Abstract: The present invention relates to a column decoder for low power consumption in a semiconductor memory apparatus. The semiconductor device according to the present invention includes a column select signal decoder, which has a driving voltage input node and uses a driving voltage, for producing a plurality of column select signals by decoding a column select control signal; and a driving voltage supply controller for controlling a supply of the driving voltage to the driving voltage input node.

Abstract: A delayed locked loop supports increased operation frequency in a semiconductor memory device. An output driver for use in a delay locked loop includes a first driving block for receiving an output from the delay locked loop to generate a first DLL clock for outputting read data corresponding to a read command, and a second driving block for receiving an output from the delay locked loop to generate a second DLL clock for reducing current consumption during a write operation, wherein the first driving block has larger delay amount than the second driving block.

Abstract: A memory device includes a delay circuit and a delay selection unit. The delay circuit delays a pulse signal to generate a delayed pulse signal. The pulse signal is used to generate a write enable signal and a read enable signal. The delay selection unit selects one of the delayed pulse signal output from the delay circuit in a test mode and the pulse signal in a normal mode.

Abstract: A semiconductor memory device includes: an input pad set configured to receive an external input signal and a reference voltage; an input buffer set configured to detect and transmit the input signal to an internal circuit of the semiconductor memory device by comparing the input signal with the reference voltage; and a reference voltage generation circuit configured to generate the reference voltage to supply the reference voltage to the input pad set and the input buffer set during a test operation, the reference voltage generation circuit being deactivated after the semiconductor memory device is packaged.

Abstract: A nonvolatile ferroelectric memory device using a silicon substrate includes an insulating layer formed in an etching region of the silicon substrate, a floating channel layer formed over the bottom word line, an impurity layer formed at both ends of the floating channel layer and including a source region formed over the insulating layer and a drain region formed over the silicon substrate, a ferroelectric layer formed over the floating channel layer, and a word line formed over the ferroelectric layer.

Abstract: An internal voltage generator stably supplies an internal voltage in a semiconductor device. The internal voltage generator includes: a first internal voltage generating means for supplying a first internal voltage which has a level corresponding to a first reference voltage using an external voltage; a second internal voltage generating means for supplying a second internal voltage which has a level corresponding to a second reference voltage using the external voltage; and a third internal voltage generating means for supplying a third internal voltage which has a level corresponding to a third reference voltage generated based on the first internal voltage, using the second internal voltage as a power source.

Abstract: An internal voltage generation circuit of a semiconductor device includes: a voltage detecting unit configured to detect a voltage level of an internal voltage output terminal to output a voltage detection signal; an oscillating unit configured to generate a first oscillation signal having a predefined frequency in response to the voltage detection signal; and a pumping unit configured to perform a charge pumping operation in response to the first oscillation signal and the voltage detection signal to output an internal voltage to the internal voltage output terminal, a period of the charge pumping operation being limited within an activation period of the voltage detection signal.

Abstract: A semiconductor memory device comprises a one-transistor (1-T) field effect transistor (FET) type ferroelectric device connected between a pair of bit lines and controlled by a word line, where a different channel resistance is induced to a channel region depending on a polarity state of a ferroelectric layer; a plurality of access transistors connected between the ferroelectric device and the pair of bit lines; and a plurality of port word lines configured to select the plurality of access transistors.

Abstract: A semiconductor memory device includes a pair of local input/output (IO) lines, a global IO line, a local driver configured to pull up/down voltage levels of the first and second local IO lines in response to input data, a global driver configured to pull up/down a voltage level of the global IO line in response to input data, and a data IO control block configured to transport output data from the local IO lines to the global driver and input data from the global IO line to the local driver.

Abstract: A semiconductor memory device is capable of controlling a delay locked loop appropriately based on operation modes, particularly in a fast power-down mode to reduce an amount of current maximally. The semiconductor memory device includes a delay-locked clock signal generating unit, a mode signal generating unit, and a delay locking control unit. The delay-locked clock signal generating unit performs a delay locking operation on a clock signal, thereby generating a delay-locked clock signal. The mode signal generating unit enables a fast precharge power-down mode signal in a fast precharge power-down mode. The delay locking control unit controls the delay-locked clock signal generating unit to be activated in a predetermined cycle in response to the fast precharge power-down mode signal.

Abstract: A one-transistor type DRAM includes a floating body storage element connected between a bit line and a source line and controlled by a word line.

Abstract: Provided are a delay locked loop (DLL) and a method for generating a divided clock therein. In the DLL, a width of a reference frequency for phase comparison can be changed depending on a magnitude of an operating frequency. In the DLL, a clock buffer receives a clock equal to an external clock and generates an internal clock. An enable clock generator generates a 1-period enable clock or a 2-period enable clock using a command signal generated for performing a predefined operation. The command signal is generated according to an address command signal inputted from an exterior. A clock divider divides the internal clock to generate a divided clock. The divided clock is controlled by the 1-period enable clock or the 2-period enable clock, such that the divided clock is made to be a 1-period based dividing clock or a 2-period based dividing clock.

Abstract: A semiconductor memory device includes a phase comparator, a delay chain, a delay controller, a fine delay chain, a delay model, a locking state detector, and a fine delay controller. The phase comparator compares a phase of a reference clock with that of a feedback clock. The delay chain delays and outputs the reference clock. The delay controller controls a delay value of the delay chain in response to the comparison result of the phase comparator. The fine delay chain outputs a delay value of a clock outputted from the delay chain. The delay model delays a clock to a modeled delay value to provide a delayed clock as the feedback clock. The locking state detector generates a locking variation signal corresponding to a phase difference between the reference clock and the feedback clock. The fine delay controller controls a fine adjustment value of the fine delay chain.

Abstract: An internal voltage generator includes: an internal voltage driving unit for supplying an internal voltage corresponding to a reference voltage maintaining a predetermined voltage level regardless of a temperature variation; and a temperature compensation current sinking unit for sinking a current generated by an internal voltage in response to a voltage level inversely proportional to a temperature.

Abstract: Provided is a pulse control device is maintained with a constant pulse width corresponding to a change of process or temperature. The pulse control device comprises a fuse set for selectively outputting a delay increase signal and a delay decrease signal that have a different state based on a cutting or non-cutting state of a fuse on which information on a change of process is programmed, and a pulse generator provided with a plurality of delay cells with predetermined time delay for selectively increasing or decreasing the number of the plurality of delay cells depending on the delay increase signal and the delay decrease signal to generate an internal clock with a pulse width corresponding to the number of the increased or decreased delay cells.

Abstract: A semiconductor memory device performs a reset operation at a wafer state by using a signal input through an address pin in a test mode. The semiconductor memory device includes a buffer for transferring a reset command in response to a reset-active signal and a test reset signal, a test-reset entry signal generation unit for generating an internal test-reset entry signal in response to the test reset signal, and a rest signal driving unit for driving an active signal of an output signal of the buffer and the internal test-reset entry signal as an internal reset signal for a reset mode entry.

Abstract: A semiconductor memory device can reduce needless current consumption when addresses are inputted. A semiconductor memory device includes a clock enable buffering unit for receiving a clock enable signal to output a buffer enable signal, an address buffer control unit for generating an address buffer control signal in response to a plurality of data output mode, and an address buffering unit for receiving an address in response to the buffer enable signal and the address buffer control signal.

Abstract: A method for forming a semiconductor device is provided. More specifically, a method for forming a bulb-shaped portion of a bulb-shaped recess gate is provided to overcome an etching process margin reduction caused by a spacer oxide film formed on sidewalls of a recess and thickly laminated to a lower part of a recess. In one aspect, a buffer dielectric film pattern is formed additionally by a plasma enhanced chemical vapor deposition (PECVD) process over a hard mask pattern, so that a sufficient process margin used for forming the bulb-shaped portion is ensured and a process margin for forming a semiconductor device is increased.

Abstract: In a multi-port memory device, a plurality of ports simultaneously access a plurality of banks through global data buses. A data conflict detector compares valid data signals input from the plurality of ports through the global data buses to the plurality of banks, and detects data conflict caused when the valid data signals are simultaneously input to the same bank.

Abstract: A semiconductor memory device can stabilize a voltage level of a normal driving voltage terminal in a normal driving operation, which is performed after an overdriving operation, even when an overdriving voltage is unstable due to environmental factors of the semiconductor memory device in the overdriving operation. The semiconductor memory device includes a bit line sense amplifier for performing an amplification operation using a normal driving voltage or an overdriving voltage to sense and amplify data applied to bit lines, a normal driving voltage compensator configured to drive a normal driving voltage terminal according to a voltage level of the normal driving voltage terminal and target normal driving voltage levels, and a discharge enable signal generator configured to generate a discharge enable signal by adjusting an activation period of the discharge enable signal according to the overdriving voltage.