Abstract: One aspect of the invention relates to a method of supplying power to a sensor arrangement including a first sensor and at least one second sensor which in each case have a first and a second supply terminal, and which can be operated in a first and a second operating mode. The first and at least one second sensor can be connected via their supply terminals to a voltage supply arrangement in the first operating mode. The first and at least one second sensor can be connected in series with one another via their supply terminals in the second operating mode and the series circuit with the first and at least one second sensor is connected in series with a current source.

Abstract: A method of detecting a carrier signal includes generating a first signal that represents a strength of a received signal. A variable threshold signal is generated based on the first signal. A fixed threshold signal is generated. The method includes detecting whether a carrier signal is present in the received signal based on a comparison of the first signal with a sum of the variable threshold signal and the fixed threshold signal.

Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Abstract: A system for punching one or more patterns selected from a plurality of related patterns into a workpiece (typically paper or similar materials). The system comprises a punch element having a plurality of cutting surfaces arranged at discrete heights relative to each other, and a means for selecting a discrete distance that the punch element travels through the workpiece.

Abstract: Method and device for transmitting outgoing useful signals and an outgoing clock signal. Useful signals and a clock signal are transmitted from a transmitter via a first line pair and a second line pair to a receiver. A first useful signal is transmitted in the form of a modulated difference between the electrical potentials of the first line pair. A second useful signal is transmitted in the form of a modulated difference between the electrical potentials of the second line pair. The clock signal is transmitted in the form of a modulated difference between the average value of the potentials of the first line pair and the average value of the potentials of the second line pair.

Abstract: An integrated circuit comprising an array of memory cells and a corresponding production method are described. Each memory cell comprises a resistively switching memory element and a vertical selection diode coupled to a selection line in a selection line trench for selecting one cell from the plurality of memory cells. A selection line is coupled to the vertical selection diode at one vertical sidewall of the selection line trench.

Abstract: A mold assembly for molding concrete blocks including at least one mold cavity including a plurality of liner plates forming sides walls of the mold cavity, wherein at least one of the liner plates is moveable between an extended position and a retracted position relative to an interior of the mold cavity. The mold assembly further includes a linear actuator having an actuator axis, a first drive linkage coupled to the linear actuator, and a second drive linkage coupled to the first drive linkage and positioned off-axis of the actuator axis and in mechanical communication with the at least one moveable liner plate, wherein the linear actuator provides forces in opposite directions along the actuator axis to the first drive linkage to drive the second drive linkage toward and away from the interior of the mold cavity to direct movement of the at least one moveable liner plate between the extended and retracted positions.

Abstract: A transmitter circuit. One embodiment provides for emitting electromagnetic waves. The circuit has a transmitting device for outputting a transmission signal, an antenna device for emitting the transmission signal in the form of an electromagnetic wave, and a matching device which is electrically connected to the transmitting device and to the antenna device. The matching device includes at least two tuning elements for setting the resonant frequency of a circuit arrangement, formed from the antenna device and the first and second tuning elements, and for matching the impedance of the transmitting device and the antenna device.

Abstract: A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An encapsulation body encapsulates the semiconductor chip and defines a second main surface. An array of external contact pads attaches to the second main surface of the encapsulation body, and at least one external contact pad of the array of external contact pads electrically couples to the ring-shaped metal structure.

Abstract: A power transistor includes a first terminal, a second terminal and a control terminal. A support layer is formed of a first material having a first bandgap. An active region is formed of a second material having a second bandgap wider than the first bandgap, and is disposed on the support layer. The active region is arranged to form part of a current path between the first and second terminal in a forward mode of operation. The active region includes at least one pn-junction.

Abstract: A device including a semiconductor chip and metal foils. One embodiment provides a device including a semiconductor chip having a first electrode on a first face and a second electrode on a second face opposite to the first face. A first metal foil is attached to the first electrode of the semiconductor chip in an electrically conductive manner. A second metal foil is attached to the second electrode of the semiconductor chip in an electrically conductive manner.

Abstract: An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.

Abstract: A method of fabricating an electrical contact through a through hole in a substrate, wherein the through hole is at least in part filled with a liquid conductive material and the solidified liquid conductive material provides an electrical contact through the through hole.

Abstract: The Examiner objected to the abstract of the disclosure because it contains the phrase “comprising.” The Abstract does not include the phrase “comprising,” however, please amend the abstract as follows: An integrated circuit having a semiconductor component arrangement and production method is disclosed. The integrated circuit as described includes an oxide layer region is provided as a protection against oxidation in the edge region on the surface region of an underlying semiconductor material region.

Abstract: A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 ?m. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.

Abstract: An integrated circuit and method of fabricating an integrated circuit. One embodiment includes a circuit chip, a contact pad, and a projecting top contact. A signal line couples the contact pad to the projecting top contact, the contact pad, the projecting top contact. The signal line is arranged on a top face of the circuit chip. A substrate and a lower contact pad, the lower contact pad is arranged on a bottom face of the substrate and the circuit chip is arranged on a top face of the substrate. A bottom face of the circuit chip is facing the top face of the substrate. A connection couples the contact pad on the circuit chip to the lower contact pad.

Abstract: A pre-inked hand-held stamp includes a pair of outwardly positioned dust cover doors that are opened by movement of the internal components of the stamp during use.

Abstract: A circuit arrangement comprising a first semiconductor switching element, which has a load path and a drive terminal. A voltage supply circuit, is provided including an inductance connected in series with the load path of the first semiconductor switching element, and a capacitive charge storage arrangement, which is connected in parallel with the inductance and which has a first and a second output terminal for providing a supply voltage.

Abstract: A cable includes a first layer of wire helically wound to define a lumen having a lumen diameter. A second layer of wire is helically wound over the first layer. A first end segment of the second layer is configured with a plurality of strands that are fused together. A second end segment of the second layer is configured with a plurality of strands that are fused together.