Patents Represented by Attorney Dicke, Billig & Czaja, PLLC

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  • Method of fabricating a semiconductor device
    Patent number: 8119452
    Abstract: One method includes fabricating a semiconductor device including providing a dielectric layer. At least one semiconductor chip is provided defining a first surface including contact elements and a second surface opposite to the first surface. The semiconductor chip is placed onto the dielectric layer with the first surface facing the dielectric layer. An encapsulant material is applied over the second surface of the semiconductor chip in a reel-to-reel process.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: February 21, 2012
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Irmgard Escher-Poeppel
  • Bipolar semiconductor device and manufacturing method
    Patent number: 8120074
    Abstract: A bipolar semiconductor device with a hole current redistributing structure and an n-channel IGBT are provided. The n-channel IGBT has a p-doped body region with a first hole mobility and a sub region which is completely embedded within the body region and has a second hole mobility which is lower than the first hole mobility. Further, a method for forming a bipolar semiconductor device is provided.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: February 21, 2012
    Assignee: Infineon Technologies Austria AG
    Inventors: Hans-Joachim Schulze, Francisco Javier Santos Rodriguez
  • Transistor
    Patent number: 8120135
    Abstract: A transistor has a cell array with two or more transistor cells, a temperature sensor, which is integrated in the cell array or is adjacent to the cell array, and an isolation structure. The isolation structure isolates the temperature sensor from the cell array, and has an isolation trench, which is arranged between the cell array and the temperature sensor. The distance between the temperature sensor and the active transistor cell that is closest to the temperature sensor corresponds approximately to the pitch between active transistor cells within the cell array.
    Type: Grant
    Filed: February 11, 2010
    Date of Patent: February 21, 2012
    Assignee: Infineon Technologies AG
    Inventors: Norbert Krischke, Nicola Vannucci, Sven Lanzerstorfer, Thomas Ostermann, Mathias Racki, Markus Zundel
  • Multiple projector image overlay systems
    Patent number: 8118435
    Abstract: A display system for providing enhanced brightness projected images from a micro-projector. The system includes at least two micro-projector display devices, one or more sensors, and a controller. The sensors provide information to the controller indicative of the micro-projector display devices having been placed in proximity to each other to project identical images, the controller further being programmed to determine from information generated by the sensors their alignment and maximize cooperative pixel alignment between multiple images generated by the micro-projector display devices by offsetting a center of an image in one or more of the projector devices.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: February 21, 2012
    Inventor: David W. Carroll
  • Integrated circuit including an ECC error counter
    Patent number: 8122320
    Abstract: An integrated circuit includes a memory array and an error correction code (ECC) circuit configured to provide a first signal indicating whether data read from the memory array has been corrected by the ECC circuit. The integrated circuit includes a mimic circuit configured to provide a second signal indicating whether the first signal is valid and a counter configured to increment in response to the second signal indicating the first signal is valid and the first signal indicating an error.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: February 21, 2012
    Assignee: Qimonda AG
    Inventors: Khaled Fekih-Romdhane, Peter Chlumecky
  • Vaginal speculum including collapsible and expandable frame
    Patent number: 8118738
    Abstract: A vaginal speculum includes a frame and a first handle assembly pivotally mounted to the frame. The frame defines an opening between a first blade that is attachable to the frame and a second blade that is attachable to the frame opposite of the first blade, and a hinge assembly configured to flex the frame to selectively change a size of the opening. The first handle assembly includes a lever portion and a blade portion coupled to the lever portion. The blades have a proximal end attachable to the blade portion and a distal end portion spaced from the proximal end. When in a first collapsed insertion state, the hinge assembly collapses the frame and the first blade contacts the second blade. When in a second deployed state the hinge assembly expands the frame and the first blade is spaced apart from the second blade.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: February 21, 2012
    Inventor: Daniel Larkin
  • Integrated circuit having a material structured by a projection
    Patent number: 8115277
    Abstract: A method of making an integrated circuit including structuring a material. The method includes providing an arrangement of three-dimensional bodies. The material is arranged between the bodies and structured directed radiation. The projection pattern of the three-dimensional bodies is transferred into the material. The structured material connects at least two of the three-dimensional bodies.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: February 14, 2012
    Assignee: Qimonda AG
    Inventor: Johannes Von Kluge
  • Integrated circuit
    Patent number: 8116157
    Abstract: An integrated circuit is disclosed. One embodiment provides a sense amplifier; a first bit line; a second bit line. A first switch is configured to connect/disconnect the first bit line to/from the sense amplifier. A second switch is configured to connect/disconnect the second bit line to/from the sense amplifier independently from the first switch.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: February 14, 2012
    Assignee: Qimonda AG
    Inventors: Michael Bruennert, Harald Roth
  • Integrated circuit device with a semiconductor body and method for the production of an integrated circuit device
    Patent number: 8114743
    Abstract: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: February 14, 2012
    Assignee: Infineon Technologies Austria AG
    Inventors: Uli Hiller, Oliver Blank, Ralf Siemieniec, Maximilian Roesch
  • Batting aid device having automatic ball feed
    Patent number: 8113970
    Abstract: An automatic feed mechanism for use with a batting aid device having a first end configured to receive a ball and a second end configured to drop the ball from the batting aid device. The automatic feed mechanism includes a substantially enclosed tubular member configured to receive a ball from the batting aid device and defining an internal support surface configured to support the ball, a wheel coupled to and positioned at least partially within the tubular member and having a rotational axis orientated substantially perpendicular to a longitudinal extension of the tubular member, and a motor configured to rotate the wheel at least a portion of a full rotation; wherein as the wheel rotates, the wheel is configured to engage and advance the ball through the tubular member in a direction from the first end toward the second end of the batting aid device.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: February 14, 2012
    Inventors: Donald Mauer, Gregory Knutson, James Mauer
  • Block mold having moveable liner
    Patent number: 8113815
    Abstract: A mold assembly for manufacturing dry-cast concrete blocks in an automated dry-cast block machine, the mold assembly a plurality of liner plates forming at least one mold cavity, each liner plate corresponding to a perimeter side of the mold cavity, wherein at least one of the liner plates is moveable toward and away from an interior of the mold cavity. A master drive element is routed about at least a portion of the perimeter sides of the mold cavity, including the perimeter side corresponding to the at least one moveable liner plate, and forming a continuous loop, wherein the master drive element is configured to be driven back and forth about the loop to provide a first linear force in a first direction and a second linear force in a second direction opposite the first direction substantially in parallel with each perimeter side along which the master drive element is routed.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: February 14, 2012
    Assignee: Ness Inventions, Inc.
    Inventors: John T. Ness, Jeffrey A. Ness
  • Integrated circuit device and method of producing
    Patent number: 8116102
    Abstract: An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and a semiconductor chip attached to the lead frame.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: February 14, 2012
    Assignee: Infineon Technologies AG
    Inventors: Chee Peng Wong, Tiam Sen Ong, Guan Choon Tee
  • Semiconductor device
    Patent number: 8110912
    Abstract: A method of manufacturing a semiconductor device includes providing a foil formed of an insulating material, where the foil includes at least one electrically conducting element, providing a chip having contact elements on a first face of the chip, and applying the foil over the contact elements of the chip.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Manfred Mengel, Joachim Mahler
  • System having a pulse width modulation device
    Patent number: 8111845
    Abstract: A system, a device and a method for pulse width modulation is disclosed. One embodiment includes a pulse width modulation device, a first pulse width modulation mapper for pulse width modulation of a data signal, or a signal derived therefrom, and a second pulse width modulation mapper for pulse width modulation of a reference signal, or a signal derived therefrom. In one or more embodiments, the data signal e.g., can be a signal for a mono audio channel, or a signal for a stereo audio channel. The reference signal can be a signal including a constant signal level or a signal including a non-constant signal level an offset signal.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventor: Christoph Braun
  • Power semiconductor component with a low on-state resistance
    Patent number: 8110868
    Abstract: A semiconductor component having a semiconductor body is disclosed. In one embodiment, the semiconductor component includes a drift zone of a first conductivity type, a drift control zone composed of a semiconductor material which is arranged adjacent to the drift zone at least in places, a dielectric which is arranged between the drift zone and the drift control zone at least in places. A quotient of the net dopant charge of the drift control zone, in an area adjacent to the accumulation dielectric and the drift zone, divided by the area of the dielectric arranged between the drift control zone and the drift zone is less than the breakdown charge of the semiconductor material in the drift control zone.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies Austria AG
    Inventors: Frank Dieter Pfirsch, Armin Willmeroth, Anton Mauder, Stefan Sedlmaier
  • Systems and methods for surgical removal of tissue
    Patent number: 8109956
    Abstract: A method for treating a body tissue comprises delivering a cutting mechanism of a surgical instrument into proximity to a target portion of the body tissue wherein the cutting mechanism includes a first member defining a lumen and a distal cutting tip. At least the first member is supported, via a coupler, by the handpiece. A fluid pathway extends from the distal cutting tip, through the lumen of the first member, and through an interior of the handpiece for fluid connection to a source of negative pressure. In one configuration, a coupler provides an internally-located aspiration control mechanism including a user interface port exteriorly exposed on the coupler and defining an aspiration control pathway extending from the user interface port to a proximal window of the inner member for communication with the lumen of the inner member.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: February 7, 2012
    Assignee: Medtronic Xomed, Inc.
    Inventor: Louis M. Shadeck
  • Semiconductor device including isolation layer
    Patent number: 8110906
    Abstract: A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl
  • Magnetic sensor integrated circuit device and method
    Patent number: 8106654
    Abstract: An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: January 31, 2012
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Helmut Wietschorke
  • Mixed wire semiconductor lead frame package
    Patent number: 8105932
    Abstract: One embodiment includes an encapsulated semiconductor package having a lead frame with die pad surrounded by a plurality of first and second leadfingers. A semiconductor chip including chip contact pads on its upper active surface is attached to the die pad. A plurality of first bond wires, including a first electrically conductive material, extend between the chip contact pads and the plurality of first leadfingers. A plurality of second bond wires, including a second electrically conductive material, extend between a chip contact pad and a second leadfinger. The semiconductor package further includes a plurality of electrically conducting means attached to the second leadfingers.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: January 31, 2012
    Assignee: Infineon Technologies AG
    Inventors: Jenny Ong Wai Lian, Chen Wei Adrian Chng
  • LED-based light
    Patent number: D654602
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: February 21, 2012
    Assignee: Forever Bulb, LLC
    Inventors: David W. Carroll, Wendell Carroll