Abstract: Improved resistor inks useful in constructing multilayer integrated circuits, particularly on porcelain-coated metal substrates, are provided. The subject inks comprise: a conductive component consisting of stannous oxide and molybdenum trioxide or a mixture of molybdenum trioxide and metallic molybdenum; a glass powder selected from the group consisting of a barium aluminum borate glass and a barium calcium borosilicate glass; and a suitable organic vehicle.

Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

Abstract: A gas sensing device comprises a gas sensing element comprising a gas-sensitive resistive film formed of an aggregate of ultrafine particles of a suitable material deposited on the surface of a substrate of an electrical insulator formed with electrodes. In a method of manufacturing such a gas sensing device, a gas-sensitive material is evaporated in a gas atmosphere to provide the gas-sensitive resistive film of ultrafine particles of the material.

Abstract: A sensor for detecting a fluid flow velocity or flow amount with high precision and high reliability is made by applying a conductor paste comprising platinum powder and an organic vehicle to the outer surface of a fine inorganic insulating tube, followed by drying and firing, thereby forming a platinum film, processing the platinum film into a spiral band form by laser application, inserting a lead wire into the insulating tube, applying a platinum conductor paste to between the spiral platinum band and the lead wire, followed by drying and baking, thereby connecting the spiral platinum band film to the lead wire.

Abstract: A free-standing, thick-film varistor is fabricated by screen printing on a smooth aluminum oxide substrate an unfired standard varistor powder mixed with a suitable organic carrier and heating the printed varistor at high temperature (1000.degree. C.-1400.degree. C.). The fabricated varistor adheres lightly to the insulating substrate and may be easily separated therefrom. The insulating substrate may be reused.

Abstract: An organic coating with slits or holes in a predetermined pattern is disposed on the surface of an electrically insulating substrate on which electrode leads have been formed. A paste of an electrically resistive material fills the slits or holes and is dried at 120.degree. to 140.degree. C. The surface of the paste is flush with that of the coating after which the paste preliminarily baked in a stream of oxygen at 500.degree. to 600.degree. C. while the coating is burnt off. The paste is fully baked at 800.degree. to 1000.degree. C. to form a heating resistor elements.

Abstract: A vitreous enamel resistor material comprising a mixture of a vitreous glass frit, an insulating material containing an oxide of zirconium, and a conductive phase of fine particles of tin oxide. The insulating material is selected from the group consisting of zirconia (ZrO.sub.2), calcium zirconate (CaZrO.sub.2), barium zirconate (BaZrO.sub.3) and strontium zirconate (SrZrO.sub.3), and the conductive phase may also contain an additive such as tantalum oxide. An electrical resistor is made from the resistor material by applying the material to a substrate and firing the coated substrate to a temperature at which the glass softens. Upon cooling, the substrate has on the surface thereof a film of glass and insulating material having the particles of the conductive phase embedded therein and dispersed therethroughout. The resistor material provides a resistor having relatively high resistivity as well as rugged physical characteristics.

Abstract: An apparatus and process for producing fired resistors having uniform resistance characteristics, wherein a continuous closed-loop feedback network detects deviations from standard resistivity values and continuously corrects the composition by varying the proportions of high and low resistance material ratios or blends of such materials being screened onto the substrates (212), and detects deviations in screened-on film thickness for continuously correcting either the speed of operation of a screener assembly (No. 1, No. 2) or the squeegee head pressure in order to obtain a predetermined film thickness. The process continuously adjusts the fired resistance values through on-the-production-line control of mixture ratios of high and low resistive paints, to produce final fired resistors (170) having the required resistance values, temperature coefficients of resistivity, improved stability, and improved TCR tracking values.

Abstract: A method for producing a thick film circuit (30) including a copper conductor pattern (19), thereby obviating the need for expensive precious metal compositions. In the process, a fritted copper paint (16) is applied to a ceramic substrate (18) and fired at a temperature of 850.degree. C. to 950.degree. C. and is oxidized. Concurrently, the paint (16) is adhesively joined to the nonreactive and nonconductive ceramic substrate (18). Next, a resistor paint (20) is applied in overlapping relationship with the air-heated copper conductor pattern (19) and fired at 850.degree. C. to 950.degree. C. The entire unit is then fired in a reducing atmosphere at a temperature of 260.degree. C. to 450.degree. C. to reduce the oxidized copper. The air-fired resistor pattern (21) can either be protected by a coating (40) or unprotected during the reducing atmosphere firing.

Abstract: A method of forming thick film resistor circuits whereby non-noble metals (11, 12) requiring a reducing firing atmosphere are included with resistor material (13) requiring an oxidizing atmosphere. The conductor metallization is capable of adhering to the substrate at a low firing temperature in air. The resistors are printed and fired in air after conductor formation. The metal oxide can then be reduced at a sufficiently low temperature so as not to significantly affect the resistor material. In one embodiment, the conductor paste includes copper and glass frits which can adhere to a ceramic substrate by firing at a temperature of less than 1100 degrees C.

Abstract: Method for manufacturing a ceramic electronic component such as a voltage-dependent non-linear resistor element and a semiconductive ceramic capacitor is disclosed, in which a precisely uniform metal coating is formed on a surface of a ceramic and the metal coating is then heat treated to convert the metal of the metal coating to a metal compound to form a metal compound coating on the surface of the ceramic and/or diffuse a portion of or all of the metal coating into the ceramic, for attaining completely different electric properties than those of untreated ceramic. The present method is particularly useful in the application to a semiconductive ceramic capacitor.

Abstract: A thick film resistor suitable for deposition on a copper printed circuit is produced by providing a resistor pattern of a mixture of metal powder and oxide of the metal and heating in a nitrogen atmosphere at a temperature such that the metal and the metallic oxide react to produce a conducting lower oxide.

Abstract: Filiform elements of predetermined resistivity, e.g. selectively destructible leads of an electrically programmable read-only memory, are formed on a semiconductor substrate such as a silicon body by first depositing thereon a layer of dielectric material such as SiO.sub.2 and topping that layer with a conductive or nonconductive coating which is resistant to a chemical such as hydrofluoric acid capable of attacking the dielectric layer. Next, the top coating is partly destroyed by photolithographic treatment to leave at least one substantially rectangular patch. Thereafter, the dielectric layer is isotropically attacked by the aforementioned chemical with resulting reduction to about half its original thickness and concurrent lateral erosion of a patch-supporting pedestal of that layer whereby channels of generally semicylindrical concavity are formed around the periphery of this pedestal.

Abstract: A method for encasing an electric component of a type comprising a body and at least one pair of lead wires extending outwardly therefrom in the same direction. An outer protective coating or casing enclosing the body therein is formed by dipping the electric component into a solution of chlorinated hydrocarbon containing either a chained aliphatic hydrocarbon or a higher fatty acid to form a film covering the entire surface of the body and the surfaces of portions of the lead wires adjacent the body, then dipping the electric component into a solvent to remove the film except for that covering the surface of a portion of the body adjacent the lead wires and also that covering the surfaces of that portions of the lead wires, and finally dipping the electric component into a coating solution.

Abstract: Preparation of an electrically conductive pattern by adhering a prolonged tack toner which is activated by heating to the toner-receptive image areas of an inert substrate, the temperature is reduced and to the activated toner is applied a prolonged tack toner having conductive metal particles and glass frit as components; optionally the steps of heating, temperature reduction and toner application are repeated at least one time, and then the toned image is burned and fired. An electrically conductive pattern is obtained which is useful, for example, as an electric circuit. The process is also useful in the application of resistor and dielectric materials.

Abstract: A temperature compensated resistive oxygen sensor and a method of manufacturing the same. On the surface of the sensor there are disposed in spaced relation three electrodes. One electrode and a portion of a second electrode is completely covered by a layer of a resistive material which is sensitive to changes in temperature. Another layer of resistive material which is sensitive to both changes in temperature and changes in the partial pressure of oxygen in the gas to which it is exposed covers the first resistive layer as well as the third electrode and the remaining portion of the second electrode. It is also a feature of the present invention that these layers are applied by shielding part of the surface of the sensor and applying the first layer by a hot thin-layer technique and by removing the shield and applying the second layer also by a hot thin-layer technique.

Abstract: Disclosed is a range of resistor compositions which exhibit a stability of less than 0.5 percent change in resistance after 2,000 hours at 175.degree. C., and yet which also have a temperature coefficient of resistance less than + or -25 ppm per degree Celsius. These compositions all comprise alloys of nickel, chromium and silicon, within a selected range. Also, disclosed is a method of manufacturing these compositions on a reproducible basis. The method includes the provision of a first silicon target and a second nickel chromium target and the subjecting of these targets to a sputtering gas and electrical potential such that the aforementioned silicon, nickel, chromium alloys are formed.

Abstract: A matrix of discrete spaced electrical components (which may be individual components or networks, for example) in fixed array on a substrate wafer, each component being connected to terminal conductor pads on the opposite surface of the substrate by thick film conductor strips that extend along the walls of apertures in the wafer.

Abstract: A cermet resistor element utilizing a silver-gold alloy to improve the contact resistance variations and the method of making the element are disclosed. A gold resinate and a silver resinate are mixed with the noble metal resinates and glass frit to make a cermet material. The mixture is heated to drive off the organic resinate materials and to alloy the silver and gold. The resultant material is ground to a powder, reheated and reground. The powder is mixed with a volatile material to form a paste which can be applied to a substrate to form the resistance element. The element is heated to drive off the volatile material and fuse the glass into a solid mass. The silver and gold form a silver-gold alloy during the process and settle on the top surface of the element in globules and improve the contact resistance variations of the element.

Abstract: High stability thin film resistors are made from an alloy comprising selected portions of nickel, chromium, and gold selected in a ratio to provide the desired temperature coefficient of resistance (TCR). The resistors are made by co-depositing gold with the nickel chromium alloy by a flash evaporation process. The evaporation process is carried out by feeding a nickel chromium wire, having a gold wire extending therealong to provide the desired composition, onto a heated tungsten strip within a vacuum system with substrates disposed in a position to obtain uniform deposition of the evaporated material thereon.

Abstract: Disclosed are humidity sensor structures, and fabrication techniques, which result in uniform and reliable humidity sensing, reliable electrical connections in small sensors, and simplified and inexpensive manufacture.

Abstract: This disclosure relates to a low power write-once, read-only semiconductor memory (PROM or programmable read only memory) array wherein the semiconductor resistors located in the word line decoder and driver and also in the bit line decoder and sense amplifier of the memory array are fabricated to have a high resistivity thereby permitting the semiconductor array to operate with much lower power. The high resistivity semiconductor resistors of this write-once, read-only semiconductor memory array are fabricated using an ion implantation step, preferably, between the base and emitter diffusion process steps in fabricating the NPN transistor structures used in the bit line and word line decoders of the memory array. The high resistivity ion implanted resistor regions are preferably shallow, boron implanted regions that are formed by ion implanting through a thin silicon dioxide layer. Various resistor devices are disclosed using shallow, boron implanted, high resistivity regions.

Abstract: An improved electrical resistor device is made by molding a body of ceramic material of positive temperature coefficient of resistivity so that a plurality of passages extend in a pattern in spaced side-by-side relation to each other between opposite ends of the body. In molding the body, lands or abutments of resistor material are formed around the ends of alternate body passages at one end of the body and similar lands or abutments are formed around the ends of the other passages at the opposite end of the body. A band of masking material is applied to the sides of the body extending around the body leaving the ends of the body, and bands of the body side surface adjacent each end of the body, free of masking material. The masked body is then immersed in a coating bath for simultaneously coating the inner walls of the body passages, the ends of the body, and the unmasked bands of the body side surface with an electrically conductive ohmic contact material.

Abstract: A glass-free thick film varistor operable at operating voltages ranging from about 30 to 200 volts per mm of active varistor material is produced by providing a screen-printable paste comprised of a non-glass containing substantially homogeneous mixture of granular varistor materials which have ZnO as the main component thereof and an organic binder, applying such paste in a desired pattern onto an insulating substrate and sintering such applied paste at relatively high temperatures so as to convert the paste into thick film varistors.

Abstract: High stability thin film resistors are made from an alloy comprising selected portions of nickel, chromium, and gold selected in a ratio to provide the desired temperature coefficient of resistance (TCR). The resistors are made by co-depositing gold with the nickel chromium alloy by a flash evaporation process. The evaporation process is carried out by feeding a nickel chromium wire, having a gold wire extending therealong to provide the desired composition, onto a heated tungsten strip within a vacuum system with substrates disposed in a position to obtain uniform deposition of the evaporated material thereon.

Abstract: A thin film, cylindrical resistor is disclosed which exhibits non-inductive characteristics and which may be fabricated easily and economically. A cylindrical insulative substrate is provided with electrically conductive termination bands and a thin coating of electrically resistive material over the entire cylindrical surface. The resistive material is then cut along an axial path and along an interrupted spiral path so as to form the resistive material into a serpentine path along the cylindrical substrate. Leads are attached to each end and as the current traverses the length of the cylinder it travels in a serpentine path. The current travels in opposite directions along adjacent parallel portions of the path thereby cancelling out the major portion of inductance.

Abstract: A folded, highly pure platinum, thick film, path on a ceramic cylindrical substrate provides a high TCR of about 3850 ppm/.degree. C. The path is applied by screen printing a thick film paste onto a substrate and then firing the paste at a time and temperature sufficient to bond the path to the substrate and to produce a TCR of at least about 3850 ppm/.degree. C. The paste is comprised of about 20% by weight of an organic carrier into which 80% by weight of particles have been mixed. The particles are 96% by weight platinum particles of less than about ten microns size and 4% by weight of a contaminant-free vitreous glass frit of less than ten microns size.

Abstract: In a film resistor comprising a substrate of insulative material and a film of Cermet formed as resistance material on the substrate, a protective film of insulative material is formed on the surface of the film of Cermet to reduce the temperature coefficient of resistance of the film resistor. The protective film is formed of magnesium fluoride.

Abstract: Disclosed are humidity sensor structures, and fabrication techniques, which result in uniform and reliable humidity sensing, reliable electrical connections in small sensors, and simplified and inexpensive manufacture.

Abstract: Disclosed is a method and resulting product whereby thick film conductors which require a reducing firing atmosphere may be included in circuits with thick film resistors requiring an oxidizing firing atmosphere. In accordance with one embodiment, a fritless paste including copper is deposited onto a substrate in a desired conductor pattern and fired to establish adhesion. The copper oxide in the pattern is then reduced to copper metal at a high temperature. This is followed by oxidation of the copper to produce a copper oxide of lower density than the oxide formed after the initial firing. The resistor material is then deposited and fired in an oxidizing atmosphere. The low density copper oxide may then be reduced at a low temperature so that resistor properties are not adversely affected.

Abstract: This invention relates generally to electrical resistors and particularly to a resistor disk and contact assembly wherein by reason of the structure of the disk, the radial resistance of the disk is randomly varied to produce a random-like resistance pattern of a predetermined configuration as the disk is rotated between fixed engaging contacts.

Abstract: A vitreous enamel resistor material which includes a mixture of fine particles of tungsten carbide, tungsten trioxide and a glass frit. The resistor material may also include fine particles of tungsten. The resistor material is made into a resistor by coating the mixture on a substrate, firing the coating at a temperature at which the glass frit melts, and then cooling the coated substrate to form the resistor having a layer of glass with the particles dispersed therein.

Abstract: A flame retardant, flexible, solder resistant covercoat has been formulated based on dichloropropyl acrylate.

Abstract: A highly stable noninductive film-type cylindrical resistor which can be economically mass-produced, with few rejects, even when the film is one having a very high resistance. This is accomplished by providing, in a silk-screened serpentine film pattern, parallel rows of bend or base regions which are on opposite sides of a longitudinal gap, and which are very wide in comparison to the remainder of the pattern. The exterior of the film is then lapped, until the resistance increases to a desired value, by effecting relative rotation between the resistor and a flexible lapping tape having a desired tension. For high-value resistors, the resistive film is caused to have a value (in ohms per square) higher than would be practical if the lapped bends were not relatively wide.

Abstract: A ceramic electric resistor and a method for making the same. The resistor has a body which is formed of a material having a Perovskite structure with semiconducting doping and on its surface is contacted with two layers of different materials. The first layer is palladium or in association with palladium chloride and the second layer is one from a group of nickel, nickel-phosphorus or nickel-boron alloys. The process includes stoving-in the palladium or palladium chloride solution and providing a given composition of nickel bath for the second layer.

Abstract: A resistor, which can be of either the fixed or variable type, having a metal base covered by an insulating coating over all but an exposed area of the metal. A film type resistive compound or a wire winding covers the insulating coating but overruns it in the exposed area of the metal base and is bonded to the metal base. A suitable conventional terminal member is in conductive relation to the resistive compound covering at a point remote from the exposed area of the base so that the base, itself, may function as one terminal for the resistor.

Abstract: A cermet resistor employs film terminations of sub-micron thickness. The terminations contain particles of SiO.sub.2 or MnO.sub.2 that may be conveniently made by mixing such particles in a metal resinate paste, screening the paste on a glazed or unglazed substrate and firing. A glass containing resistor paste is screened in overlapping relationship with the fired terminations and is itself fired. The particle additives ameliorate cracking of the terminations at resistor firing and enhance the termination to substrate bond.

Abstract: Metallizing compositions suitable for the production of fired on electrically conductive films which do not adversely affect the overall strength of heat resistant substrates are described. The compositions comprise, in specified proportions, at least one finely divided electrically conductive metal, certain alkali metal, crystallizable, high silica glass frits as binder, inert liquid vehicle and, if desired, inert filler and/or pigment. The compositions are particularly suited to glass substrates and provide therewith composite structures having greater strength than that of the glass substrate.

Abstract: The process by which this device is made comprises the implantation of ions into an insulator. Surface charge on the insulator is discharged during implantation by an electron beam or by a thin conductive surface layer previously deposited on the insulator. Ion energy and dose are selected to embed ions into the insulating lattice to a sufficiently high local concentration to produce a zone of lower resistance which is the implanted zone. The dosage which presently appears to be a minimum dosage for providing a conductive zone in the insulative body is the order of 10.sup.18 ions per square centimeter. Beam currents upward from 10 microampers per centimeter square implanted areas are satisfactory.

Abstract: Conductive metal pigments which may be used in electrical devices are prepared by forming an alloy of a non-noble conductive metal and at least one oxidizable material, mixing the resulting alloy with a vitreous frit and an organic vehicle to form an ink, screening said ink onto a substrate, firing the alloy in an air atmosphere at a temperature in excess of about 500.degree. C. and cooling the ink to produce a conductive pigment. The oxidizable material is preferentially oxidized during the firing with a concomitant non-oxidation of the non-noble conductive metal.

Abstract: A vitreous enamel resistor material comprising a mixture of a vitreous glass frit and fine particles of a mixture of tin oxide (SnO.sub.2) and tantalum oxide (Ta.sub.2 O.sub.5). An electrical resistor is made from the resistor material by applying the material to a substrate and firing the coated substrate to a temperature at which the glass melts. The oxide mixture may be heat treated prior to mixing with the glass frit. Upon cooling, the substrate has on the surface thereof a film of the glass having the particles of the oxides embedded therein and dispersed therethroughout. The resistor material provides a resistor having a high resistivity and a low temperature coefficient of resistance.

Abstract: A termination material for a vitreous enamel electrical resistor which includes a mixture of a glass frit and particles of nickel and iron. The termination material is applied to a substrate and fired to melt the glass frit, and then cooled to form a layer of the glass with particles of an alloy of nickel and iron embedded therein. The termination material may be applied to the substrate either before or after the resistance material is applied to the substrate.

Abstract: An electrical resistor and method of making same including a substrate of an electrical insulating material having on a surface thereof a film of a resistance material and a termination film of a conductive material at each end of the resistance film. The resistance film is preferably a layer of a glass having embedded therein conductive particles such as tantalum nitride and tantalum or tungsten carbide and tungsten. The termination film contains either molybdenum, tungsten or a mixture thereof.

Abstract: A process is described for producing a composite metal film in which metalliferous particles and polymer particles are co-deposited on a substrate, the proportion of metalliferous particles being such that the metal film is discontinuous, the metal particles being present in the form of islands with intervening zones of polymeric material. The resulting composite films have negative temperature coefficient of resistance. The process may be applied to the production of semiconductor composite films, e.g., copper oxide films by means of an annealing oxidative treatment to convert metal to metal oxide before loss of polymeric matrix by oxidation or evaporation.

Abstract: A band-shaped metal layer useful as a resistance layer and/or a contact layer is pyrolytically deposited onto a cylindrical substrate by surrounding the surface of the substrate with a mixture of a thermally decomposable metal compound and a carrier therefor and substantially simultaneously heating only precise surface areas of the substrate, as by a laser beam, to a temperature slightly above the thermal decomposition temperature of the metal compound and moving the substrate in a rotational and/or axial manner so that a band-shaped metal layer forms only at the heated surface areas of the substrate.

Abstract: A row of thick-film resistors connected by thick-film conductors on a ceramic substrate are suitably powered to form a thermal printing head. Thermally-sensitive paper is placed in intimate contact with the resistors, some of which are heated to a temperature sufficient to cause a color change in the paper to thereby produce a corresponding array of dots. The paper is moved across the printing head in incremental steps, forming other arrays of dots. The dots combine to form alphanumeric characters.

Abstract: A technique for the fabrication of hybrid integrated circuitry combining the expedients of thick and thin film technology is described. A novel processing sequence for attaining ohmic contact between thick film resistors and thin film conductive metallization involves the use of an interphase gold tab as a conductive link.

Abstract: A process is disclosed for vacuum depositing by co-sputtering a thin film nickel-chromium resistor of metastable composition. Also disclosed is a resistor made by this process, which resistor possesses a near zero temperature coefficient of resistance.

Abstract: A thin film circuit consisting of a planar substrate of insulating material and a thin metal film formed from an alloy of aluminum with between 2 to 20 atom percent tantalum from which resistors and capacitors are developed. The metal film has an equivalent composition to a film which is formed by means of reactive cathode sputtering. In particular, the film is equivalent to a film formed using a cathode of aluminum and tantalum which is reactively sputtered in a sputtering atmosphere containing oxygten with a low partial pressure.In such an arrangement, the temperature coefficient of resistance and the capacity temperature coefficient compensate one another. The alloy films have a high oxidation stability and the resistors and capacitors therefrom have a high resistance to aging.

Abstract: a zinc oxide compound nonlinear resistance overvoltage surge arrester disc is provided with a low temperature-curing ceramic antiflashover collar having relatively low coefficient of thermal expansion of about 4.5 .times. 10.sup.-6. The cured ceramic comprises the reaction product of a dry mixture of 80% by weight of mullite refractory filler and 20% kaolin suspending clay, together with 5% to 15% of the weight of the dry mixture of a binder consisting of equal weights of monoaluminum phosphate and concentrated phosphoric acid.Also disclosed is a method of application comprising the steps of applying the slurry to the perimeter of the disc and baking at a temperature below about 600.degree. Celsius.