Abstract: An on die thermal sensor in a semiconductor memory device includes: a reference voltage generating unit for generating a band gap voltage and generating a reference voltage by using the base band gap voltage; a voltage amplifying unit for outputting a temperature voltage by amplifying the band gap voltage; and a temperature information code generating unit for generating a temperature information code corresponding to a voltage level of the temperature voltage, wherein voltage variation of the temperature voltage is amplified as much as a preset amplifying value and a maximum voltage level of the temperature voltage is maintained lower than that of a power supply voltage used in the semiconductor memory device.
Abstract: A semiconductor device includes a through-silicon-via arranged to couple a plurality of stacked semiconductor chips, an interconnection line coupled to the through-silicon-via at one side and arranged to couple the through-silicon-via to the semiconductor chip, an internal interconnection line disposed at the other side of the interconnection line and intersected with the interconnection line, and at least one first contact disposed to couple the internal interconnection line to the interconnection line. A region of the interconnection line in which the internal interconnection line is disposed is equally divided, and an area between the divided regions is removed.
Abstract: A data input device of a semiconductor memory apparatus includes: a differential amplifier configured to compare an input to a reference voltage and output a differential signal based on the comparison; and a control circuit configured to adjust a current driving capacity of the differential amplifier by turning on a first current path connected to the differential amplifier in response to a first enable signal and turning off a second current path connected to the differential amplifier in response to a second enable signal in a standby mode, wherein, during a time that a plurality of external command signals toggle back and forth between a status of all being high signals and a status of all being low signals repeatedly, the second enable signal is controlled to be maintained at a low state signal.
Abstract: A refresh control circuit for a semiconductor memory device includes a refresh controller configured to control the number of times a refresh signal is enabled during one refresh period in response to a refresh mode entering signal which indicates the start of a refresh mode, and a mode determination signal having refresh mode information, a refresh counter configured to output a row address for a refresh operation by counting the refresh signal in response to an active signal enabled in an active mode, and a row address decoder configured to decode the row address to generate a row address selection signal for sequentially accessing word lines within a cell array.
Abstract: A semiconductor device includes a conductive layer formed in the junction region and a boundary layer arranged to wrap a side and a bottom of the conductive layer.
Abstract: A nonvolatile memory device includes a memory cell array configured to comprise memory cells coupled by bit lines and word lines, a page buffer unit configured to comprise page buffers and flag latches, wherein the page buffers, coupled to one or more of the bit lines, each are configured to comprise a plurality of latches for storing logic operation results for error correction and configured to store data read using a read voltage, and the flag latches each are configured to classify the page buffers into some page buffer groups each having a predetermined number and to store flag information indicating whether an error has occurred in each group, and an error detection code (EDC) checker configured to determine whether an error has occurred in each of the page buffer groups.
Abstract: A semiconductor memory device includes a refresh counter for counting a refresh signal and outputting a refresh address in response to an active mode signal enabled in an active mode, an external address input buffer for buffering an external address to output an internal address in response to a mode selection signal enabled in an external address refresh mode, an address selector for outputting the refresh address from the refresh counter as a selection row address in a normal refresh mode and outputting the internal address from the external address input buffer as the selection row address in the external address refresh mode in response to the refresh signal and the mode selection signal, and a row address decoder for generating a row address selection signal for sequentially accessing word lines by decoding the selection row address.
Abstract: A method for forming a hole pattern includes forming a hard mask layer for a hole pattern over an etch target layer, forming pillar patterns having a gap therebetween over the hard mask layer for a hole pattern, forming spacer patterns on sidewalls of the pillar patterns, removing the pillar patterns between the spacer patterns, and etching the hard mask layer for a hole pattern by using the spacer patterns as etch barriers.
Abstract: A method of operating a nonvolatile memory device includes reading data stored in a main cell and a flag cell using a first read voltage, the nonvolatile memory device comprising the main cell for storing data including a least significant bit (LSB) and a most significant bit (MSB), and the flag cell for determining a program state of the main cell, determining a program state of the main cell based on the data read from the flag cell, reading data stored in the main cell and the flag cell using a second read voltage if a MSB page program has been performed on the main cell, and reading data stored in the main cell using a third or a fourth read voltage based on the data read from the flag cell using the second read voltage, if a threshold voltage of the main cell shifts.
Abstract: A nonvolatile memory device including a bit line voltage supply unit configured to supply a power source voltage, a second voltage in which a second reference voltage has been subtracted from a third reference voltage, or a third voltage in which a first reference voltage has been subtracted from the third reference voltage according to data stored in a first latch unit, a second latch unit, and a third latch unit included in a page buffer, and a bit line voltage setting unit configured to transfer a voltage of 0 V or an output voltage of the bit line voltage supply unit to a bit line according to the data stored in the first, second, and third latch units.
Abstract: A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.
Abstract: A method for forming a device isolation layer of a semiconductor device or a non-volatile memory device is provided. A method for forming a device isolation layer of a semiconductor device includes: forming trenches having a first predetermined depth by etching a substrate; forming a first insulation layer having a second predetermined depth inside the trenches; forming a liner oxide layer having a predetermined thickness on internal walls of the trenches with the first insulation layer formed therein; and forming a second insulation layer for forming a device isolation layer over the substrate with the liner oxide layer formed therein, wherein the second insulation layer has a lower etch rate than that of the first insulation layer.
Type:
Grant
Filed:
May 28, 2009
Date of Patent:
October 2, 2012
Assignee:
Hynix Semiconductor Inc.
Inventors:
Jae-Hyoung Koo, Jin-Woong Kim, Mi-Ri Lee, Chi-Ho Kim, Jin-Ho Bin
Abstract: A method of performing a program verification operation in a nonvolatile memory device includes storing program data, programmed into a selected memory cell of a memory cell block, in a page buffer which is coupled to a bit line of the memory cell block via a sense node, controlling a voltage level of the sense node in response to a value of the program data, changing the voltage level of the sense node in response to a program state of the selected memory cell coupled to the bit line, and performing a program verification operation on the selected memory cell by sensing the voltage level of the sense node.
Abstract: A semiconductor device includes a pads for receiving a reference voltage and input signals from an external device, a unit gain buffer for receiving the reference voltage as an input, input buffers for identifying a corresponding one of the input signals based on an internal reference voltage outputted from the unit gain buffer, external electrostatic discharge protectors connected to a transmission path of the reference voltage and transmission paths of input signals, and internal electrostatic discharge protectors connected to the transmission path of the reference voltage and the transmission paths of the input signals.
Abstract: A fuse circuit includes a control signal generation unit configured to generate a control signal that is enabled after a moment when a power-up signal is enabled, a potential control unit configured to control potentials of both ends of a fuse in response to the control signal, and a fuse output unit configured to be initialized in response to the power-up signal and output a fuse signal in response to whether the fuse is cut or not.
Type:
Grant
Filed:
November 30, 2010
Date of Patent:
September 25, 2012
Assignee:
Hynix Semiconductor Inc.
Inventors:
Sung-Soo Chi, Ki-Chang Kwean, Woo-Young Lee
Abstract: A semiconductor device including an internal voltage generator circuit that provides an internal voltage having a different level depending on the operation speed is provided. The semiconductor device includes an internal voltage generator circuit configured to receive operation speed information to generate an internal voltage having a different level depending on the operation speed; and an internal circuit operated using the internal voltage.
Abstract: A nonvolatile memory device includes first and second registers configured to store parameters received via an input/output (IO) unit, a microcontroller configured to control an operation of the nonvolatile memory device according to the parameter stored in the first register, and a control logic unit configured to, when a parameter is received via the IO unit while the microcontroller performs an internal operation, store the received parameter in the second register.
Abstract: A semiconductor memory device includes a plurality of memory banks each having a plurality of memory cell arrays, a plurality of sense amplification units corresponding to the memory banks, configured to sense data corresponding to a selected memory cell to amplify the sensed data, and a common delay unit configured to delay a plurality of respective bank active signals activated in correspondence with the memory banks by a predetermined time to generate an operation control signal for controlling the sense amplification units.
Abstract: A method for fabricating a semiconductor device includes forming a plurality of plugs over a die region and an edge bead removal (EBR) region of a wafer, forming metal lines coupled to the plugs, removing the metal lines in the EBR region, forming an inter-layer dielectric layer over the wafer, and forming a plurality of contact holes that expose the metal lines by selectively etching the inter-layer dielectric layer through a dry etch process using a plasma etch device.
Type:
Grant
Filed:
July 9, 2010
Date of Patent:
September 18, 2012
Assignee:
Hynix Semiconductor Inc.
Inventors:
Hae-Jung Lee, Kang-Pok Lee, Kyeong-Hyo Lee
Abstract: An integrated circuit includes a counter configured to perform a counting operation and output a count code value. The integrated circuit further includes an operation controller, a digital circuit and an alignment unit. The operation controller receives the count code value and generates a first control signal and a second control signal. The first control signal is generated, when the count code value is equal to a first value, which is counted by the counter prior to a target count value. The second control signal is generated, when the count code value is equal to the target count value. A digital circuit performs a first operation based on the first control signal, and output a digital signal. An alignment unit aligns the digital signal, and outputs the aligned digital signal as a final digital signal in response to the second control signal.