Abstract: A light emitting device with a top electrode and a bottom electrode is pushed by a plug to make contacts with either an upper metal plate or a lower metal plate each serving as one of the leads for an electrode of the light emitting devices. The plug is inserted through an opening larger than the light emitting device in the metal plate not in contact with the light emitting device but serving as another lead for the light emitting device. The plug is locked in place by means of threaded screw heads, snug-fit, snap-on buttons or an elastic sleeve. Thus, the light emitting device can be easily replaced without any wire bonding. A plurality of the light unit can be sandwiched between the upper metal plate and the lower metal plate.

Abstract: The electrodes of a light emitting diode (LED) is coupled to the terminals of a package with solderless pressure contacts. Each package is housed in a module with a bed on which the bottom electrode of the LED rests, and a pressure plate which is coupled to the top electrode of the LED. The pressure plate slides along four vertical posts to exert pressure to an LED package against a bed to form solderless pressure contacts. A plurality of LED packages can be lined up in a row to form a light strip, with the top pressure plate extended to form the bed of an adjacent module. A plurality of LED packages can also be arranged a matrix array display panel, where a plurality of lower terminals rests on one row of common bed of a number of parallel horizontal common beds, and where a plurality of upper terminals are pressed under a column of parallel vertical common pressure plates, so that any individual LED at the cross-point of a common bed and a common pressure can be randomly accessed.

Abstract: A three-dimensional surface shape is produced from input numerical data. The shape of an elastic surface is determined by the positions of a first matrix of memory rods. The position of each of the memory rods is determined by a flexible sheet which is contoured by a second matrix of control rods and is computer-controlled. After control rods transfer the contour data to the memory rods, the control rods are reset to receive new contour data. Both the memory rod and control rod are fitted with two pneumatically controlled locking mechanisms, one for the X-coordinate and one for the Y-coordinate. When both locks on a particular rod are released the rod is free to move to a new position determined by an elevator. Once all of the rods have been adjusted, they are locked in position and the surface has been configured.

Abstract: Heat from a heat generating device such as CPU is dissipated by a heat sink device containing a recycled two-phase vaporizable coolant. The coolant recycles inside a closed metal chamber, which has an upper section and a lower section connected by a conveying conduit, and a wick evaporator placed in connection with the lower section. The liquid coolant in the evaporator is vaporized by the heat from the heat generating device. The coolant vapor enters the upper section and condenses therein, with the liberated latent heat dissipated out through the inner top chamber wall. The condensed coolant is then collected and flows into the lower section, and further flows back to the wick evaporator by capillary action of the evaporator, thereby recycling the coolant. Space or a piece of element with parallel grooves is used to at least one of the sections to reduce friction in the liquid flow path.

Abstract: This invention describes an approach for monolithically integrating all the components of a photoreceiver—optical amplifier, optical band-pass filter, and photodiode module—on a single chip. The photoreceiver array employs unique optical amplifier and conversion technologies that provides the ultra-sensitivity required for free space optical communications networks. As an example, by monolithically integrating a vertical cavity surface emitting laser-diode (VCSEL) optical preamplifier with a photodiode receiver and related amplifiers and filters on the same chip, sensitivities as low as ?47 dBm (62 photons/bit at 2.5 Gb/s), along with an order of magnitude reduction in size, weight, and power consumption over comparable commercial-off-the-shelf (COTS) components can be demonstrated.

Abstract: When both the sourcing command and the sinking command to the phase comparator are high, the charge pump phase detector creates a high impedance output dead period, which is undesirable. The dead zone can be minimized by resetting the phase comparator when both sourcing command and sinking command are high. Accurate timing of the reset signal is crucial to good PLL phase noise performance and also to the elimination of the dead zone problem. In our invention, accurate reset timing is achieved by including the charge pump delay time caused by the input gate capacitance of the output complementary MOSFETs in the reset signal path.

Abstract: A three-dimensional surface shape is produced from input numerical data. The shape of a sheet elastic material is determined by the positions of a matrix of control rods. The position of each of the rods is determined by a computer-controlled system. Each rod is fitted with two pneumatically controlled locking mechanisms, one for the X coordinate and one for the Y coordinate. When both locks on a particular rod are released the rod is free to move to a new position determined by an elevator. Once all of the rods have been adjusted they are locked in position and the surface has been configured. In one application, the surface can be used as a mold for casting a replica or in another application can be used as the screen in an image projection system.

Abstract: An array of light emitting diodes (LED) are laid out as a dot matrix array as a display panel. Each LED is accessed by two dimensional addressing from a first set of parallel horizontal interconnections and a second set of orthogonal interconnections. The two sets of orthogonal interconnections are printed on two sides of a substrate. One of the two electrodes of an LED, which mounted on the top of the substrate, is fed through the substrate with a via hole and connected to the orthogonal interconnection at the bottom of the substrate. The size of the display panel is configurable by removing certain rows and/or columns. More than one partitioned blocks can be pieced together by aligning and coupling the corresponding orthogonal interconnections through a motherboard.

Abstract: An integrated circuit chip with ball-grid array solder balls is packaged as a module without being sealed in protective glue. The IC chip is mounted on an insulating substrate with pads to support the solder balls. The pads are connected to a second set of pads along the periphery of the substrate. Leads are pressed against the second set of pads for external connections. A second IC chip may be pressed against the other side of the substrate to increase the external connections.

Abstract: A BJT operating as a mixer has its collector biased at the knee of the IC vs VCE characteristic. A local oscillator voltage is applied to the base and an RF signal voltage is applied to the collector through a singled-ended emitter follower. The nonlinear curvature at the knee produces a beat frequency current. The base of the emitter follower can be fed from a current mirror or through an ohmic resistor. This mixer requires less supply voltage, and results in more conversion gain and less feed-through of the RF input signal than the Gilbert multiplier. Alternatively, the RF voltage can be applied to the gate and the local oscillator voltage can be applied to the drain. Sometimes, it is more desirable to invert the collector and the emitter, or to connect a normal transistor and an inverted transistor in parallel to optimize conversion gain.

Abstract: One or more UV light emitting diode (LED) chip is used as the light source of a picture projection system. The UV LED light is converted into red, green and blue light beams by means of red, green and blue fluorescent plates, respectively. The lights emerging from said fluorescent plates is transmitted through one or more programmable liquid crystal plate or reflected by one or more digital micro-mirror device (DMD) to control the light transmission, and then merged together for projection onto a screen. When only one programmable liquid plate or one DMD is used, the different color signals are sequentially projected onto the screen.

Abstract: The light emitted from a bank of light emitting diodes is converted through a set of lenses into parallel light beams, which, in turn, is focused or diversified as projection light source. Such a light source can replace traditional incandescent bulb. Reflection mirrors can be used to deflect or reflect the light beams. Phosphorescent material can be added in the transmission path to convert blue or ultraviolet short wave light into white light.

Abstract: One or more LED panel is used as a light source of a light projector. The LEDs are mounted on a panel and arranged as a matrix array. The light emitted from the LEDs are reflected by a reflecting cup. The LEDs are connected to two separate metal parts each connected the two electrodes of the LEDs. The spaces between the LEDs are utilized for light passage.

Abstract: The surface of the glass window of a scanner is coplanar with flanges on top of the scanner frame. The light path between the scan window and the light sensor mounted on the frame is prevented from varying regardless of any interface tolerance in mechanical dimension of the optical components in the light path between the scan window and the light sensor.

Abstract: An LED display panel are mounted with an array of LEDs on a number of metallic partitions, serving as common electrodes foil a line of LEDs as well as heat sinks. Another number of rails serve as common electrodes for another line of LEDs. The metallic partitions and the rails are orthogonal to and insulated from one another at their cross-points.

Abstract: LEDs of a light matrix display are mounted between two metal frames. Each frame has air ducts to circulate air around the LEDs, thereby removing the heat generated in the LEDs and allowing higher intensity light to be emitted.

Abstract: The paper guide for a scanner has an upper guide and two lower guides: the inlet lower guide and the outlet lower guide. The inlet lower guide overhangs over an output lower guide and is separated by a gap in the direction of the paper movement. The paper is scanned at the gap by the scanning light.

Abstract: The VCO of a synthesizer operates with a coarse tuning and a fine tuning. During the coarse tuning, a binary search method is used to match the VCO frequency to one of a finite number of discrete reference frequencies. The coarse tuning operates without frequency division and phase comparison in a closed feedback loop, thereby speeding up the settling time and increasing the lock-in range. The fine tuning operates as a conventional analog PLL.

Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.

Abstract: A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.