Abstract: A resilient friction pad is pushed by a spring against a conveying roller for feeding paper automatically in a printer. The friction pad is placed in a recess at the end of the paper tray. A flat auxiliary spring may be used to share the pressure of a heavy paper load and to prevent the separation of the resilient friction pad and the conveying roller. A support block may be placed underneath the resilient friction pad to prevent sagging of the resilient friction pad. A corrugated arm may be inserted between the push-up spring and the resilient friction pad to provide wider contact between the resilient friction pad and the conveying roller. Two springs are located at the tail end of the resilient friction pad: one to lift to paper tray when the paper stack is light and the other to depress the paper stack so that paper in the upper section of the remaining paper stack does not push the paper being fed so hard that more than one sheet of paper are fed.

Abstract: A plastic focusing cup is directly mounted on the bottom metallic contact plates for surface mounting of an optoelectric diode package.

Abstract: A light emitting field effect transistor is proposed with a new extended drain region. The extension is doped with erbium or other rare-earth atoms. The erbium provides light-emitting centers in the indirect bandgap silicon substrate to enhance the radiative process. When a drain voltage is applied to create a high enough electric, energetic electrons entering this region interact with Er to emit infrared light.

Abstract: A low supply voltage for operating an operational amplifier operating as a voltage follower is derived from a high voltage source. Two npn transistors, two Zener diodes and a current source are connected in series across the high voltage source. The input voltage (to the operational amplifier) plus a Zener reference voltage is applied to the base of the transistor near the positive terminal of the high voltage source. Then, a low positive supply voltage V+ nearly equal to the input voltage plus the Zener voltage (Vi+Vz) is derived at the emitter. This low positive supply voltage V− is derived by dropping V+ through the two series Zener diodes to obtain a low negative supply voltage equal to (Vi−Vz).

Abstract: The output optical beam from an angled-facet semiconductor laser diode is made to propagate parallel to the optical axis of the laser package with low optical back-reflection. In this way, the angled-facet devices are made compatible with conventional semiconductor laser packages enabling them to be economically incorporated in a wide-range of external semiconductor lasers and amplified spontaneous emission sources. The parallel beam is achieved by tilting the laser diode with respect to the front and back surfaces of the package.

Abstract: A light emitting diode (LED) is connected in series with the power supply input pad of an integrated circuit chip. The LED lights up when the power supply is turned on as an indicator that the IC is operating properly.

Abstract: Two IC chips in a multiple-chip module are stacked together on a common lead frame or substrate of a ball-grid array package to save space. The top chip is wire-bonded to the lead frame. The bottom chip is flip-chip bonded to the lead frame, thus allowing more leads. The common substrate of the two chips are connected together by a conductive layer of metal plate, solder or conductive epoxy. The connecting layer may serve as a heat sinking element or a common electrical terminal.

Abstract: A resilient friction pad is pushed by a spring against a conveying roller for feeding paper automatically in a printer. The function pad is placed in a recess at the end of the paper tray. A flat auxiliary spring may be used to share the pressure of a heavy paper load and to prevent the separation of the resilient friction pad and the conveying roller. A support block may be placed underneath the resilient friction pad to prevent sagging of the resilient friction pad. A corrugated arm may be inserted between the push-up spring and the resilient friction pad to provide wider contact between the resilient friction pad and the conveying roller.

Abstract: Flat metal strips are used to make connections to a laser diode so that the interconnections are parallel to the surface of the semiconductor device and the structure has a lower profile than a wire-bonded package. The contacts can be made with conducting glue or hard pressed by a lid before sealing with glue.

Abstract: An optical sensor switch system is used to effect a selection function of a scanner. The depressed switch for a selected function changes the light intensity incident on the pixels of a light sensitive panel in two steps. This change in light intensity activates the operation of the particular function. The change in light intensity is effected by shuttering the light from a source to the pixels. The pixels of the panel are divided into different sections, each designated to a particular function for the scanner.

Abstract: A high temperature cookware is made with material to render it heat more uniformly, at a lower temperature to avoid over-burning, more resistant to cracking due to sudden change in temperature, and less fragile. The material includes cordierite to possess small expansion coefficient, mullite to store more heat, talc to lower the firing temperature, and refractory clay for high heat conductivity. Other ingredients are added to enhance far-infrared radiation with certain kinds of metallic oxide. After the body is fired, the cookware is glazed to be impervious to water and coated with Teflon to make the cookware non-sticking.

Abstract: A heat conducting metal is placed under a semiconductor chip and wraps around a substrate of the semiconductor device package to serve as the heat sink for the chip. The metal can wrap around a through-hole in the middle of the substrate, or wrap around the edge of the substrate. A metal plate can be placed between the chip and the heat conducting metal to hold the semiconductor chip.

Abstract: An optical reader and the driving motor of a scanner are integrally mounted on a movable module, which can slide back and forth along a track to scan an image. The driving motor exerts a force on a fixed rack attached to the frame of the scanner through a pinion. The reaction to the force causes the movable module to slide. The rack and pinion mechanism can be replaced with a friction tape and roller combination, or a steel wire wrapped around a wheel attached to the movable module.

Abstract: During transient operation of a voltage regulator, the gate of p-channel MOS pass transistor may be pulled down during the transient period to cause excessive surge current. The surge current is limited by using the pass transistor as a current mirror during the transient period. After the transient period, the pass transistor resumes its role as an element together with a differential amplifier and a reference voltage in a feedback loop to regulate the output voltage.

Abstract: In the scanning optical module of a scanner, the light source module is mounted over the lens module through a spring to push the light source module against the scan window. Thus, the light source is moved closer to the document to be scanned and irradiates the document with higher intensity than prior art light source, which must be clear away from the scan window to allow for manufacturing tolerances.

Abstract: The frequency of oscillation of two cross-coupled CMOS inverters with a parallel LC tank connected between the two drains can be varied by a control voltage which varies the capacitance value of the tank circuit. The gate-to-source capacitance is used as the variable capacitance. The gate-to-source capacitance is varied by changing the dc gate voltage, which can be effected by either changing the dc current through the inverters or by varying the dc voltage across the inverters. The control voltage may also be made to vary with temperature such that the free running frequency of the oscillator is held constant with varying temperature.

Abstract: The reflection mirrors in the optical system of a scanner is arranged to have reflections in a vertical direction instead of a horizontal direction as is commonly done. Then, the horizontal dimension of the scanner can be reduced.

Abstract: A package for multiple IC chip module. The IC chip is attached to electric wires on ceramic substrate which has good heat dissipating capability. The bonding pads along the periphery of the ceramic substrate are lead-bonded to a second substrate with printed wiring on at least one side of the surfaces and ball grid array at the bottom surface. Double-sided printed wiring can be used to provide multiple-layered interconnection. The IC chip is separated from the second substrate by a resin to cushion the stress due to difference in thermal expansion coefficients of the IC chip and the second substrate.

Abstract: A method of making accurate alignment layers in a liquid crystal display (LCD) cell is provided so that the LCD seal band can be placed as close to the pixel as possible. This method is implemented by ablating the apolyimide film on the glass substrates of the LCD cell to remove the alignment film where the sealing material is to be dispersed later. Thus, the sealing band can butt against the liquid crystal mixture without any clearance. In so doing, the display area is increased, and the reliability of the seal is improved.

Abstract: A resettable fuse is connected in series with a bonding pad of an IC chip, In the presence of a high voltage surge, the resettable fuse breaks the connection temporary. After the surge is over, the resettable reset itself and the IC resumes operation.