Abstract: A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto. The printed wiring board and electronic components are placed in an outer shell made of lightweight stiff material. The spaces or voids between the outer shell and the printed wiring board and the electronic components are filled with lightweight filling material and thermal filler material. The outer shell and the filling material provide increased rigidity to the electronic components and the thermal filler material increases heat transfer from a given electronic component to outside the circuit card assembly.

Abstract: Line termination units having dual ports for accepting communication traffic of two different types facilitate the concurrent transmission of voice traffic, serial data traffic and packetized data traffic across a telecommunication transport system, such as a DSL (digital subscriber line) system. The bandwidth of the telecommunication transport system is allocated between the differing traffic types to permit the full utilization of the available bandwidth.

Abstract: An adaptor for dispensing a liquid into a container is provided. The adaptor includes a sleeve having an outer surface and an inner surface. The adapter also includes an opening passing through the outer surface and inner surface of the sleeve. The adapter further includes a pipe having a first and a second end, the first end attached to the opening. The adapter also includes a sealing lid removably disposed over the second end of the pipe.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: A monolithic 1.75 is mounted in a speaker cabinet 1.71 to drive the voice coil 1.74 of the speaker 1.70. The monolithic integrated circuit may be a class D amplifier 1.10, and is at least a half-bridge or full bridge power MOSFET device. Structures and process for forming the mos switching devices 2.20 of the bridge driver circuits are disclosed. Also disclosed is the N+ buried layer 4.14 of the QVDMOS transistors 4.43 of the bridge circuits.

Abstract: A method for controlling power consumption in a communication device is provided. The method includes powering down a receiver of the communication device for a selected period of time and, when the selected period of time expires, powering up the receiver to check for incoming data.

Abstract: The present invention relates to an integrated circuit having a sealed nitride layer. In one embodiment, a method of forming a sealing nitride layer overlaying a silicon oxide layer in a contact opening of an integrated circuit is disclosed. The method comprises, forming a second layer of nitride overlaying a first layer of nitride to form the sealing nitride layer. The second layer of nitride further overlays an exposed portion of a surface of a substrate in the contact opening and sidewalls of the contact opening. Using reactive ion etching (RIE etch) without a mask to remove a portion of the second nitride layer adjacent the surface of the substrate in the contact opening to expose a portion of the surface of the substrate in the contact opening without removing portions of the second nitride layer covering the sidewalls of the contact opening.

Abstract: The communication system includes a hybride fiber/coax distribution network. A head end provides for downstream transmission of telephony and control data in a first frequency bandwidth over the hybrid fiber/coax distribution network and reception of upstream telephony and control data in a second frequency bandwidth over the hybrid fiber/coax distribution network. The head end includes head end multicarrier modem for modulating at least downstream telephony information on a plurality of orthogonal carriers in the first frequency bandwidth and demodulating at least upstream telephony information modulated on a plurality of orthogonal carriers in the second frequency bandwidth. The head end further includes a controller operatively connected to the head end multicarrier modem for controlling transmission of the downstream telephony information and downstream control data and for controlling receipt of the upstream control data and upstream telephony information.

Abstract: A ring network for transporting data packets between network devices is provided. The ring network includes a number of ring switches. Each ring switch has at least one ring port, at least one local port and at least one table that self learns which network devices are associated with each port of the ring switch based on a selected source identifier from the packets processed by the ring switch. The source and destination identifiers may, for example, be a media access control (MAC) address from an Ethernet packet, an Internet Protocol (IP) address, at least a portion of a hierarchical address, a combination of two or more identifiers at different protocol levels for the data packet, a port number of a universal datagram protocol, or other appropriate identifier. The at least one ring port of each ring switch is coupled to a ring port of another ring switch in the ring network.

Abstract: Backside failure analysis of integrated circuits. In one embodiment, a method of preparing a device under test (DUT) for an image based diagnostic testing is disclosed. The method comprises removing a portion of the backside package of the DUT to allow for the implementation of an image based diagnostic test through the backside of the DUT. The functionality of DUT is destroyed by the removal of the portion of the backside package of the DUT. Further, restoring the functionality of the DUT with an interface carrier before an image based diagnostic test is conducted.

Abstract: An apparatus to filter noise from being induced into a power line. In one a ferrite choke is disclosed that filters noise from being induced into a power line. The ferrite choke includes a tube of ferrite, a supply power line and a return power line. The tube of ferrite is made of a single piece of ferrite. The supply power line is received inside the tube of ferrite and the return power line is also received inside the tube of ferrite.

Abstract: A bonded semiconductor-on-insulator substrate for an integrated circuit. The bonded semiconductor-on-insulator substrate includes a wafer, a handle wafer and an insulating bond layer. The wafer has a first layer of monocrystalline semiconductor material adjacent a first surface of the wafer. The wafer also has a second layer of undamaged by implantation monocrystalline semiconductor material adjacent a second surface of the wafer. The wafer further has a substantially planar intrinsic gettering zone of substantially pure semiconductor material and active gettering sites positioned between the first and second layers formed by implanting ions of the semiconductor material through the first layer of monocrystalline semiconductor material. The insulating bond layer bonds the handle wafer to the first surface of the wafer.

Abstract: A bit error rate or other performance characteristic of a communication link is monitored using a state machine. The state machine includes at least three states — for example, a NO ALARM state, an ALARM DETECTION state, and an ALARM state. A sliding window is used to determine when to transition from the ALARM DETECTION state to the NO ALARM state or the ALARM state. A sliding window is also used to determine when to transition from an ALARM state to a NO ALARM state. A respective sum is calculated as a function of the sliding window for use in making such determinations.

Abstract: The present invention relates to an integrated circuit having a MOS capacitor. In one embodiment, a method of forming an integrated circuit comprises forming an oxide layer on a surface of a substrate, the substrate having a plurality of isolation islands. Each isolation island is used in forming a semiconductor device. Patterning the oxide layer to expose predetermined areas of the surface of the substrate. Depositing a nitride layer overlaying the oxide layer and the exposed surface areas of the substrate. Implanting ions through the nitride layer, wherein the nitride layer is an implant screen for the implanted ions. Using the nitride layer as a capacitor dielectric in forming a capacitor. In addition, performing a dry etch to form contact openings that extend through the layer of nitride and through the layer of oxide to access selected device regions formed in the substrate.

Abstract: A communication system is provided. The communication system includes a host unit that is adapted to communicate wireless telephony signals with a telephony network and adapted to communicate wireless data with at least one data network. A communication link carries both the wireless telephony signals and the wireless data. At least one remote antenna unit is communicatively coupled to the host unit over the communication link. The remote antenna unit communicates the wireless telephony signals and the wireless data with wireless terminals. The at least one remote unit further communicates digitized telephony signals and wireless data signals with the host unit over the communication link.

Abstract: A wireless distribution system includes a number of remote units distributed in a coverage area to receive wireless signals and to provide the signals through the distribution system to input ports of an expansion unit where the signals are combined, detectors operatively connected to one or more of the plurality of input ports to determine the presence of information carrying signals at the input ports, a number of selection circuits to select signals in which information has been detected, and a node to combine the selected signals.

Abstract: An optical distribution node is provided. The optical distribution node includes a laser transceiver that is coupleable to at least one fiber optic link. The optical distribution node communicates upstream and downstream digital data with the head end over the at least one fiber optic link. The optical distribution node further includes a data concentrator coupled to the laser transceiver. Further, for each of at least one coaxial cable link, the optical distribution node includes a frequency translator and a node modem. The frequency translator receives and translates the upstream digital data from modems on the at least one coaxial cable link to a different carrier to provide a signal to the modems on the at least one coaxial cable link for collision detection. The node modem is coupled between the coaxial cable link and the data concentrator. The node modem demodulates upstream digital data for the data concentrator and modulates downstream digital data for transmission over the coaxial cable link.

Abstract: The invention provides a device that can be used to record the motion of a wafer and fine perturbations and vibrations in its motion during its progress through and between semiconductor process and inspection machines in the course of the actual manufacturing process or during a test cycle of the processing or inspection machine. It also provides a system and a method which uses this record mechanical malfunction of the processing or inspection machine which has caused, or could cause, defects in the manufactured wafer whether directly or indirectly.

Abstract: A miniaturized body electronic implant for providing artificial vision to a blind person or for other uses as neuro-muscular sensors and microstimulators. The implant has a high resolution electrode array connected to a chip integrating implant stimulation and monitoring circuits, mounted on the back of the electrode array. The implant is powered by and communicates with an external unit through an inductive bi-directional link.

Abstract: A chip capacitor that includes a first and second terminal and a plurality of first and second conductive plates. The first terminal has a first interfacial attachment area that is adapted to be attached to a host substrate. The second terminal has a second interfacial attachment area also adapted to be attached to a host substrate. The first interfacial attachment area and the second interfacial attachment area separated by at least one relatively thin isolation strip such that the first and second interfacial attachment areas generally approach covering the entire attaching area of the chip capacitor. The plurality of first conductive plates are coupled to the first terminal and the plurality of second plates are coupled to the second terminal. In one embodiment, approximately 50% of the periphery of each first and second conductive plate is coupled to the respective first and second terminals.