Abstract: A surface-mount package for multiple LED chips is constructed by inscribing a groove in an insulating substrate. The LED chips are mounted in the groove and the leads are connected to metal plates, which wrap around the substrate to provide bottom contacts for surface-mounting.

Abstract: Thick metal plates are used both as leads and substrate of a laser diode package. The laser diode and the metal plate are covered with a sealing glue up to the outside end of the laser diode to form a unitary structure. The thick metal plates serve as a heat sink. The outside end of the laser diode is not covered with glue so that the emitted is not attenuated. A photo diode is used to monitor the emitted light intensity. The photo diode can share a common electrode with the laser diode by mounting the photo diode on a step-down metal plate, so that the light emitted from the inside end of the laser diode is only partially blocked.

Abstract: A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the focusing cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames need not withstand the stress of folding and the package can be made thinner than prior art. The elimination of the through holes makes the package narrower. The bottoms of the metallic frames can be aligned one side of the bottom surface of the package, so that the package can be surface-mounted normally to or in parallel with a motherboard with light emitting respectively in parallel with or normally to the surface of the motherboard.

Abstract: The leads of a light emitting device package are extended is flexible pins. These pins can be bent with respect to a motherboard so that the direction of the light entitled from the light emitting device can be adjusted. The package is tab-mounted to the motherboard for heat sinking or serving as a lead.

Abstract: In a surface mount LED chips mounted on an insulating substrate, plated through conduits to interconnect the chips on both sides are placed at the corners of the outer terminals at two horizontal ends. The depressions caused by wire-bonding the chip to the terminals are lined up vertically with the corner conduits to reduce horizontal dimension.

Abstract: An image processing system integrates the scanning function with image processing function. The scanned image can be directly transmitted to a printer for high quality reproduction to serve a “scan to print” function. The system can also transmit the scanned image with or without being processed to a computer for further processing. The output from the computer can be transformed into image for rapid printout.

Abstract: An automatic paper feeder uses a paper guide with two separate lower blades for feeding the paper past a scan window. The separate blades provide smooth passage of the paper over the scan window and avoiding rubbing the scan window surface. When the paper feeding mechanism is used both for automatic paper feeding scanning and for flat-fed scanning, the image sensor position is changed for the two applications, because the former scan window lies over the larger scan window for flat bed scanning and the elevations of the scanned papers for the two situations are different. The vertical position of the image sensor can be changed to maintain equal distance between the scan surface and the image sensor.

Abstract: Two or more coupled sub-wells are inserted in the quantum well region of a MODFET to move the electron/hole gas away from the interface between the spacer layer and the well region. The channel can be constructed with a wire cross-section to confine the electron/hole gas in two dimensions, thereby reducing the scattering and improving the device performance. Structures with supply layer contacts, along with their application are described. Laterally coupled quantum wire MODFETs are also disclosed. The insertion of a coupled-well transport channel is applicable for Si MOSFETs in improving the high frequency performance.

Abstract: A paper feeding device includes a back plate, a first bracket, a second bracket, a shaft, and a friction roller. The first bracket is arranged on the back plate and formed of a first socket. The second bracket is arranged on the back plate and formed of a second socket. The shaft has a first end and a second end opposite to the first end. The first end of the shaft is rotatably mounted in the first socket. The second end of the shaft is rotatably mounted in the second socket. At least one of the first and second sockets is an open-ended socket for facilitating both the insertion and removal of the shaft. The friction roller wraps around the shaft for conveying a piece of paper.

Abstract: A resilient friction pad is pushed by a spring against a conveying roller for feeding paper automatically in a printer. The friction pad is placed in a recess at the end of the paper tray. A flat auxiliary spring may be used to share the pressure of a heavy paper load and to prevent the separation of the resilient friction pad and the conveying roller. A support block may be placed underneath the resilient friction pad to prevent sagging of the resilient friction pad. A corrugated arm may be inserted between the push-up spring and the resilient friction pad to provide wider contact between the resilient friction pad and the conveying roller. Two springboards, one wider than the other, are located at the tail end of the resilient friction pad, one to lift to paper tray when the paper stack is light and the other to depress the paper stack so that paper in the upper section of the remaining paper stack does not push the paper being fed so hard that more than one sheet of paper are fed.

Abstract: Two resonant tunneling diodes with hysteretic folding V-I characteristics are connected in series. The node voltage and the series current of the cell determine the memory state and there can be a large number of states. During writing, one writing pulse sets the pull-down RTD to one of the positive differential resistance region of the hysteretic V-I characteristic, and a second writing pulse sets the pull-up RTD to one of positive differential resistance region. During writing, the series current is sensed by measuring the colon ground current.

Abstract: The soldering pads on metal contacts for connection to the electrodes of a semiconductor diode chip are surrounded with a coating of insulating material to prevent the spreading of the molten solder, which may cause misalignment of the chip with respect to the package.

Abstract: The optical system of a scanner comprising at least four reflecting mirrors, a focusing lens and an image sensor has its lens placed outside the area encircled by the reflecting mirrors so that the reflecting mirrors can be placed closer in the vertical direction. Thus, the vertical dimension of the scanner is made smaller.

Abstract: A mobile telephone uses a laser diode to indicate the presence of incoming telephone calls. The laser diode is energized by the incoming radio frequency (rf) signal by rectifying the rf signal to produce dc voltage. The antenna assembly has a transparent window for the emitted light to radiate. The emitted light passes through a patterned mask to generate artistic light rays. Using different kinds of semiconductor material for the laser diode, the laser diode can emit different colors.

Abstract: An automatic alignment system is used to correct the offset error of a bidirectional printing device. The positional offset between the forward printing and the backward printing is compensated by adjusting the position of the printing cartridge. The actual position of the cartridge is sensed by a light detector, which is shuttered when the moving cartridge, driven by a microstepping motor, passes through the sensor. Based on the difference between the actual position and the correct theoretical position, the cartridge position is automatically adjusted to correct the offset error. For fine adjustment, time delay can be used in addition to the positional adjustment of the cartridge.

Abstract: Via holes are plated through the substrate of a surface mount package. The leads of an electronic device is inserted in the plated-through via holes. The bottom of the plated through metal is enlarged as pads to provide reliable soldering surfaces to a motherboard. Upon heating the leads are soldered to the walls of the plated through via holes. Alternatively, the leads can be folded before inserting into the plated-through via holes.

Abstract: More than one photodetectors, each sensitive to different wavelengths, are integrated on a common semiconductor substrate. The different photodetectors can be stacked over one another or placed laterally on the common substrate. Gratings may be placed over each photodetector to sharpen the spectral response. Three such photodetectors can form a pixel of an active matrix array for an image sensor. The different photodetectors in each pixel can be multiplexed electronically. The electronic circuits for activating the different photodetectors can be integrated on the same substrate.

Abstract: The elastic cover of a scanner has an elastic convex bottom plate to press against the paper to be scanned. The convex bottom plate has windows for air trapped in the duct of the convex bottom plate to flow out and press against the paper so that the paper does not fly when the cover is lifted.

Abstract: A solid state epoxy powder and a solid state fluorescent powder material are mixed in a fixed ratio for application over the surface of an optical device. When the mixture is heated into liquid form and then cooled down, the mixture forms a fluorescent coating which emits colorless light when optical device is excited.

Abstract: In the scanning optical module of a scanner, the light source module is mounted over the lens module through a spring to push the light source module against the scan window. Thus, the light source is moved closer to the document to be scanned and irradiates the document with higher intensity than prior art light source, which must be clear away from the scan window to allow for manufacturing tolerances. The light source is separated from the scan window by rollers.