Abstract: A substrate includes a non-conductive support layer and a plurality "n" of conductive leads disposed on the support layer. The leads are arranged in a generally radial pattern about a central point on the support layer, each of the leads having a width "w" and spaced a distance "d" from one another at their innermost ends, thereby forming a generally square opening of side dimension "s". The substrate accommodates semiconductor dies ranging in size from smaller than the opening, to approximately equal to that of the opening, to substantially larger than the opening, such as four times the size (linear dimension) of the opening. The die is bonded to the substrate. Other elements of a semiconductor device assembly are added to the resulting structure. Method and apparatus are disclosed.
Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.
Type:
Grant
Filed:
October 11, 1991
Date of Patent:
December 1, 1992
Assignee:
LSI Logic Corporation
Inventors:
Nicholas F. Pasch, Vahak K. Sahakian, Conrad J. Dell'Oca
Abstract: An adder array for adding two or more input addends, whose bit lengths are not necessarily matched, and a method of configuring the adder array are disclosed. The addends are organized according to bit weight, and bits of equal weight are added in adder columns. Carry-outs are introduced into subsequent, higher weight adder columns according to delay. Thereby, the delay associated with the addition of the addends is minimized. Method and apparatus is disclosed.
Abstract: A single sheet of paper is divided into at least original and copy panels by fold line(s). Information entered on the two, front and back surfaces of the original panel are reproduced on the two surfaces of the copy panel by carbonless copy treatments. In one embodiment, the original panel is fully coated or partially coated with carbonless CB treatment, on both surfaces, and the copy panel is fully coated or partially coated with carbonless CF treatment. In a variation of this embodiment, the original panel is not coated, and the copy panel is coated in selected areas with carbonless SC treatment. In a second embodiment, the original panel is not coated, an image-transferring panel is fully coated on both surfaces with carbonless CB treatment, and the copy panel is fully coated with carbonless CF treatment. In a variation of this embodiment, the image-transferring panel is formed of a separate sheet of paper.
Abstract: A genlock frequency generation system synchronizes a dependent, or controllable, video source to an independent video source, with the capability of reverting to some predetermined default conditions in the event that no coherent independent video signal is found. The genlock frequency generation system is capable of placing a dependent video image in an arbitrary rectangular area overlaying the independent video image. Method and apparatus are disclosed.
Abstract: A digital filter, and more particularly a digital filter such as a transversal filter is disclosed, which is comprised of digital filter modules and provided with a function to detect the occurrence of anomalies such as overflow (a state in which excessively large or small absolute values exceeding an allowable limit are produced during arithmetic operations).
Abstract: Various configurations of "clear" areas for entering information on the front and back sides of an "original" page of a two-sided form are disclosed. The page may be the original page of a self-replicating form which includes a copy page and appropriate carbonless coatings. The clear area on the front side of the original page is offset from the clear area on the back side of the original page. A method for laying out the original page of the form, such as with a computer system, to ensure offset of the front and back clear areas, is also disclosed. A method of filling out "variable" information in the offset clear areas, such as with a computer system, is also disclosed.
Abstract: The carbonless copy form of this invention reproduces information written or printed on both the front and back surfaces of an "original" page onto the two (front and back) surfaces of a "copy" page. In one embodiment, the form is formed of a single sheet of paper comprising a clear (uncoated) original page and a copy pages coated with carbonless CF treatment on both sides. A separate intermediate sheet, coated with carbonless CB treatment on at least one side is interposed between the folded and refolded original copy pages to effect reproduction of information entered on the front and back surfaces of the original page onto the back and front surfaces, respectively, of the copy page. In other embodiments, the original, copy and intermediate pages are formed from a single sheet of paper. The original page is clear, the copy page is CF-coated on both sides and the intermediate page is CB-coated on both sides.
Abstract: A recordkeeping book has a front cover, a back cover and an accordion-folded strip of paper extending therebetween. The strip is divided longitudinally into a "left" portion, disposed within the covers, and a "right" portion, extending out from the covers. Information entered on the front surface of the left portion is reproduced on the back surface of the right portion when the right portion is folded underneath the left portion. Information entered on the back surface of the left portion is reproduced on the front surface of the right portion when the right portion is folded over the left portion. Means for effecting the reproduction of information entered on both surfaces of the left portion onto both surfaces of the right portion are disclosed and include a "male", or "CB" carbonless copy treatment applied to the front and back surfaces of the left portion, and a "female" or "CF" carbonless copy treatment applied to the front and back surfaces of the right portion. Method and apparatus are disclosed.
Abstract: A vibratory tube-to-tube transfer system for transferring the contents of an input tube to an output tube is disclosed. The system includes an alignment fixture having an input section for receiving an input tube loaded with ICs and an output section for receiving an empty output tube. A support plate supports the alignment fixture and a directional vibrator is affixed to the support plate for vibrating the alignment fixture and effecting the transfer of the contents of the input tube to the output tube. An equal number of input tubes and output tubes, such as eight of each, are accommodated by the transfer system.
Abstract: A high-speed receiver/latch is implemented by incorporating a differential amplifier/comparator directly into the feedback loop of a latch function. Both transparent and edge-triggered variants are possible. The resulting circuit is capable of extremely high-speed operation by virtue of very small setup time and small propagation delay.
Abstract: A preformed planar structure is interposed between the chip(s) and the substrate in a flip-chip structure, and establishes a minimum gap between the chip(s) and the substrate. Liquid flux may be applied to the preformed planar structure in order that flux is selectively applied to the solder balls (pads) on the chip and the substrate. The preformed planar structure may be provided with through holes in registration with the solder balls on the chip(s) and the substrate. In this case, liquid flux selectively fills the through holes for delivery to the solder balls during soldering. The through holes also aid in maintaining registration of the chip(s) and the substrate. The through holes may be sized to establish a predetermined mechanical structure of solder joints formed by the solder balls when fused together. The preformed planar structure has a planar core and opposing planar faces.
Type:
Grant
Filed:
August 30, 1990
Date of Patent:
May 5, 1992
Assignee:
LSI Logic Corp.
Inventors:
Nicholas F. Pasch, Vahak K. Sahakian, Conrad J. Dell'Oca
Abstract: An arithmetic unit using a digital filter is disclosed, and more particularly an arithmetic unit using a digital filter in which a signal filtered by the digital filter and an original signal are processed to derive therefrom an arithmetic signal.
Abstract: A method of making a plastic-packaged semiconductor device, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed cirucit boards for aiding in alignment of the device with the board.
Abstract: A structure is formed on an electronic integrated circuit by altering the electrical characteristics of a diffused region of a substrate through a contact hole (window) in an insulating layer, in proportion to the size of said contact hole, such that the resistance of the diffused region is changed in a known and predictable fashion and may be measured electrically, giving indirect but accurate evidence of contact size in a completely nondestructive fashion. The measurements may be made on completed devices. Method and structure are disclosed.
Abstract: A combination holder/enclosure for a multi-leaf folded article is disclosed, and includes a front cover, a back cover hinged to the front cover, and means for retaining a portion of the leaves against the inside surface of the front cover and the remaining portion of the leaves against the inside surface of the back cover when the holder/enclosure is open. The front and back covers have raised edges extending from their inside surfaces, and the means for retaining the leaves is clips on the edges and bands extending from the clip on a bottom raised edge to the clip on a top raised edge of the respective cover. The hinge is an elongated member, and the means for retaining the article includes at least one band extending the length of the hinge, and holding the fold portion of the multi-leaf article against the inside surface of the hinge. When the holder/enclosure is closed, a carrying case is formed, and the multi-leaf article can be stored within the enclosure, along with other items.
Abstract: Enhanced uniformity of illumination is achieved in photolithography by interposing photochromic glass in the light path between the illuminator light source and a semiconductor wafer. In one embodiment of the invention, the photochromic glass is disposed immediately adjacent and before (upstream of) the mask. In another embodiment of the invention, the photochromic glass is disposed upstream of the mask, and an intermediate lens is disposed between the photochromic glass and the mask. In a still further embodiment of the invention, the photochromic glass is disposed in a reflector behind the illuminator light source. In other embodiments of the invention. The photochromic glass is disposed downstream of the mask. In yet another embodiment of the invention, the photochromic glass is exposed by two or more copies of a mask on a reticle to effect averaging. The photochromic glass is then used as a virtual mask to expose the wafer. Each of the described embodiments has its own advantages.
Abstract: A plastic-packaged semiconductor device, method of making same, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed circuit boards, aiding in alignment of the device with the board.
Abstract: An expansion anchor stud comprises an expansion anchor for gripping a hole in a surface, an axially-aligned, externally threaded stud of substantially the same outside diameter as the anchor and engaging the distal end of the anchor, and an axially-aligned bolt extending through a hole in the anchor and engaging the stud. A head on the proximal end of the bolt abuts the proximal end of the anchor, and external threads on the bolt engage internal threads in a hole extending through the stud. The anchor is expanded by a tool inserted into the distal end of the hole in the stud to engage the distal end of the bolt and rotate the bolt relative to the stud, thereby axially compressing, and hence expanding, the anchor. The distal end of the stud extends, in use, through a hole in a panel being mounted to the surface so that a nut may be threaded onto the external threads of the stud to secure the panel to the surface.
Abstract: A baby walker is equipped with a device that produces a sound, such as musical tones, when it is moved about a floor surface. The walker may be moved in response to the urgings of a baby within the walker, or in response to the urgings of another person pulling the walker via a pull-cord detachably connected thereto. The device for producing sound may be a trail-along toy, such as a wheeled xylophone, or may be built into the wheel assemblies of the walker. A cord attaching the trail-along toy to the walker may be grasped by the infant and pulled, without any motion of the walker, to produce a sound. Each wheel of the conveyance is suitably fitted with a sounding device, which may produce a different sound for the turning of each wheel.