Abstract: A method for fabricating a transistor including a bulb-type recess channel includes forming a bulb-type recess pattern in a substrate, forming a gate insulating layer over the substrate and the bulb-type recess pattern, forming a first gate conductive layer over the gate insulating layer, forming a void movement blocking layer over the first gate conductive layer in the bulb-type recess pattern, and forming a second gate conductive layer over the void movement blocking layer and the first gate conductive layer.

Abstract: A phase change memory device includes a plurality of programming current driving blocks each of which is configured to provide a corresponding phase change memory cell with a programming current corresponding to input data and a programming current adjusting block commonly connected to the plurality of programming current driving blocks and configured to generate a control voltage to adjust the programming current.

Abstract: A method for fabricating a semiconductor device includes forming a gate insulation layer over a substrate, sequentially forming a silicon layer and a metal layer over the gate insulation layer, performing a first gate etching process to etch the metal layer using a gate hard mask layer, formed on the metal layer, as an etch barrier, and then partially etch the silicon layer, thereby forming a first pattern, performing a second gate etching process to partially etch the silicon layer, thereby forming an undercut beneath the metal layer, forming a capping layer on both sidewalls of the first pattern including the undercut, performing a third gate etching process to etch the silicon layer to expose the gate insulation layer using the gate hard mask layer and the capping layer as an etch barrier, thereby forming a second pattern, and performing a gate re-oxidation process.

Abstract: A balloon type stent system for treatment of obesity is disclosed. An injection expansion unit and a plurality of distribution expansion units extend in a longitudinal direction of a stent unit body formed by coupling two sheets of synthetic vinyl in the shape of a cylinder. The injection expansion unit has an expansion agent injection port, and the distribution expansion units each have a distribution injection port communicating with a distribution channel. Connection ends are partially cut in the longitudinal direction such that the expansion units are divided into an integrated expansion unit and a separated expansion unit. The injection expansion unit and the distribution expansion units constituting the separated expansion unit are bent outward to form a balloon type stent unit. A tube has a length corresponding to a lumen length of the duodenum, and the tube is connected to the stent unit body by a connection wire.

Abstract: A semiconductor device and a method for fabricating a semiconductor device are provided. The method for fabricating a semiconductor device includes forming an isolation layer over a semiconductor substrate defining first and second regions, etching the isolation layer at an edge of the first region to form a guard ring pattern, forming a buried guard ring filling the guard ring pattern, selectively etching the isolation layer of the first region to form a plurality of patterns, forming a plurality of conductive patterns in the respective patterns, and completely removing the isolation layer of the first region through a dip-out process.

Abstract: An impedance code generation circuit includes an impedance unit configured to drive a calibration node to a first level by using an impedance value determined by an impedance code, a code generation unit configured to generate the impedance code so that a voltage of the calibration node has a voltage level between a first reference voltage and a second reference voltage, and a reference voltage generation unit configured to generate the first reference voltage and the second reference voltage in response to the impedance code.

Abstract: A semiconductor memory device having read and write operations includes a discrimination signal generating unit for generating a discrimination signal during the write operation and a selective delay unit for receiving and selectively delaying a command-group signal in response to the discrimination signal.

Abstract: A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal.

Abstract: A data output circuit for a semiconductor memory device includes a first driver configured to output a first drive control signal in response to a data signal, a drive controller configured to compare a voltage level of the first drive control signal with a reference voltage and output a second drive control signal, and a second driver configured to drive an output terminal in response to the first drive control signal and additionally drive the output terminal in response to the second drive control signal.

Abstract: A semiconductor memory device includes a first data input/output unit configured to receive a normal training data, whose data window is scanned based on an edge of a source clock, in response to a training input command, and output a data in a state where an edge of the data window is synchronized with the edge of the source clock in response to a training output command, and a second data input/output unit configured to receive a recovery information training data, whose data window is scanned based on the edge of the source clock, in response to the training input command, and output a data in a state where an edge of a data window is synchronized with the edge of the source clock in response to the training output command.

Abstract: A semiconductor memory device includes a first data input circuit configured to align data inputted to a first data pad in parallel for transferring the aligned data to a first global bus and for transferring the aligned data to a second global bus in a test mode; and a second data input circuit configured to align data inputted to a second data pad in parallel for transferring the aligned data to the second global bus and to not receive data in the test mode.

Abstract: A DLL circuit includes a common delay line configured to generate a delay locked clock by selectively delaying a source clock by one or more unit delays in response to a first delay control code or a second delay control code, a clock cycle detector configured to compare a phase of the source clock with a phase of the delay locked clock in a cycle detection mode and generate the first delay control code corresponding to a delay amount of a cycle of the source clock based on a result of comparing the phases of the source and delay locked clocks, a feedback delay configured to delay the delay locked clock and output a feedback clock, and a delay amount controller configured to compare the phase of the source clock with a phase of the feedback clock in a delay locking mode and change the second delay control code based on a result of comparing the source and feedback clocks.

Abstract: A self-expandable shape memory alloy stent includes first and second wires made of super-elastic shape memory alloy. The first wire extends downwardly from the top to the bottom of the stent without interlocking with itself but extends upwardly from the bottom to the top of the stent while interlocking with itself to leave a multiplicity of rhombic spaces. Similarly, the second wire extends downwardly from the top to the bottom of the stent without interlocking with itself but extends upwardly from the bottom to the top of the stent while interlocking with itself, in such a manner as to divide the rhombic spaces formed by the first wire into four small rhombic spaces. The first wire and the second wire are woven with each other in such a manner that the second wire passes alternately below and above the first wire at intersection points.

Abstract: A method for fabricating a semiconductor device includes: forming a thin film over trenches by using a first source gas and a first reaction gas; performing a first post-treatment on the thin film by using a second reaction gas; and performing a second post-treatment on the thin film by using a second source gas.

Abstract: An internal voltage generator includes: a detection unit configured to detect a level of an internal voltage in comparison to a reference voltage; a first driving unit configured to discharge an internal voltage terminal, through which the internal voltage is outputted, in response to an output signal of the detection unit; a current detection unit configured to detect a discharge current flowing through the first driving unit; and a second driving unit configured to charge the internal voltage terminal in response to an output signal of the current detection unit.

Abstract: A semiconductor wafer includes at least one chip formed on a substrate, and a scribe line region surrounding the chip. The chip includes a device formation region, and a chip boundary region surrounding the device formation region and formed between the device formation region and the scribe line region. The chip boundary region includes a guard ring structure which physically separates the device formation region from the scribe line region. The guard ring structure includes a signal transfer element which transfers an electric signal between the device formation region and the scribe line region.

Abstract: A method for fabricating a semiconductor device through a chemical mechanical polishing (CMP) process is provided. The CMP process is performed by using a slurry. The semiconductor device fabrication method can ensure the reliability and economical efficiency of the device by performing a CMP process using a CMP slurry having a high polishing selectivity with respect to a target surface, an anti-scratch characteristic, and a high global planarization characteristic.

Abstract: A method for performing a double pattering process of a semiconductor device is provided. The method includes forming a hard mask layer having a stack structure of a first layer, a second layer and a third layer in sequence, forming a first photoresist pattern over the hard mask layer, etching the third layer to form third layer patterns by using the first photoresist pattern as an etch barrier, forming a second photoresist pattern over the third layer patterns, etching the second layer to form second layer patterns by using the second photoresist pattern and the third layer patterns as an etch barrier, removing the second photoresist pattern, and etching the first layer to form first layer patterns by using the second layer patterns as an etch barrier.

Abstract: A semiconductor integrated circuit having a multi-chip structure includes a number of stacked semiconductor chips. Each of the semiconductor chips includes a first through electrode formed through the semiconductor chip, a first bump pad formed over the semiconductor chip at a region where the first bump pad is separated from the first through electrode, a first internal circuit formed inside the semiconductor chip, coupled to the first through electrode through a first metal path, and coupled to the first bump pad through a second metal path; and a redistribution layer (RDL) formed over a backside of the semiconductor chip.

Abstract: A semiconductor package includes a wire board, a plurality of semiconductor chips configured to be stacked over the wire board and to be electrically coupled with the wire board, and at least one shielding unit configured to be formed between the plurality of semiconductor chips and to be maintained at a predetermined voltage.