Abstract: Methods and apparatus for providing data processing and control for use in a medical communication system are provided.

Abstract: Methods, systems, computer-program products and program-storage devices for determining whether or not to perform an action based at least partly on an estimated maximum test-range. One method comprises: attaining results generated from a parametric test on semiconductor devices included in a control set; selecting from the semiconductor devices at least one extreme subset including at least one of a high-scoring subset and a low-scoring subset; plotting at least results of the at least one extreme subset; fitting a plurality of curves to a plurality of subsets of the results; extending the curves to the zero-probability axis for the low-scoring subset or the one-probability axis for the high-scoring subset to define a corresponding plurality of intersection points; defining an estimated maximum test range based on at least one of the intersection points; and determining whether or not to perform an action based at least partly on the estimated maximum test range.

Abstract: The present invention systems and methods facilitate increased die yields by flexibly changing the operational characteristics of functional components in an integrated circuit die. The present invention system and method enable integrated circuit chips with defective functional components to be salvaged. Defective functional components in the die are disabled in a manner that maintains the basic functionality of the chip. A chip is tested and a functional component configuration process is performed on the chip based upon results of the testing. If an indication of a defective functional component is received, the functional component is disabled. Workflow is diverted from disabled functional components to enabled functional components.

Abstract: Disclosed is a test method an apparatus in which an area for test and an area for analysis are specified based on the design information of the display device having a non-rectangular display area. To carry out testing, parasitic capacitances are found using the design information, and operations for weighting are performed on test data or threshold values based on which a decision on pass/fail is to be made.

Abstract: Systems and methods for quantifying the suitability of a coax network segment to support MoCA communications, comprising: transmitting a test signal associated with MoCA communications through the segment's first end; receiving the test signal through the segment's second end; determining a response function; determining a channel degradation reference based on the highest power level of the response function and a predetermined reference; calculating subcarrier degradation for each MoCA subcarrier, in accordance with the difference between the channel degradation reference and the subcarrier response function; and quantifying the suitability of the segment to support MoCA communications from the first end to the second end in accordance with the subcarrier degradation of all subcarriers in the response function.

Abstract: A fault detection method of semiconductor manufacturing processes is disclosed. The method includes the steps of providing a storage device, collecting a fault detection and classification(FDC) parameter by the storage device, setting up a measurement site for measuring an online measurement parameter, collecting a wafer acceptance test(WAT) in correspondence to the FDC parameter, establishing a first relationship equation between the FDC parameter and the online measurement parameter, establishing a second relationship equation of the online measurement parameter and the WAT by using the first relationship equation, establishing a third relationship equation between the FDC parameter and the WAT, establishing a waning region of the manufacturing processes by using the first, second, and third relationship equations, and determining the situation of generating wafer defects according to the warning region. The present invention discloses a system architecture for the method.

Abstract: Disclosed is an abnormality detection system that accurately detects abnormalities that arise in a device.

Abstract: A method for determining disposition of via hole on printed circuit board (PCB) includes the steps of: providing a PCB on which is disposed with a geometric layout and a via hole; providing a line on the PCB for intersecting the geometric layout to form a plurality of points of intersection; defining line segments by segmenting the line at each of the points of intersection to form a plurality of line segments; deleting some of the line segments having one end not being point of intersection for the geometric layout to form a plurality of segmented regions; searching a closed region by repeatedly searching region from any one of the points in the plurality of segmented regions; determining whether a closed region is a smallest closed region; determining whether a via hole is located within the smallest closed region.

Abstract: The present invention proposes a method for optimizing a quality control strategy for rapid release results. An embodiment of the invention includes generating a set of candidate quality control rules and for each candidate rule, computing a maximum number of patient specimens that can be tested between quality control events while keeping the expected number of correctable unacceptable results below a predetermined correctable maximum and keeping the expected number of final unacceptable results below a predetermined final maximum. Furthermore a quality control utilization rate can be computed based on the number of patient specimens tested between each quality control event and the number of reference samples tested at each quality control event. The candidate rule for which the best quality control utilization rate may be selected along with the corresponding number of patients to be tested between each quality control as the optimum quality control strategy.

Abstract: A semiconductor memory device includes a plurality of detecting code generators configured to generate a plurality of detecting codes to detect errors in a plurality of data items, respectively, a plurality of first correcting code generators configured to generate a plurality of first correcting codes to correct errors in a plurality of first data blocks, respectively, each of the first data blocks containing one of the data items and a corresponding detecting code, a second correcting code generators configured to generate a second correcting code to correct errors in a second data block, the second data block containing the first data blocks, and a semiconductor memory configured to nonvolatilely store the second data block, the first correcting codes, and the second correcting code.

Abstract: An apparatus, method and an image quality guide document are disclosed. The method includes, for at least one image in a set of images undergoing image enhancement, identifying image quality-related features for the image based on enhancements being applied to the image, identifying image content-related features based on content of the image, determining a content-based degradation of the image based on the identified image quality-related features and image content-related features, and generating a thumbnail of the image. The method further includes generating an image quality guide document for the set of images in which at least one of the thumbnails is associated with a respective text description that is based on the determined content-based degradation.

Abstract: Method for measuring the shape of a workpiece includes a measuring sensor used to find measured values that represent the shape of a workpiece. The shape of the workpiece is determined by an iterative method using the measured values. The shape of the workpiece is determined during machining. The determining of the shape during machining is particularly suited for determining the shape during grinding. The shape determined may be the shape of a pin, especially a crankpin for a crankshaft.

Abstract: A method of establishing statistically valid assay means and ranges for quality control materials, used to qualify medical testing machines, utilizes tests on a new lot of quality control material to establish an assay mean, and uses data from a database of historical test results to establish an assay range. The system may estimate the variability of test results from prior lot data, and then compute the limits of the assay range such that a new test on a new lot of the quality control material will be expected to fall within the range with a specified probability. Because historical data is used to estimate the test variability, the number of new tests required to specify a statistically valid mean and range may be dramatically reduced, as compared with establishing the mean and range based only on tests of the new lot of material.

Abstract: There is provided a control system of a substrate processing apparatus, comprising: a collecting unit for collecting data from each component that constitutes a substrate processing apparatus, the collecting unit further comprising at least: a buffer for temporarily storing collected data; and a sorting part for rearranging the collected data, based on time data attached to the collected data.

Abstract: A non-destructive system for characterizing welds that includes at least one weldment that further includes at least two components joined together a weld; at least one source of heat energy directed toward one side of the weldment, wherein the source of heat energy is operative to direct a predetermined amount of heat energy through the first component toward one side of the weld, through the weld and the area surrounding the weld, and through the second component to the opposite side of the weldment, and wherein the heat energy is sufficient to induce a temperature change in the weld and the area surrounding the weld; and a temperature measuring device directed toward the opposite side of the weldment for gathering temperature data from heat passing through the second component away from the weld and the area surrounding the weld, wherein the gathered temperature data is indicative of weld quality.

Abstract: According to one embodiment, a manufacturing control system includes a reference data creating unit, first, second and third data storing units, first, second and third data extracting units. The reference data creating unit creates reference data including a reference time related to a product. The first data storing unit stores data related to parts acceptance inspection and related to assembly of the product. The second data storing unit stores data related to inspection in manufacturing. The third data storing unit stores data related to quality assurance inspection and of acceptance inspection at a customer site. The first data extracting unit extracts data related to latest parts acceptance inspection and related to latest assembly of the product. The second data extracting unit extracts data related to inspection in latest manufacturing. The third data extracting unit extracts data related to latest quality assurance inspection and of latest acceptance inspection.

Abstract: Provided are techniques for numerically integrating an intensity distribution function over a numerical aperture in a manner dependent on a determination of whether the numerical aperture spans a Rayleigh singularity. Where a singularity exists, Gaussian quadrature (cubature) is performed using a set of weights and points (nodes) that account for the effect of the Wood anomaly present within the aperture space. The numerical aperture may be divided into subregions separated by curves where the Wood anomaly condition is satisfied. Each subregion is then numerically integrated and a weighted sum of the subregion contributions is the estimate of the integral. Alternatively, generalized Gaussian quadrature (cubature) is performed where an analytical polynomial function which accounts for the effect of the Wood anomaly present within the aperture space is integrated. Points and nodes generated from a fit of the analytical polynomial function are then used for integration of the intensity distribution function.

Abstract: Methods and systems for systems and methods for product reliability estimation are provided. A method implemented in a computer infrastructure includes separating products into different process window segments. The method also includes calculating a product reliability estimation for each process window segment. The method further includes calculating a system product reliability estimation. At least one of the separating, calculating the product reliability estimation, and calculating the system product reliability estimation is performed using a processor.

Abstract: A radiation analysis system/method that automatically optimizes the efficiency calibration of a counting system based on benchmark data and variable parameters associated with radiation source/sensor/environment (RSSE) combinations is disclosed. The system/method bifurcates RSSE context (SSEC) model parameters into WELL-KNOWN (fixed) parameters (WNP) and NOT-WELL-KNOWN (variable) parameters (NWP). The NWP have associated lower/upper limit values (LULV) and a shape distribution (LUSD) describing NWP characteristics. SSEC models are evaluated using randomized statistical NWP variations or by using smart routines that perform a focused search within the LULV/LUSD to generate model calibration values (MCV) and calibration uncertainty values (UCV) describing the overall SSEC efficiencies. Sensor measurements using the MCV/UCV generate a measurement value and uncertainty estimation value.

Abstract: Methods and systems for programmed dispensation of consumable compositions are provided. A method for sterilizing a beverage container may include, but is not limited to: (a) detecting a sterilization status of a container; and (b) controlling functionality of a controllable device according to the sterilization status. A system for sterilizing a beverage container may include, but is not limited to: (a) means for detecting a sterilization status of a container; and (b) means for controlling functionality of a controllable device according to the sterilization status.

Abstract: Provided is a monitoring and control system which, by displaying memo information created by an operator on an arbitrary system screen, can enhance freedom of memo display and fully exhibit the effectiveness of memo information. A memo data operation portion 4 receives an input of memo information from an input device 2, imparts attribute information relating to an arbitrary system screen to the memo information, and outputs this with the memo information to a client-side data management portion 6. A display device 1 displays the memo information on a system screen having attribute information.

Abstract: Methods, apparatus, products are disclosed for providing policy-based application services to an application running on a computing system. The computing system includes at least one compute node. The compute node includes an application and a plurality of application services of a service type. Providing policy-based application services to an application running on a computing system includes establishing, on the compute node, a service policy specifying one of the application services of the service type for use by the application, establishing a performance ruleset, the performance ruleset specifying rules for analyzing the performance of the computing system, measuring performance of the computing system, and adjusting the service policy in dependence upon the performance ruleset and the measured performance. Providing policy-based application services to an application running on a computing system may also include accessing, by the application, the specified application service.

Abstract: A method of detecting variance by regression model has the following steps. Step 1 is preparing the FDC data and WAT data for analysis. Step 2 is figuring out what latent variable effect of WAT data by Factor Analysis Step 3 is utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components. Step 4 is demonstrating how the tools and FDC data affect WAT data by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.

Abstract: The present invention is related to the in-line determination of thickness, optical properties and quality of thin films and multilayer structures of organic (conductors, semiconductors and insulators), hybrid (organic/inorganic) and inorganic (e.g. metals, oxides) materials in real-time by the use of Spectroscopic Ellipsometry—SE, during their printing and/or treating by roll-to-roll and sheet-to-sheet processes. SE unit is located on a stage with the possibility of movement in the lateral direction in relation to the movement of e.g. the roll, taking measurements in the spectral range of Vis-fUV from 1.5-6.5 eV.

Abstract: The current invention relates to a monitoring and analysis device and a method for monitoring and analysis that utilizes the unintended electromagnetic emissions of electrically powered systems. The present invention monitors electrical devices by taking detailed measurements of the electromagnetic fields emitted by any component or system utilizing electricity. The measurements will be analyzed to both record a baseline score for future measurements and to be used in detailed analysis to determine the status of the analyzed system or component.

Abstract: An information processing apparatus for processing information on semiconductor treatment apparatus includes an abnormality information display device which displays information on an abormality in semiconductor treatment apparatus, a countermeasure information receiving device which receives countermeasure information on countermeasure, a countermeasure information storing device which stores the countermeasure information matched with abnormality identification information, an output device which outputs the countermeasure and abnormality identification information via communication device to outside, a countermeasure item display device which displays countermeasure item candidates, a countermeasure item storing device which stores countermeasure item selected from the candidates matched with the abnormality identification information, a countermeasure item transmitting device which transmits the countermeasure item and abnormality identification information via the communication device to outside, a count

Abstract: A transmitting/receiving system includes two transmitting/receiving apparatuses connected through a transmission cable having two one-direction signal lines. Each apparatus includes a transmitting unit that transmits a signal, a receiving unit that receives a signal, a calculator, a controller, a storage, and an estimating unit. The calculator calculates an Signal to Noise (S/N) ratio of the received signal. The controller controls the calculation by obtaining, as a first value, a strength of a signal caused by a check signal transmitted during absence of a check signal being received, obtaining, as a second value, a strength of a check signal received during absence of a check signal being transmitted, and dividing the second value by the first value. The storage stores relationship between a predetermined transmission-cable S/N ratio and temporal signal fluctuation. The estimating unit estimates temporal signal fluctuation from the calculated S/N ratio and the relationship.

Abstract: A method for generating an electronic quality record of a manufacturing operation that may involve generating inputs from a plurality of information sources located within a manufacturing environment. The plurality of information sources may provide information pertaining to at least a tool being used, an individual using the tool, and an operation that the tool is being used by the individual to perform. A locating system may be used that is in communication with the plurality of information sources to monitor a location and an operation of the tool. A processor may be in communication with the locating system to receive the generated inputs and to generate an electronic record upon completion of the operation that the tool is being used by the individual to perform. The electronic record may identify that the operation has been performed by the individual using the tool in accordance with a predefined standard.

Abstract: The present disclosure provides one embodiment of an integrated circuit (IC) fabrication method to form an IC structure having one or more through silicon via (TSV) features. The IC fabrication method includes performing a plurality of processing steps; collecting physical metrology data from the plurality of processing steps; collecting virtual metrology data from the plurality of processing steps based on the physical metrology data; generating a yield prediction to the IC structure based on the physical metrology data and the virtual metrology data; and identifying an action at an earlier processing step based on the yield prediction.

Abstract: Methods for optimizing conductor patterns for conductors formed by ECP and CMP processes. A method includes receiving layout data for an IC design where electrochemical plating (ECP) processes form patterned conductors in at least one metal layer over a semiconductor wafer; determining from the received layout data a global effects factor corresponding to a global pattern density; determining layout effects factors for unit grid areas corresponding to the pattern density of the at least one metal layer within the unit grid areas, determining local effects factors for each unit grid area; using a computing device, executing an ECP simulator using at least one of the global effects factor and the local effects factors, and using the layout effects factor; outputting an predicted post-ECP hump data map from the ECP simulator; and if indicated by a threshold comparison, modifying the layout data.

Abstract: A method for performing a dimensional inspection of a fabricated composite part (9), comprising steps of: a) Providing a number of points (Iij, Oij) to be inspected in its inner and outer surface; b) Obtaining the positional data of said points (Iij, Oij) from the fabricated composite part (9) hold in a position that allows the access to its outer and inner surfaces as a first set of positional data (WIij, WOij); c) Using said first set of positional data (WIij, WOij) and a second set of positional data (TIij, TOij) of the same points (Iij, Oij) obtained from an analytical model defining its theoretical geometry for calculating the deviations between them taking into account the deformations suffered by the fabricated composite part (9) in said position. The invention also refers to a workstation (11) for performing the method.

Abstract: A chip diagnostics management system includes secure design information that define production features of integrated circuit devices and are accessible according to selected levels of access privilege. A database of device defect information includes information of defects of devices produced according to the production features of the design information and associated wafers, production lots, and dies in or with which the devices were produced. A diagnostic manager correlates device defect information from plural wafers with the design information to identify a device location with a probability of being associated with the device defect information. A diagnostic manager viewer indicates the device location together with an amount of design information correlated the level of access privilege assigned to a selected user.

Abstract: A data storage device (DSD) tester is disclosed for testing a DSD. The DSD tester comprises control circuitry operable to receive production line data through an interface, wherein the production line data is related to the DSD. The control circuitry executes a DSD test on the DSD, and transmits failure data generated by the DSD test and the production line data to a failure information database.

Abstract: The present invention relates to a method and system for providing real-time packet-level quality assurance of digital data that controls an electromechanical device transmitted through a network between a transmitting computer and at least one terminal computer. Specifically, all data packets transmitted between the transmitting computer and the at least one terminal computer are passively monitored, and those data packets containing digitized data that controls an electromechanical device of a pre-determined format are selectively recorded to a database. The selectively recorded data packets are then analyzed for determining whether a current set of digitized data that controls an electromechanical device transmitted between the transmitting computer and the at least one terminal computer during a current session would lead to a harmful or undesirable outcome by the electromechanical device being controlled.

Abstract: Disclosed are systems and methods for prognostic health management (PHM) of electronic systems. Such systems and methods present challenges traditionally viewed as either insurmountable or otherwise not worth the cost of pursuit. The systems and methods are directed to the health monitoring and failure prediction of electronic systems, including the diagnostic methods employed to assess current health state and prognostic methods for the prediction of electronic system failures and remaining useful life. The disclosed methodologies include three techniques: (1) use of existing electronic systems data (circuit as a sensor); (2) use of available external measurements as condition indicators and degradation assessor; and (3) performance assessment metrics derived from available external measurements.

Abstract: To improve a method for making an overprint prediction to that extent, that the method allows more reliable overprint predictions with a reduced effort, the invention proposes a method for making the overprint prediction for a color combination, in which method a printing substrate and at least two printing colors and one gradation of hue values per printing color including the full tone as well as color combinations are predefined as data of the hue value of the n printing colors, wherein first of all individual color predictions comprising three transmittance components and the associated transmittance spectra for the respective hue value are determined for each of the n printing colors, wherein for an intended color combination up to (3 to the power of n) combinations of the transmittance components and the associated combined transmittance spectra are determined, and an overall reflectance spectrum of an overprint is predicted on the basis of the determined transmittance components with their transmittanc

Abstract: A system, a method and a computer program product for identifying incompatible manufacturing tools. The system receives measurements of products that were subject to a manufacturing process involving a plurality of manufacturing tools. The measurements pertain to a performance characteristic of each product. The system evaluates whether each manufacturing tool implemented in a sequential manufacturing process individually performs normally based on the received measurements. In response to evaluating each manufacturing tool implemented in said manufacturing process individually performs normally, the system evaluates whether a first combination of the manufacturing tools together in sequential manufacturing process perform normally based on the received measurements.

Abstract: A semiconductor wafer fabrication metrology method in which process steps are characterised by a change in wafer mass, whereby during fabrication mass is used as a measurable parameter to implement statistical process control on the one or more of process steps. In one aspect, the shape of a measured mass distribution is compared with the shape of a predetermined characteristic mass distribution to monitor the process. An determined empirical relationship between a control variable of the process and the characteristic mass change may enable differences between the measured mass distribution and characteristic mass distribution to provide information about the control variable. In another aspect, the relative position of an individual measured wafer mass change in a current distribution provides information about individual wafer problems independently from general process problems.

Abstract: A health monitoring system for monitoring the health of an electronic system. The health monitoring system includes an analog-to-digital converter, and a monitoring circuit within the electronic system. The monitoring circuit includes fatigue life characterized electrical components representative of electrical components comprising the balance of the electronic system. The fatigue life characterized electrical components are employed solely to monitor the health of the electronic system. The monitoring circuit output is electrically connected to the analog-to-digital converter.

Abstract: A system and a method for controlling the quality of an industrial process, of the type that comprises the steps of: providing one or more reference signals for the industrial process; acquiring one or more real signals that are indicative of the quality of said industrial process; and comparing said one or more reference signals with said one or more real signals in order to identify defects in said industrial process.

Abstract: Example methods and apparatus to predict process quality in a process control system are disclosed. A disclosed example method includes receiving process control information relating to a process at a first time including a first value associated with a first measured variable and a second value associated with a second measured variable, determining if a variation based on the received process control information associated with the process exceeds a threshold, if the variation exceeds the threshold, calculating a first contribution value based on a contribution of the first measured variable to the variation and a second contribution value based on a contribution of the second measured variable to the variation, determining at least one corrective action based on the first contribution value, the second contribution value, the first value, or the second value, and calculating a predicted process quality based on the at least one corrective action at a time after the first time.

Abstract: A door closing-inspection apparatus for a vehicle includes a first lightening and light-receiving device which strides over a transferring conveyer in a finished vehicle inspection line which inspects a finished vehicle while being transferred; a pair of door-closing devices arranged at positions on a downstream side of the first lightening and light-receiving device and on symmetrically both sides of a length of the transferring conveyer; a second lightening and light-receiving device arranged on a downstream side of the door-closing devices which strides over the transferring conveyer; a pair of door distance-measuring sensors arranged at positions on a downstream side of the second lightening and light-receiving device is on symmetrically both sides of the length of the transferring conveyer; and a controller which is connected to the first and second lightening and light-receiving devices, the door-closing devices, the sensors, and a driving source controller of the transferring conveyer.

Abstract: An apparatus for evaluating the quality of an input image is disclosed. The apparatus may include a composition pattern selection unit configured to select a composition pattern based on an attribute of the input image. The apparatus may also include a composition evaluation unit configured to evaluate the input image based on the composition pattern and the attribute. Additionally, the apparatus may include an evaluation result output unit configured to output to a display the input image and an indication of a result of the evaluation.

Abstract: A system and method for performing spatial signature analysis, the system including a memory unit for storing wafer defect density maps of multiple resolutions, derived from a defect map obtained by an inspection tool; an analyzer for analyzing the wafer defect density maps to identify zones of interest; and a spatial signature generator for generating spatial signatures in response to relations between zones of interest of different density resolution.

Abstract: A white LED quality inspection method includes steps as follows. A steady current is supplied to a LED by a rated voltage supply unit for generation of a stable light spot from the LED; a stable light spot is received by a photosensor of a luminous intensity sensing unit and transformed to digital information; the digital information is received by a preprocessing unit and transformed to pixel information; the pixel information is received by a calculation unit to calculate a Yellow Ring Index of each pixel in the pixel information.

Abstract: A system for measuring at least one parameter of moving cable, the system including a system power source, a digital camera adjacent a moving cable for taking digital images of the cable as the cable moves past the digital camera, the digital camera producing signals corresponding to the digital images, a signal processor for receiving the signals from the digital camera and for processing the images to produce processed image data, the signal processor for calculating measurements of the at least one parameter of the cable based on the processed image data, the system power source for powering systems devices, e.g., the digital camera and/or the signal processor. This abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims, 37 C.F.R. 1.72(b).

Abstract: A substrate processing apparatus checking method that can simply and reliably check the transient response characteristics of a substrate processing apparatus. An analyzing apparatus reads and analyzes process data comprised of time-series data on a plurality of parameters relating to a process comprised of a plurality of steps carried out on a substrate by the substrate processing apparatus. The analyzing apparatus extracts data that satisfies predetermined extracting conditions from the process data, and analyzes the extracted data based on predetermined analyzing conditions.

Abstract: Methods and systems are provided for fabricating and measuring features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves fabricating a feature of the semiconductor device structure on a wafer of semiconductor material, determining a hybrid recipe for measuring the feature, configuring a plurality of metrology tools to implement the hybrid recipe; and obtaining a hybrid measurement of the feature in accordance with the hybrid recipe.

Abstract: In order to test the integrity of products in containers, several characteristics of the products are detected with physical measuring methods and a good-bad signal is produced on the basis of the measuring results, for which purpose several of the measuring results are placed in relation to each other, which can consist in the following: the deviations of the individual measuring results from a reference value, optionally after weighting and standardization are added up and the sum is compared to a threshold value. The measuring results can also form a multidimensional area in which one or several boundary surfaces separate the good value areas from the bad value areas.

Abstract: A system and method for computerized grading of the cut of a gemstone. The system includes a gemstone model and an illumination model. The gemstone model defines the cut of the gemstone in three dimensions with reference to the facets of the gemstone. The illumination model defines light projected onto the gemstone. The method includes the steps of determining a beam of light refracted into the gemstone from the illumination model for at least one of the facets, tracing reflections of the beam of light within the gemstone, and measuring at least one light beam refracted out of the gemstone model. The measurements of the refracted light are used to evaluate the gemstone.