Abstract: The circuit for combined operation of a mobile radio with GMSK and 8-PSK modulation includes a transmission PLL for GMSK operation, and a direct modulator for 8-PSK operation. A transmission oscillator in the transmission PLL is also used as a synthesizer oscillator for the direct modulator. The modulation in the transmission PLL is suppressed for this purpose. The circuit allows cost-effective implementation while retaining the advantages of a transmission PLL.

Abstract: An internal combustion engine has an intake tract, at least one cylinder, an exhaust gas tract and inlet and outlet valves, which are assigned to the cylinder. An exhaust gas pressure in the cylinder is determined during the valve overlap of the inlet and outlet valves as a function of an estimated value of an exhaust gas pressure, which is effected by the combustion of an air/fuel mixture in the cylinder, and a variable which characterizes the centroid of the valve overlap of the inlet and outlet valves. At least one actuating signal for controlling an actuator of the internal combustion engine is derived from the exhaust gas pressure, or the internal combustion engine is monitored as a function of the exhaust gas pressure.

Abstract: In a rotary printing machine, a folder operatable in different folding modes, and having a copy-guiding cylinder to which copies severed from a material web by a cutting-cylinder pair are feedable, the copy-guiding cylinder having a circumferential surface wherein gripping and cross-folding elements are accommodated, includes a device having movable circumferential-surface parts guidable by a respective guide element and, during folding-mode changeovers, selectively extendable into the circumferential surface of the cylinder and retractable between stationary and movable segments of the copy-guiding cylinder which are positionable relative to one another.

Abstract: The S0-interface for ISDN base access connects a four-wire line with a receiver line pair and a transmitter line pair to an ISDN terminal device, subject to potential separation within the interface. Each of the receiver lines has a respective capacitor for potential separation and the transmitter lines have a transformer. An inductance is connected into each receiver line and each transmitter line on the interface side. Preferably, the receiver line pair is connected to a voltage amplifier on the device side. The voltage amplifier has a voltage amplification in the same ratio as the voltage amplification of the transformer in the transmitter line pair.

Abstract: An adaptive CAP filter includes a clock-controlled A/D converter for converting an input signal, a digital level-control circuit, an adaptive controlled reception filtering system with two parallel filters and a downstream decision maker for outputting reconstructed signal coordinates. The digital level-control circuit and the adaptive reception filtering system are decoupled by virtue of the fact that either an adjustment of the digital level-control circuit or a coefficient adjustment of the adaptive reception filtering system is active. A method for controlling a cap receiver is also provided.

Abstract: One or more contact elements for transmitting calibration data during the calibration of a sensor of the sensor device are electrically connected to a signal processing unit of the sensor. The contact element has a contact region in a groove of a housing part of the sensor device. A sealing compound, which seals the contact region, is introduced into the groove and a cover is brought into contact with the sealing compound in the groove. The groove, the sealing compound, and the cover are configured and they interact in such a way that the chamber communicates only with a working medium which is to be sensed by the sensor.

Abstract: A monolithic honeycomb body includes mutually spaced-apart inlet and outlet flow ends, different successive sections between the flow ends, and at least partially structured sheet metal layers having structures forming walls defining channels through which a fluid can flow in one flow direction. The channels have sizes or numbers varying in the different successive sections in the flow direction. At least a part of the structured sheet metal layers extend from the inlet flow end to the outlet flow end. Each of the sheet metal layers has at least a first structure and a second structure with different dimensions. At least one of the structures extends over only one of the sections. A method for manufacturing the honeycomb body is also provided.

Abstract: A gas and steam-turbine plant having a heat-recovery steam generator which is connected downstream of a gas turbine on a flue-gas side is described. The heat-recovery steam generator has heating surfaces connected in a water/steam circuit of a steam turbine. Cooled air for cooling the blades can be directed via an evaporator to the gas turbine. The evaporator is connected on a secondary side to the water/steam circuit and opens on an outlet side into a steam-collecting chamber. The steam-collecting chamber is connected to a water/steam drum via feed pipes connected in parallel on a steam side. The intention is to ensure that, during the transport of the water/steam mixture from the evaporator to the water/steam drum, a separation of the two-phase mixture is reliably prevented. Therefore, the steam-collecting chamber has a number of sub-chambers, which are connected to one another and in each case assigned to a feed pipe.

Abstract: A method for checking a semiconductor memory device integrated on a semiconductor chip includes providing the semiconductor memory device with a plurality of memory cells each being disposed on a semiconductor substrate for one binary information value, data lines for reading out and writing in information values, gate transistors being associated with the memory cells for selectively clearing a data path between a given memory cell and a data line, selection lines for purposefully triggering the gate transistors, and at least one in-chip reference voltage being adjusted to a predetermined normal value when the semiconductor memory device is functioning as intended. The method for checking the semiconductor memory device integrated on a semiconductor chip is carried out by at least intermittently varying the at least one in-chip reference voltage, and detecting and weighting the information values read out at the at least intermittently varied reference voltage.

Abstract: A chip card has a contact zone on which an electrically conductive lacquer applied. The electrically conductive lacquer is based on an intrinsically conductive plastic material. Pigments are added to the electrically conductive lacquer. In an alternative embodiment an electrically nonconductive lacquer is applied to the contact zone. Conductive particles are disposed in the electrically nonconductive lacquer. The electrically conductive lacquer forms a covering for the conductive particles. A method of lacquering a contact zone and a method of producing a chip card are also provided.

Abstract: DDR SDRAM memory chips require a highly precise output clock signal in order to pass the stored data onto a data highway at the correct instant. This signal is generated by a symmetrical circuit configuration that, by virtue of the integration of a multiplexer in a clock ratio compensator, additionally generates the output clock signal in a minimal time.

Abstract: A circuit configuration allowing for in-circuit emulation, comprising a memory containing an operating program; and a first and second microcontrolller. Each microcontroller has a computer core, at least five external connection ports, and a setable connecting device selectively connecting the computer core to the connection ports. A first connection port of the first microcontroller is connected to a first connection port of the second microcontroller. The memory is connected to at least a second one of the connection ports of the first microcontroller. The connecting devices are set to provide the computer core of the first microcontroller with the operating program contained in the memory, and are set to provide data transfer between the first connection port of the first microcontroller and the first connection port of the second microcontroller.

Abstract: A filter device for at least one electrical line connectable externally to a housing includes at least one contact pin for connecting the externally connectable electrical line to a multilayer printed circuit board having at least one support layer and at least one conductor layer, the contact pin having a part thereof located at a side of the filter device and being affixed to the printed circuit board, at least one outer layer of the printed circuit board being formed as either a holohedral or a grid-shaped shielding layer, respectively, the shielding layer being in an electrically conductive contact-connection with the housing. A contact pin of a conductor path of the conductor layer conductable to the outside is connected to the printed circuit board, the contact pin being arranged without electrical connection to the shielding layer.

Abstract: The thermohydraulic principle is utilized for generating intensive ultrasonic fields. At least two electrodes which enclose a volume with an electrolyte are driven by a power pulse generator. The electrolyte volume to be heated by the electrical pulse is delimited to such an extent that the electrical power to be applied can be controlled by semiconductor switching elements.

Abstract: There is provided, in a folder for web-fed printing machines for processing webs of material with longitudinal adhesive bonding, a longitudinal folding device including a displaceable folder former movable relative to a cylinder part of the folder, and a frame carrying former outlet rollers and spindles whereon the former outlet rollers are mounted, the frame being displaceable with the longitudinal folding device; further provided is a method of adjusting the longitudinal adjusting device.

Abstract: Semiconductor components, which each include at least one semiconductor chip mounted on a common carrier substrate, are singled. The separation is effected by severing of the carrier substrate. The carrier substrate is thereby bent at least in that area of the carrier substrate which is to be severed. The severing takes place beginning from the convexly curved surface of the carrier substrate. In addition, the invention describes a singling device for separating semiconductor components.

Abstract: A grid-shaped array of conductor areas is used for capacitive image acquisition. Shielding conductors are disposed in each case between the conductors that are provided for measurement. During a plurality of charging and discharging cycles, the potential is always carried along on the conductors belonging to a respective pixel in order to prevent displacement currents between the shielding capacitors. By way of example, a compensation line with a feedback operational amplifier can be used for identically altering the electrical potentials on the conductors.

Abstract: A component is produced on a substrate made of SiC. The component has at least one ohmic contact and at least one Schottky contact. The component is brought to a temperature of more than 1300° C. at least during the growth of an epitaxial layer. To ensure that the production of the ohmic contact does not lead to impairment of other structures on the component and that the ohmic contact, for its part, is insensitive with respect to later method steps at high temperatures, the first metal is applied to the substrate for the ohmic contact before the epitaxial layer is grown.

Abstract: A contact layer is used, for example, as a liner for the fabrication of electrical contacts in contact holes. The contact layer is fabricated in two steps, in a first step a first contact layer is deposited, in which only a small proportion of the particles to be sputtered is ionized. In a second sputtering step, a second contact layer is sputtered, in the course of whose fabrication a larger proportion of the particles to be sputtered is ionized. The procedure ensures that the first contact layer is disposed as a protective layer on the substrate by gentle sputtering before the second contact layer is sputtered.