Abstract: An electronics enclosure is provided. The enclosure includes a cylindrical body, one or more modular card cages adapted to receive one or more electronic circuit cards. The one or more modular card cages including an outer frame member in direct physical and thermal contact with an inner wall of the cylindrical body, an inner frame member, one or more support members coupled between the outer frame member and the inner frame member, and a plurality of electronic device retainers adapted to couple to the modular card cage and hold each of the one or more electronic circuit cards in direct physical and thermal contact with one of the one or more support members. The support members provide an isolated heat dissipation path for heat, produced by each of the one or more electronic circuit cards, to be removed from the enclosure.

Abstract: There is provided a complex frequency response filter providing a frequency response having a desired shape. A first complex frequency response filter includes a first and a second reflecting surfaces defining a resonant cavity therebetween. Each of the reflecting surfaces respectively has a predetermined surface finish providing a given reflectivity, therefore providing resonances with a predetermined shaped frequency response of a predetermined amplitude and of a predetermined periodicity. Those frequency responses can then be summed to generate an arbitrarily complex spectral response. In another embodiment, the complex frequency response filter includes a transmission medium and a first and a second reflecting surfaces defining a resonant cavity therebetween.

Abstract: A communication system. The communication system communicates to a number of subscribers. The communication system includes a number of communication circuits which are disposed to divide a region into communication areas. Each communication circuit communicates using a first polarization in a first portion of its communication area and communicates using a second, different polarization in a second portion of its communication area. Additionally, adjacent portions of the communication areas of the communication circuits use the same polarization.

Abstract: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

Abstract: Disclosed is a method of storing data for temporarily storing a plurality of detected data in a data buffer or the like included in a radar used for a vehicle. The radar detects signals reflected from a plurality of target objects so as to obtain a plurality of detected data, and detects the presence of the plurality of target objects on the basis of the plurality of detected data.

Abstract: A system and method for protection of virtual connections at the data link layer. The method provides for protection switching in a ring network. The method comprises detecting an error in one of a first and second routes (“the errored route”). Error cells are generated for each virtual connection affected by the detected error. Error cells are transmitted downstream on the errored route. First switch fabric receives the error cells at a downstream network element associated with the errored route. Change in state of the errored route is communicated to a second switch fabric of the downstream network element associated with the other of the first and second routes (the “other route”). When the state of the errored route is worse than the state of the other route, automatically configuring the second switch fabric to establish the other route to be a working route for the virtual connection.

Abstract: A receiver circuit for a tester for electronic devices is provided. The receiver circuit includes a clock receiver that is adapted to receive a source synchronous clock signal from a device under test. The receiver circuit further includes a data receiver that is responsive to the clock circuit. The data receiver is adapted to receive at least one differential data signal from the device under test. The receiver circuit also includes a trigger receiver that is responsive to the clock circuit. The trigger receiver is adapted to receive a trigger signal from the device under test. Finally, the receiver circuit includes a control circuit that is coupled to the trigger receiver. The control circuit is adapted to generate a start alignment capture signal based on the received trigger signal to initiate capture of data received at the data receiver for comparison with expected values.

Abstract: Cascade low-pass filters are useful in attenuating the xDSL band in a POTS splitter. The design of the low-pass filter is a sixth-order filter having two stages. A first stage includes a fourth-order filter, preferably with a stop-band frequency of approximately 48 kHz. A second stage includes a second-order filter in cascade with the fourth-order filter. For this filter, the stop-band frequency is preferably approximately 29 kHz. The inductance value of the second stage is relatively small in comparison to the inductance values of the first stage. In this manner, improvements in xDSL band attenuation are facilitated with little or no eroding of the voice band performance such as insertion loss, pass-band attenuation and return loss.

Abstract: A photonic crystal fiber comprising: a core (20) having a refractive index; and a cladding region (10) at least substantially surrounding the core (20) and comprising a bulk material having a second refractive index that is higher that the first refractive index, the bulk material containing an arrangement of elongate, longitudinal holes that comprise hole material of a third refractive index that is lower than the first refractive index; such that an electromagnetic mode guided in the core (20) has an evanescent wave that becomes more closely confined to the vicinity of the core (20) as the wavelength of the electromagnetic mode is increased over a first range of wavelengths.

Abstract: The present invention enables the self-diagnosis functionality by embedding a cable modem with the CMTS system with mechanisms to redirect the signals from external connections to the embedded cable modem, thereby enabling the end user to fully test the CMTS using a suite of diagnostic tests. The embedded cable modem integrates the external CM, computer and diagnostic software in the chassis, or alternatively onto the CMTS card in the chassis. The invention enables the end user to fully test the functionality as a stand-alone unit, without relying on any external test equipment or methods. It also enables the end user to diagnose the CMTS from a remote location. Another major advantage of the present invention is that it enables the CMTS/CM function to be verified over the entire physical layer parameter set (frequency, symbol rate, FEC, signal levels, etc.) while not interrupting any of the services that are on the ‘live’ HFC plant.

Abstract: A telecommunications network is provided. The network includes at least one service delivery unit having a data port and a network interface port and a memory that stores data for managing the telecommunications network. The network interface port is coupled to a switch fabric. The data port is coupleable to at least one local area network. A network management station is communicatively coupled to the service delivery unit. The at least one service delivery unit is configurable to allow the network management station to view selected portions of the data in the memory of the at least one service delivery unit to facilitate management of selected aspects of the service delivery unit.

Abstract: An input power sharing control circuit is provided. The control circuit includes a plurality of current limiting circuits each circuit adapted to receive power from one of a plurality of independent power sources, a power switching control circuit adapted to receive power from the plurality of independent power sources and provide a variable power output and a load coupled to the output of the power switching control circuit, wherein the value of the load impedance and the value of the voltage of the output power controls the variable power output.

Abstract: A network amplifier is provided. The network amplifier includes a variable equalizer having at least one control input and a variable attenuator having at least one control input. The network amplifier also includes at least one amplifier circuit that is coupled in series with the variable equalizer and the variable attenuator in a signal path of the network amplifier. The network amplifier also includes an automatic gain control circuit with a processor that monitors signals in the signal path and generates control signals for the control input of the variable equalizer and the control input of the variable attenuator to control at least one characteristic of the network amplifier.

Abstract: The present invention relates to an integrated circuit having a MOS capacitor. In one embodiment, a method of forming an integrated circuit comprises forming an oxide layer on a surface of a substrate, the substrate having a plurality of isolation islands. Each isolation island is used in forming a semiconductor device. Patterning the oxide layer to expose predetermined areas of the surface of the substrate. Depositing a nitride layer overlaying the oxide layer and the exposed surface areas of the substrate. Implanting ions through the nitride layer, wherein the nitride layer is an implant screen for the implanted ions. Using the nitride layer as a capacitor dielectric in forming a capacitor. In addition, performing a dry etch to form contact openings that extend through the layer of nitride and through the layer of oxide to access selected device regions formed in the substrate.

Abstract: A microcellular communications network includes a plurality of base station units and corresponding antenna units. The microcells connected to their respective base station units over a telephone system. The microcells providing received signal strength indication (RSSI) level signals and Supervisory, Audio Tone (SAT) frequencies to the base station for hand-in evaluation. The base stations having a scanning receiver for processing the RSSI level signals and SAT frequencies and for performing hand-in for neighboring cells.

Abstract: A fault warning system controls light sources and a warning signal to provide an indication of fatal and non-fatal faults in a communication system. The circuitry uses a pull-down circuit in electrical communication with light and signal control circuits. The circuit can be operated to activate a first light emitting diode (LED) if an operational status of a monitored circuit is either fatal or non-fatal fault. The circuit can be operated to deactivate a second LED if an operational status of a monitored circuit is fatal, and the second LED remains active if the operational status of the circuit is a non-fatal fault.

Abstract: A system and process for directly and flexibly switching connections of data packet flows between nodes of a broadband data processing system network. The system acts as a single IP switch.

Abstract: A fan control system uses a closed loop system to adjust the actual operating speed of a fan or fans to a desired operating speed. The desired speed and actual speed are compared in a high gain amplifier to generate a control signal to adjust the actual operating speed of the fan given the feedback.

Abstract: A bonded semiconductor-on-insulator substrate for an integrated circuit. The bonded semiconductor-on-insulator substrate includes a wafer, a handle wafer and an insulating bond layer. The wafer has a first layer of monocrystalline semiconductor material adjacent a first surface of the wafer. The wafer also has a second layer of undamaged by implantation monocrystalline semiconductor material adjacent a second surface of the wafer. The wafer further has a substantially planar intrinsic gettering zone of substantially pure semiconductor material and active gettering sites positioned between the first and second layers formed by implanting ions of the semiconductor material through the first layer of monocrystalline semiconductor material. The insulating bond layer bonds the handle wafer to the first surface of the wafer.

Abstract: An improved base for a NPN bipolar transistor. The base region is formed with Boron and Indium dopants for improved beta early voltage product and reduced base resistance.