Patents Represented by Attorney Hiscock & Barclay LLP
  • Patent number: 7745845
    Abstract: An integrated low leakage Schottky diode has a Schottky barrier junction proximate one side of an MOS gate with one end of a drift region on an opposite side of the gate. Below the Schottky metal and the gate oxide is a RESURF structure of an N? layer over a P? layer which also forms the drift region that ends at the diode's cathode in one embodiment of the present invention. The N? and P? layers have an upward concave shape under the gate. The gate electrode and the Schottky metal are connected to the diode's anode. A P? layer lies between the RESURF structure and an NISO region which has an electrical connection to the anode. A P+ layer under the Schottky metal is in contact with the P? layer through a P well.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: June 29, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Jun Cai
  • Patent number: 7738949
    Abstract: The invention relates to a method for transforming physiological data from the time domain to the frequency domain. The method includes the steps of: providing a plurality of digital data in the time domain; providing a microcomputer programmed to run a recursive Fourier transform estimation algorithm; calculating, for each newly received digital data in the time domain, an integer index using modulo(N) arithmetic based on a time the each newly received data was received; selecting a frequency vector from a plurality of N frequency vectors using the integer index; and updating the plurality of frequency coefficients according to a recursive equation including the selected frequency vector as an input variable. The invention also relates to an apparatus that performs a recursive Fourier transform estimation algorithm to convert data in the time domain to data in the frequency domain.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: June 15, 2010
    Assignee: Welch Allyn, Inc.
    Inventor: Alexander Holland
  • Patent number: 7727012
    Abstract: The invention provides a connector for coax cable with a snap bearing providing the interface between the inner body and the outer body. A concave surface below the snap bearing, which is retained by a pair of shoulders, allows the snap bearing to elastically deform during assembly of the connector to thereby reduce the risk of plastic deformation of the components while allowing significant improvements in overlap at the interface of the components.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: June 1, 2010
    Assignee: John Mezzalingua Associates, Inc.
    Inventors: Noah Montena, Shawn Chawgo
  • Patent number: 7727011
    Abstract: The invention is directed to a clutching mechanism for a coax connector. The device comprises an extended nut having a standard connector contained within. The extended nut comprises internal threads and a first clutch face and the internal standard connector comprises a connector body having a second clutch face. In operation, the first clutch face and the second clutch face are engaged by forcing the nut toward the connector body/cable, thereby serving as an interlocking mechanism. The device further comprises a compression sleeve between the nut and the connector body, serving to secure the cable to the connector.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: June 1, 2010
    Assignee: John Mezzalingua Associates, Inc.
    Inventors: Noah Montena, David Jackson
  • Patent number: 7728437
    Abstract: Provided are a semiconductor package which is small in size but includes a large number of terminals disposed at intervals equal to or greater than a minimum pitch, and a method of fabricating the semiconductor package. The semiconductor package includes a semiconductor chip having a bottom surface on which a plurality of bumps are formed, redistribution layer patterns formed under the semiconductor chip and each including a first part electrically connected to at least one of the bumps and a second part electrically connected to the first part, an encapsulation layer surrounding at least a top surface of the semiconductor chip, and a patterned insulating layer formed below the redistribution layer patterns and exposing at least parts of the second parts of the redistribution layer patterns.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: June 1, 2010
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Soung-yong Choi, Min-hyo Park
  • Patent number: 7719453
    Abstract: The present invention relates to an analog-to-digital converter (ADC) and an analog-to-digital conversion method employing a Josephson digital-to-analog converter (DAC) into an extremely accurate ADC of a physical metrology grade. The ADC includes: a front end ADC for converting an analog input signal into digital data; the Josephson DAC for receiving the digital data from the front end ADC and converting the received digital data into reference analog voltage; a differential ADC for extracting a difference voltage between a reference analog voltage of the Josephson DAC and an unknown input signal; and a data processor for summing output data of the differential ADC and output data of the front end ADC and outputting the summed result.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: May 18, 2010
    Assignee: Korea Research Institute of Standards and Science
    Inventors: Kyu Tae Kim, Mun Seog Kim, Yon Uk Chong
  • Patent number: 7714428
    Abstract: A high power semiconductor package includes a substrate including a base metal layer, a base insulation layer formed on the base metal layer, and a plurality of conductive patterns formed on the base insulation layer. In one embodiment one or more high power semiconductor chips are mounted on the substrate, each including a plurality of bonding pads, one or more first package leads having end portions that are electrically connected to the corresponding conductive patterns, and a second lead having an end portion electrically which may be connected to either the base insulation layer or the base metal layer.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: May 11, 2010
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Keun-hyuk Lee, Seung-won Lim
  • Patent number: 7708403
    Abstract: An apparatus that measures images of at least a portion of an eye and records data sets indicative of a neurological condition. A method of the invention employs a plurality of images, or a plurality of data sets, or at least one image and at least one data set to provide an interpretive result based on the interrelation of the images and data sets, such as by superposition. The apparatus and method thereby provide guidance as to the presence of a medical condition in a patient. The apparatus includes modules that observe images and/or data sets, that analyze the information, and that superpose the information. Modules are provided to store information, to provide data output, to provide reports, and to display information, including superposed images and data. Modules can be provided in hardware, in software, in firmware, or in combinations thereof.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: May 4, 2010
    Assignee: Welch Allyn, Inc.
    Inventor: Richard W. Newman
  • Patent number: 7705288
    Abstract: An optical reading device comprising a sensor array having pixels which are exposed to an image; an illumination generator for illuminating the image with light, the illumination generator being configured to have a front face; a housing for housing the sensor array, aiming pattern generator and illumination generator for hand held operation, the housing having a window disposed between the illumination generator and the image for permitting transmission of the illuminating light; a lens for focusing light to the sensor array, wherein the lens protrudes through the illumination generator; a gasket disposed around the lens for blocking light reflected off of the window from reaching the sensor array.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: April 27, 2010
    Assignee: Hand Held Products, Inc.
    Inventors: Colleen Patricia Gannon, Vivian Loomis Hunter
  • Patent number: 7706140
    Abstract: A portable data terminal comprising a circuit board which supports and interconnects a plurality of electrical components, a display, an angled frame which maintains the display at an angle to the circuit board, and a bracket which extends across the angled frame. The angled frame engages a peripheral portion of a first side of the circuit board. The bracket engages the circuit board so as to reduce the flexure of, and secure at least one electrical component on the circuit board.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: April 27, 2010
    Assignee: Hands Held Products, Inc.
    Inventors: Jonathan T. Grunow, Larry Keith Hooks, Jr.
  • Patent number: 7706146
    Abstract: Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: April 27, 2010
    Assignee: Fairchild Korea Semiconductor Ltd
    Inventors: Keun-hyuk Lee, Seung-won Lim, Seung-han Paek, Sung-min Park
  • Patent number: 7699555
    Abstract: A mounting assembly for releasably mounting a rear light member to a body member of a vehicle. The mounting assembly comprises a locking member. The locking member includes a sleeve-like mounting portion adapted to be fixed to the support member, and a first locking portion integrally joined to the mounting portion. The first locking portion is adapted to snappingly engage a matingly shaped second locking portion of the structural member for retaining it. The mounting assembly further comprises a release pin axially slidably in the mounting portion of the locking member. The release pin has a shaft portion axially project from the sleeve-shaped mounting portion and is adapted to be axially displaced for releasing the two locking portions from being snappingly engaged.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: April 20, 2010
    Assignee: Bollhoff Verbindungstechnik GmbH
    Inventors: Hans-Joachim Dembowsky, Hans-Ullrich Figge, Martin Jodeleit
  • Patent number: 7699227
    Abstract: An optical reader comprising: an image sensor array for converting light from a target into output signals representative thereof, the image sensor array having a centerline; a processor for decoding a machine readable symbology within the target derived from the output signals; receive optics for directing light from the target to the image sensor, the optics having a receive optics optical axis, wherein the image sensor array and receive optics are configured such that the centerline is not coincident with the optical axis.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: April 20, 2010
    Assignee: Hand Held Products, Inc.
    Inventors: Ynjiun P. Wang, William H. Havens
  • Patent number: 7701048
    Abstract: A power module with low thermal resistance buffers the stress put on a substrate during a package molding operation to virtually always prevent a fault in the substrate of the module. The power module includes a substrate, a conductive adhesive layer formed on the substrate, a device layer comprising a support tab, a power device, and a passive device which are formed on the conductive adhesive layer, and a sealing material hermetically sealing the device layer. The support tab is buffers the stress applied by a support pin to the substrate, thereby virtually always preventing a ceramic layer included in the substrate from cracking or breaking. As a result, a reduction in the isolation breakdown voltage of the substrate is virtually always prevented and the failure of the entire power module is do to a reduction in the breakdown voltage of the substrate is virtually always prevented.
    Type: Grant
    Filed: May 3, 2007
    Date of Patent: April 20, 2010
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Keun-hyuk Lee, O-seob Jeon, Seung-won Lim
  • Patent number: 7698774
    Abstract: Disclosed in this specification is an assembly for bending the blade of a drywall knife. In one aspect of the invention, a first and second blade bender are each attached to a drywall knife and a force is applied. This force bends the blade in such a manner that an arcuate blade is produced. The magnitude of the bend is highly adjustable.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: April 20, 2010
    Inventor: Darren M. Coon
  • Patent number: D613797
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: April 13, 2010
    Assignee: W.A. Krapf, Inc.
    Inventors: Wallace A. Krapf, John Deats, Ryan O'Connell
  • Patent number: D614128
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: April 20, 2010
    Assignee: Back-Seo Park
    Inventor: Gye-su Kim
  • Patent number: D615544
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: May 11, 2010
    Assignee: 3Dconnexion Holding SA
    Inventor: Antonio Pascucci
  • Patent number: D615650
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: May 11, 2010
    Assignee: Welch Allyn, Inc.
    Inventors: John R. Strom, Steven R. Slawson, Elizabeth P. Staples, Kimberly E. McNeilly, Eric M. Andreassen
  • Patent number: D616772
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: June 1, 2010
    Inventor: Zhichao Guo