Abstract: A collaborative data transferring process can combine segments from all known servers and peer-to-peer (P2P) sources simultaneously, regardless of their native protocols. The process uses variable data block size that can be dynamically selected according to sizes provided by sources, e.g., according to the protocol of the source, and can generate hash values or validation codes on the fly so that compliance with validation techniques (if any) of other protocols is not required. The process may be classified as a P2P protocol, although it also contains centralized elements. Machine language implementations and low syntax overhead allow file exchanges over a homogeneous network with high throughput and low bandwidth consumption.

Abstract: Systems and methods use cyclical propellers with dynamic blade angle control to extract power from waves. A control system for such implementations can adapt pitching schedules for the blades of the cyclical propellers for efficient energy extraction and/or to control reactive forces. The cyclical propellers may be installed on the floor of a body of water or other liquid, on a submarine, or on a surface float, and blades may extend vertically or horizontally depending on the character of the waves. Several cyclical propellers can be combined into a single unit operated to minimize net reactive force or torque, to propel the unit horizontally or vertically, and/or to stabilize the unit. Such units can be installed with minimal or no moorings.

Abstract: An optoelectronic timing system includes an adaptive frequency generator system in which optical pulses are developed by a semiconductor laser. The pulses are directed into a number of time-quantifiable optical paths. Time quantification for a pulse is based upon the time required for a pulse to travel a particular length at the speed of light. Pulses are recombined at a nodal point and exhibit a numerical relationship with the periodicity of the issued pulse train equal to the numerical relationship between the lengths of the number of optical waveguides. A pulse detector and a regenerator are coupled to the semiconductor laser. A regeneration waveguide having a length equal to the longest of the optical paths is coupled to receive pulses from the laser.

Abstract: Systems and methods permit use of efficient solid state emitters for broad spectrum continuous spectrum lighting defined by illumination data. The illumination data, which can be sold as a commercial product, can be recorded or authored and include spectral, temporal, and spatial information. Intensities of individual emitters such as LEDs can be controlled through a combination of pulse width modulation (PWM) and amplitude modulation (AM) of drive currents. The combination of PWM and AM permits fine tuning of the spectrum of emissions and creation of free space optical data channels.

Abstract: Address books, activity logs, or similar data that are normally prepared by people for purposes other than rating businesses can be parsed and processed to rate businesses without requiring users to complete reviews. As a result, a large amount of rating data is available and may provide business ratings and rankings that are more complete and statistically accurate. A local search site can provide users with lists of businesses with rankings or ratings based on community preferences as reflected in user data and activity logs.

Abstract: Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate.

Abstract: Continuous wave laser diodes are able to be operated so as to achieve a high power pulsed output by operationally exercising them using a subnanosecond input pulse having an IV (power) amplitude characteristic at or exceeding a particular derived power (IV) threshold. Injection current on the order of 1 Amp and an operational voltage in the range of 4 Volts causes a CW laser to define a pulsed output in the 200 mV to 500 mV range. CW lasers having these output characteristics are coupled to mathematically defined branched pathways in order to construct an optical timing device relying on optical pulses traversing optical pathways at the speed of light. Pathway length is precisely controlled in order to define timing intervals relying solely on an optical path length and a known traversal speed.

Abstract: A propeller having one or more blades eccentrically mounted to a shaft dynamically changes the blade pitch to produce free vortices in a fluid. For extracting energy from a moving fluid, the fluid flow acting on the blades rotates the propeller, while the pitch changes create a fluid flow pattern known as a von Karman vortex street. The resulting time averaged flow field distant from the propeller is a wake flow, and the energy of the fluid flow can be efficiently converted to rotation of a shaft driven device. For propulsion, applied shaft rotation and the dynamic pitch change in a fluid together create a flow pattern that is the inverse of the von Karman vortex street. For either energy extraction or propulsion, the propeller is particularly suited for low flow speeds, where the effects of low Reynolds number induced flow separation on blades may make other propellers inefficient.

Abstract: In a trench-gated MOSFET including an epitaxial layer over a substrate of like conductivity and trenches containing thick bottom oxide, sidewall gate oxide, and conductive gates, body regions of the complementary conductivity are shallower than the gates, and clamp regions are deeper and more heavily doped than the body regions but shallower than the trenches. Zener junctions clamp a drain-source voltage lower than the FPI breakdown of body junctions near the trenches, but the zener junctions, being shallower than the trenches, avoid undue degradation of the maximum drain-source voltage. The epitaxial layer may have a dopant concentration that increases step-wise or continuously with depth. Chained implants of the body and clamp regions permits accurate control of dopant concentrations and of junction depth and position. Alternative fabrication processes permit implantation of the body and clamp regions before gate bus formation or through the gate bus after gate bus formation.

Abstract: A radiation detector can perform both rate and dose measurements for personal safety and also to provide measurements that are sufficiently sensitive for security applications. In one embodiment, a radiation detector has a first measurement channel and a second measurement channel, where the second measurement channel can measure radiation at levels that would saturate the first measurement channel. The detector can automatically switch between the high and low sensitivity channels while continuously integrating the measured rates to determine a radiation dose. The detector can also conserve power by automatically shutting off the unused measurement channel and still give a personal safety warning when the radiation rate or the dose reaches respective alarm thresholds.

Abstract: A multi-edge snowboard includes multiple boards with attached bindings. A pivot mechanism that connects the bindings to the boards rotates each board, so that each board can provide an active edge that engages the snow during turning or stopping. The increase in the number of active edges relative to a conventional snowboard improves the performance of the multi-edge snowboard, while the binding structure retains the feel of a conventional snowboard.

Abstract: A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding pads together, the ESD protection circuitry and/or the MOSFET can be separately tested. A voltage higher than functioning ESD protection circuitry would permit can be used when testing the MOSFET. A packaging process such as wire bonding or attaching the die to a substrate in a flip-chip package can connect the bonding pads after testing.

Abstract: Power MOSFETs and fabrication processes for power MOSFETs use a continuous conductive gate structure within trenches to avoid problems arising from device topology caused when a gate bus extends above a substrate surface. The gate bus trench and/or gate structures in the device trenches can contain a metal/silicide to reduce resistance, where polysilicon layers surround the metal/silicide to prevent metal atoms from penetrating the gate oxide in the device trenches. CMP process can remove excess polysilicon and metal and planarize the conductive gate structure and/or overlying insulating layers. The processes are compatible with processes forming self-aligned or conventional contacts in the active device region.

Abstract: A probing system for electrical testing of a semiconductor device uses a probe device including probe tips on a surface of a semiconductor die. The probe tips can be fabricated as metal bumps on contact pads having a pattern that is the same as the pattern of contact pads on the semiconductor device. The semiconductor die can provide the probe device with substantially the same thermal properties as the semiconductor device, so that the same probe can be used for testing over a broad temperature range. Further, the probe device can be fabricated using semiconductor device fabrication techniques, so that probe designs can scale down as device fabrication techniques move to smaller dimensions.

Abstract: A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding pads together, the ESD protection circuitry and/or the MOSFET can be separately tested. A voltage higher than functioning ESD protection circuitry would permit can be used when testing the MOSFET. A packaging process such as wire bonding or attaching the die to a substrate in a flip-chip package can connect the bonding pads after testing.

Abstract: An oxygen sensor includes a solid polymer electrolyte, e.g., on an acid treated Nafion membrane and uses a diffusion-limited fuel cell type reactions. The sensor avoids electrolyte leakage and avoids consumption of electrodes. In different configurations, a counter or reference electrode can be on the same or the opposite side of the electrolyte as a sensing electrode. An insert limits and controls oxygen diffusion into a sensing chamber containing the sensing electrode that catalyzes reduction of oxygen. Applying appropriate bias voltages to the reference and sensing electrodes causes an output current of the sensing electrode to be proportional to the rate of oxygen consumption based on Frick's law under a diffusion-limited mode. The output current can be measured, e.g., using a resistor to convert the current to a voltage signal.

Abstract: One embodiment of the present invention is a method for fabricating a structure useful for testing circuits that includes steps of: (a) aligning a first side of a connector-holder comprised of electrical connectors having retractable ends that are extendable out of the first side of the connector-holder and having retractable ends that are extendable out of a second side of the connector-holder with a substrate; and (b) connecting ends extendable out of the first side to pads on the substrate to form the structure.

Abstract: Preprocessing audio data to generate parameters associated with time scaling reduces the processing power required for real-time time scaling of the audio data. An augmented audio data structure includes the audio data and the parameters. The parameters for a frame of the audio data can identify best match blocks for time scaling or represent a plot of offset versus time scale that can be interpolated to determine an offset. The real-time time scaling uses the blocks that the parameters identify instead of performing a search for the best matching blocks. The parameters can also indicate which of the frames represent silence and can be scaled differently from frames that do not represent silence.

Abstract: Packaging processes and structures provide thin-film interconnects for high performance signal transmission of high frequency signals. The thin-film interconnects can be formed on a carrier that is at least partly removed for formation of terminals such as a BGA connected to the thin-film interconnects. Removal of the carrier can leave a frame for handling of the thin-film interconnects during subsequent processing. The thin film interconnects can be used to route signals to external terminals, between dies, or between functional units within a die. This allows the dies to contain fewer routing layers and allows configuration of a device such as an ASIC during packaging. A coarser pitch interconnect structure can be fabricated on the carrier using different technology for power and ground management and/or in a core that attaches to the thin-film package structure.

Abstract: A gear-forming cutter for forming a gear tooth on a non-metallic blank includes a spindle and a blade portion. The blade portion extends from the spindle along an axis of the spindle, and includes a blade surface and a surrounding surface. The blade surface has front and rear sides, and opposite first and second lateral sides. The surrounding surface is disposed around the axis, and extends from the first lateral side to the second lateral side. Any point of the first lateral side is spaced apart from the axis by a first radial distance. Any point of the second lateral side is spaced apart from the axis by a second radial distance smaller than the corresponding first radial distance. The first radial distance corresponding to the rear side is larger than that corresponding to the front side.