Abstract: A system having a filter is disclosed. One embodiment includes at least two polyphase filter branches, each of the polyphase filter branches including a respective recursive allpass filter, wherein the filter approximates a linear filter.

Abstract: A power semiconductor module including a contact element. One embodiment provides an electrically conductive contact element extending in a longitudinal direction and having a first end and a second end lying opposite the first end. The contact element has a first flange at its first end. The first flange is embodied such that when the contact element is placed with the first flange ahead onto a plane perpendicular to the longitudinal direction, the first flange has with the plane a number of first contact areas spaced apart from one another.

Abstract: A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 ?m.

Abstract: An integrated circuit includes an array of memory cells and a doped semiconductor line formed in a semiconductor substrate. The doped semiconductor line is coupled to a row of memory cells. The integrated circuit includes conductive cladding contacting the doped semiconductor line.

Abstract: An apparatus includes a shaft and a first code ring including a first number of pole pairs. The first code ring is attached to the shaft. The apparatus includes a second code ring including a second number of pole pairs different from the first number. The second code ring is attached to the shaft and spaced apart from the first code ring. The apparatus includes a first magnetic field sensor between the first code ring and the second code ring for sensing a first superposition of magnetic fields provided by the first code ring and the second code ring.

Abstract: An implantable medical device for delivering a therapeutic substance including a housing and a volume sensor assembly. The housing includes a stationary wall and maintains a reservoir containing the therapeutic substance and including a base wall movable relative to the stationary wall such that reservoir volume is a function of a spacing between the base wall and the stationary wall. The volume sensor assembly includes a cap, a shaft, a target, and circuitry. The cap defines a passage extending from an open end, and is mounted to the stationary wall such that the open end is open relative to a stationary wall inner face. The shaft has a first end attached to the base wall and a second end maintaining the target otherwise movably arranged within the passage. The circuitry generates information indicative of a longitudinal position of the target relative to the cap, and thus of the reservoir volume.

Abstract: An integrated circuit includes a first transistor having a first gate and a first source and a second transistor having a second gate and a second source. The integrated circuit includes a first source contact adjacent the second transistor and coupled to the first source and the second source. The integrated circuit includes a first bond wire coupled to the first source contact.

Abstract: A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carrier sheet, and thereafter, selectively etching a second surface of the lead frame material sheet, the second surface being opposite to the first surface.

Abstract: A memory cell includes a first electrode, a second electrode, and phase change material between the first electrode and the second electrode. The phase change material has a step-like programming characteristic. The first electrode, the second electrode, and the phase change material form a via or trench memory cell.

Abstract: A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element.

Abstract: A food dispensing machine includes a product chamber with a dispensing valve connected to the product chamber and having an outlet through which a product contained in the product chamber is dispensed. The product chamber has a cleaning solution inlet connectable to a cleaning solution supply source for receiving cleaning solution into the product chamber. The product chamber further has an ingredient inlet alternatively connectable to either an ingredient supply source or the dispensing valve outlet. When the ingredient inlet is connected to the dispensing valve outlet, a re-circulating flow path is created, allowing for complete cleaning and sanitizing of the product flow path.

Abstract: A tire sensor system includes a first sensor and a second sensor spaced apart from the first sensor. The first and second sensors are mounted to a tire. A processor receives input signals from the first and second sensors, and is programmed to determine the length of a contact patch of the tire in response to the input signals.

Abstract: In a method for controlling the data flow on a radio link between a WLAN base station and a WLAN mobile station, the data rate on the radio link is reduced for in each case one time period (36, 37) at time intervals (35). One preferred field of application for the method is to restrict general or unauthorized transmission of a telephone call via the Internet.

Abstract: A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip.

Abstract: A Semiconductor component having a space saving edge structure is disclosed. One embodiment provides a first side, a second side, an inner region, an edge region adjoining the inner region in a lateral direction of the semiconductor body, and a first semiconductor layer extending across the inner region and the edge region and having a basic doping of a first conductivity type. At least one active component zone of a second conductivity type, which is complementary to the first conductivity type, is disposed in the inner region in the first semiconductor layer. An edge structure is disposed in the edge region and includes at least one trench extending from the first side into the semiconductor body. An edge electrode is disposed in the trench, a dielectric layer is disposed in the trench between the edge electrode and the semiconductor body, a first edge zone of the second conductivity type adjoin the trench and are at least partially disposed below the trench.

Abstract: A self-propelled vehicle comprises a frame and a platform pivotally mountable to a rear portion of the vehicle frame. The platform is pivotally movable between a first position in which the platform extends generally horizontally from the rear portion of the frame to support a rider during operation of the vehicle, and a second position in which the platform is removably secured in a generally upright position adjacent the rear portion of the frame to enable walk-behind operation of the vehicle.

Abstract: An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 ?m. A first thermally conductive layer is applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K). A second electrically insulating layer is applied over the first thermally conductive layer and having a thickness of less than 100 ?m.

Abstract: A coating composition including a compound having a first molecular group or a first combination of atoms, the first molecular group or the first combination of atoms capable of bonding to an oxidizable metal or a metal oxide, and a second molecular group or a second combination of atoms, the second molecular group or the second combination of atoms capable of interacting with a precursor of a polymer so the compound and the polymer are bound together.

Abstract: Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is removed. The first semiconductor chip is removed from the first body. The second body is attached to the first body. The first metal layer is electrically coupled to the second metal layer.

Abstract: A wall assembly includes a wall frame, a trough, a moisture transport spacer coupled to the wall frame and providing a substantial barrier to the passage of air and moisture vapor through the wall assembly, a moisture wicking sheet disposed at a bottom of the wall frame and extending from the moisture transport spacer to the trough, and an air seal disposed between the moisture wicking sheet and the bottom of the wall frame. The trough communicates with a dynamic ventilation system configured to remove moisture collected in the trough.