Abstract: A nonvolatile memory device and a method of programming the device includes storing first data in first main and sub-registers and storing second data in second main and sub-registers, performing first program and verification operations on first memory cells based on the first data stored in the first main register, storing a result of the first verification operation in the first main register, performing a second program operation on second memory cells based on the second data stored in the second main register, changing the result of the first verification operation, stored in the first main register, into the first data stored in the first sub-register, performing an additional verification operation on the first memory cells on which the first verification operation has been completed, storing a result of the additional verification operation in the first main register, and performing a second verification operation on the second memory cells.

Abstract: A multi-chip package according to an aspect of this disclosure includes a plurality of multi-chips. Each of the multi-chips includes a lead configured to receive an external power supply voltage, and a pad circuit configured to reset an internal node to the level of a ground voltage and to generate chip address information by controlling the potential of the internal node based on the state of a connection between the pad circuit and the lead.

Abstract: A semiconductor memory device includes a memory string coupled between a common source line and a bit line, a page buffer configured to supply a first precharge voltage to the bit line and to latch data corresponding to a threshold voltage level of a memory cell of the memory string, wherein the data is detected according to a shift in a voltage of the bit line, in a precharge operation, a precharge circuit configured to supply a second precharge voltage to the common source line in the precharge operation, and a voltage supply circuit configured to generate operating voltages for turning on the memory string in the precharge operation. While the first precharge voltage is supplied from the page buffer to the bit line, the second precharge voltage is supplied to the bit line through the memory string.

Abstract: A semiconductor device and a method for fabricating the same. A plurality of gate patterns are formed over a first-conductivity type silicon layer of a silicon-on-insulator semiconductor substrate including a buried insulation layer, so as to be separated from each other. A plurality of silicon bodies are formed under the gate patterns, by removing a portion of the first-conductivity type silicon layer exposed between the gate patterns. A plurality of polysilicon spacers are formed over a sidewall of the silicon bodies, and each contains a second-conductivity type dopant. A contact plug is electrically connected to at least one of the polysilicon spacers.

Abstract: A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal.

Abstract: A semiconductor device includes: a first reference voltage generator for generating a first reference voltage; a first band gap circuit for dividing a voltage at a second reference voltage output node to produce a first and a second band gap voltages having a property relative to temperature variations; a first comparator for receiving the first reference voltage as a bias input and comparing the first band gap voltage with the second band gap voltage; and a first driver for pull-up driving the second reference voltage output node in response to an output signal of the first comparator.

Abstract: A non-volatile memory device includes a pair of columnar cell channels vertically extending from a substrate, a doped pipe channel arranged to couple lower ends of the pair of columnar cell channels, insulation layers over the substrate in which the doped pipe channel is buried, memory layers arranged to surround side surfaces of the columnar cell channels, and control gate electrodes arranged to surround the memory layers.

Abstract: A nonvolatile memory device comprises a memory cell array including a number of bit lines commonly coupled to a source line and each coupled to a number of memory cells, a delay unit configured to delay a sense signal in response to a voltage level of the source line and to output a delayed sense signal, and a page buffer unit configured to sense voltage levels of the bit lines in response to the delayed sense signal.

Abstract: A signal delay circuit including a clock transfer control circuit configured to transmit or block a clock signal, and a pulse signal generation circuit configured to delay a first pulse signal in response to the transmitted clock signal to generate a second pulse signal which has a longer active period than the first pulse signal.

Abstract: A semiconductor integrated circuit includes: a semiconductor chip; a through-chip via passing through a conductive pattern disposed in the semiconductor chip and cutting the conductive pattern; and an insulation pattern disposed on an outer circumference surface of the through-chip via to insulate the conductive pattern from the through-chip via.

Abstract: A method of programming a nonvolatile memory device comprises performing a first program operation on first memory cells and second memory cells so that threshold voltages of the first and second memory cells have a first reference level lower than a first target level, the first memory cells having the first target level as a first target level, and the second memory cells having a second target level higher than the first target level as a second target level; performing a second program operation on the second memory cells so that the threshold voltages of the second memory cells have a second reference level lower than the second target level; and performing a third program operation on the first and second memory cells to have the respective target levels.

Abstract: A method for fabricating a semiconductor device includes forming a first conductive layer doped with an impurity for forming a cell junction over a semiconductor substrate, forming a second layer over the first conductive layer, forming a plurality of active regions by etching the second layer and the first conductive layer, the plurality of the active regions being separated from one another by trenches, forming a side contact connected to a sidewall of the first conductive layer, and forming a plurality of metal bit lines each connected to the side contact and filling a portion of each trench.

Abstract: A semiconductor memory device comprises planes each configured to comprise flag cells storing data about program methods of memory cells of the plane, page buffer units configured to sense the data of the flag cells, a flag cell data detection circuit configured to make a determination of program methods of the planes on the basis of a result, obtained by comparing the sensed data of the flag cells of the planes, and the sensed data of the flag cells, and a microcontroller configured to control the page buffer units, wherein the page buffer units read least significant bit (LSB) data of the planes or both the least significant bit (LSB) data and most significant bit (MSB) data on the basis of the determination of the flag cell data detection circuit.

Abstract: There is provided a repeating system for cancellation of a feedback interference signal, including: a PA (Power Amplifier) for power-amplifying an output signal; a feedback ICS (Interference Cancellation System) for canceling a feedback interference signal and detecting a residual error; a pre-distorter for compensating for an error of the PA by applying pre-distortion and compensating for the residual error by using information on the residual error detected by the feedback ICS to linearize the characteristic of the PA; and a control unit for controlling the feedback ICS and the pre-distorter.

Abstract: In a semiconductor memory device which performs a repair method of replacing a repair target word line and one adjacent word line at the same time by a repair operation through an efficient decoding operation for selecting a repair target address, a test operation of enabling only a word line corresponding to a cell coupled to a bit line or a bit line bar is stably performed.

Abstract: A delay locked loop (DLL) of a semiconductor integrated circuit includes a first delay line configured to variably delay a source clock signal and output a locked clock signal, a phase comparator configured to compare the phase of the source clock signal with the phase of a feedback clock signal, a second delay line configured to variably delay the locked clock signal, a first delay controller configured to control the first delay time of the first delay line, a second delay controller configured to control the minimum delay time of the second delay line, and an operation mode controller configured to control the first and second delay controllers in response to an output signal of the phase comparator, and switch operation modes of the first and second delay controllers depending on locking state of the delay lines.

Abstract: A resistive memory device includes: a bottom electrode formed over a substrate; and an insulation layer having a hole structure formed over the substrate structure. Herein, the hole structure exposes the bottom electrode, has sidewalls of positive slope, and has a bottom width equal to or smaller than a width of the bottom electrode; a resistive layer formed over the hole structure; and an upper electrode formed over the resistive layer.

Abstract: A semiconductor device includes: a semiconductor substrate configured to include a plurality of trenches therein; a plurality of buried bit lines each configured to fill a portion of each trench; a plurality of active pillars each formed in an upper portion of each buried bit line; a plurality of vertical gates each configured to surround each active pillar; and a plurality of word lines configured to couple neighboring vertical gates with each other.

Abstract: An impedance code generation circuit includes a first code generation unit configured to compare a voltage of a calibration node with a reference voltage and generate a first impedance code, a code modification unit configured to generate a modified impedance code by performing an operation on the first impedance code according to a setting value, and a second code generation unit configured to generate a second impedance code based on the modified impedance code.

Abstract: A method for fabricating a vertical channel type non-volatile memory device including a plurality of memory cells stacked along channels protruding from a substrate includes: alternately forming a plurality of first material layers and a plurality of second material layers over the substrate; forming a buffer layer over the substrate with the plurality of the first material layers and the plurality of the second material layers formed thereon; forming trenches by etching the buffer layer, the plurality of the second material layers, and the plurality of the first material layers; forming a material layer for channels over the substrate to fill the trenches; and forming the channels by performing a planarization process until a surface of the buffer layer is exposed.