface of the laminar polymer PTC element (12), and (B) a metal lead element (20) electrically connected to the metal foil electrode. The metal foil electrode (14) has at least two metal layers, one of which, the X-th layer, has laser beam absorption a % that is the lowest among the metal layers of the metal foil electrode (14). The X-th layer is present between a first metal layer (18) of the metal foil electrode and the laminar polymer PTC element (12).

Abstract: Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.

Abstract: A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor.

Abstract: A method of forming a strain sensor from a polymeric film includes the steps of selectively irradiating a surface of the polymer with high energy radiation to change the composition of the polymer and increase the electrical conductivity in selected portions of the surface. The radiation can create carbonized particles or metallic particles within the polymer and the changes in interparticle gaps between conducting particles in the polymer will result in strain dependent electrical properties in the treated polymer.

Abstract: A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline polymer; a terminal preparing step of preparing a pair of lead terminals holding the matrix therebetween, a surface of each lead terminal facing the matrix being formed with a plurality of anchor protrusions separated from each other; a flattening step of flattening the anchor protrusions formed in respective nonoverlapping areas in the pair of lead terminals kept from overlapping the matrix; and a thermocompression bonding step of holding the matrix between respective overlapping areas in the pair of lead terminals overlapping the matrix, and securing the pair of lead terminals and the matrix together by thermocompression bonding.

Abstract: A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Abstract: The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon reducing agents). The present invention further provides a method for reducing undesirable light emission from a sample (e.g., a biochemical or cellular sample) with at least one photon producing agent and at least one collisional quencher. The present invention also provides a method for reducing undesirable light emission from a sample (e.g., a biochemical or cellular sample) with at least one photon producing agent and at least one quencher, such as an electronic quencher. The present invention also provides a system and method of screening test chemicals in fluorescent assays using photon reducing agents. The present invention also provides compositions, pharmaceutical compositions, and kits for practicing these methods.

Abstract: Oriented materials and methods for their formation are disclosed. The oriented material is formed by depositing an oriented component from an oriented liquid crystal medium. Oriented materials having multiple layers and methods for their formation are also disclosed.

Abstract: The invention relates to a transparent substrate coated on at least one of its faces with a polymer layer deposited under vacuum. This polymer layer is provided with an adhesion prelayer of organic or organoinorganic nature. The invention also relates to the process for manufacturing such a coated substrate and to its applications.

Abstract: A fabricating method and apparatus of an zinc phosphate coating for a varistor has a insulation formed on a surface of a body which does not include two opposite ends of the body formed two outer terminals. The insulation has anti-etch feature for the electrolyte, so that the exposed surface of the body prevents to be etched and to be electroplated a metal material on it. Therefore the varistor has a great fabricating yield and the great shape after electroplating the two outer terminals step.

Abstract: A composition of matter comprising a mixture of an oxide powder or powders and a Reactive Organic Medium (ROM) which can be used to create electronic components on a suitable. The materials are applied to conventional polymer-based circuit substrates by any convenient printing process and thermally cured to well-consolidated oxide components at a temperature, which the substrate can withstand. Mixtures for various components, including resistors, capacitor dielectrics and magnetic cores and processes to apply them are disclosed.

Abstract: A magnetoresistance effect film includes a substrate, a plurality of ferromagnetic particles disposed on the substrate, a nonmagnetic film deposited on the substrate and covering the plurality of ferromagnetic particles, and a pair of electrodes arranged on the nonmagnetic film, in which the resistance across the pair of electrodes is changed by applying a magnetic field. The magnetoresistance effect film is manufactured by vapor-depositing ferromagnetic particle starting material on a substrate at a temperature not exceeding 300° C., the starting material being vapor-deposited in an amount enough to cover the substrate surface to a thickness ranging from 0.5 to 15 nm, and, after formation of ferromagnetic particles on the substrate, vapor-depositing at a temperature not exceeding room temperature a nonmagnetic film over the ferromagnetic particles, the nonmagnetic film having a thickness ranging from 1 to 100 nm, and providing a pair of electrodes each at a predetermined position on the nonmagnetic film.

Abstract: A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a thermosetting binder resin, and a conductive filler. The method further includes a process for driving the mixed solution: and a process for curing the binder resin by baking. The good solvent is at least one selected from dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, and dipropylene glycol monoethyl ether. The poor solvent is at least one selected from terpineol eat 2-phenoxy ethanol and 2-benzyloxy ethanol.

Abstract: A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.

Abstract: The present invention provides a coating composition comprising: A coating composition comprising: TEOS; a surfactant; at least one organosilane; HCl; water; and ethanol. The present invention also provides films made from such a coating composition and a method for making such films.

Abstract: A method for manufacturing an ink jet recording head by combining each of the processes to fabricate a heater board comprises (I) the first step of patterning a resistive layer on a substrate, (II) the second step of laminating a first protection layer and patterning the protection layer to form a groove by removing an area for wiring electrode layers to be formed later, (III) the third step of laminating a layer formed by material for use of the wiring electrode layers, (IV) the forth step of continuously giving heat treatment to the surface of the substrate, while the surface is not allowed to be exposed to the air outside, to enable the layer formed by the material of the wiring electrode layers to flow into only the groove on the first protection layer provided in the first step, and making the surface flat, as a result of which, a pair of electrode layers are formed to enable the resistive layer between them to be constituted as the heat generating unit and (V) the fifth step of forming a second protecti

Abstract: A method of providing nickel barrier end terminations for a zinc oxide semiconductor device with exposed body surfaces and end terminal regions, in which the device is controllably reacted with a nickel plating solution only on an exposed end terminal region and thereafter provided with a final tin or tin-lead termination.

Abstract: The present invention provides a method for reducing undesirable light emission from a sample using at least one photon producing agent and at least one photon reducing agent (e.g. dye-based photon reducing agents). The present invention further provides a method for reducing undesirable light emission from a sample (e.g., a biochemical or cellular sample) with at least one photon producing agent and at least one collisional quencher. The present invention also provides a method for reducing undesirable light emission from a sample (e.g., a biochemical or cellular sample) with at least one photon producing agent and at least one quencher, such as an electronic quencher. The present invention also provides a system and method of screening test chemicals in fluorescent assays using photon reducing agents. The present invention also provides compositions, pharmaceutical compositions, and kits for practicing these methods.