Abstract: A fabricating method of a semiconductor stacking layer includes following steps. First, an amorphous silicon (?-Si) layer is formed on a substrate. Surface treatment is then performed on a surface of the ?-Si layer. After that, a doped microcrystalline silicon (?c-Si) layer is formed on the treated surface of the ?-Si layer, wherein interface defects existing between the ?-Si layer and the doped ?c-Si layer occupy an area in a cross-sectional region having a width of 1.5 micrometers and a thickness of 40 nanometers, and a ratio of the occupied area in the cross-sectional region is equal to or less than 10%. The method of fabricating the semiconductor stacking layer can be applied to a fabrication process of a semiconductor device to effectively reduce the interface defects of the semiconductor stacking layer.

Abstract: A data storage system, method and a data storage and backup system are provided. The data storage method comprises defining a local storage of the data processing system as a journal vault; storing data in the journal vault by journaling; sending the data from the journal vault to a transmitter; and transmitting the data from the transmitter to a secondary storage. The present invention enhances a write function of a low performance storage device by journaling. In a case where the present invention is applied to a backup system, the performance of the whole backup system can be improved significantly, and the backup system can be extended to a remote site easily. When a storage of a production system fails, the storage system of the present invention can be switched to “production mode” and service resumes to be provided with the shortest downtime.

Abstract: A lead arrangement suitable for an electrical connector includes a lead lane. The lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, and a ground lead positioned between the two pairs of first and second differential signal leads. Each of the first and second differential signal leads has a surface mounting segment for being soldered onto a surface pad of a circuit board. The ground lead has a via passing segment for being soldered into a through via of the circuit board.

Abstract: A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.

Abstract: The present invention relates to an ink cartridge for an ink jet printer, comprising an ink storage chamber formed by a concave housing (3) and a flexible and deformable film (2), a fluid outlet (5) connected with a fluid inlet of the printer, an information storage device (11), a locking mechanism (6) and a detection mechanism for detecting ink consumption. The detection mechanism comprises a lever component (4) positioned in the ink storage chamber and a force transmission component (10) positioned on the housing, made of deformable material and communicated with the ink storage chamber. This ink cartridge can solve the technical problems that the conventional detection mechanism of the ink cartridge of the ink jet printer is complex and low in reliability.

Abstract: A testing device suitable for testing an electronic device is provided. The electronic device has a first body and a second body, wherein the first body is suitable for rotating relative to the second body. The testing device includes a carrying platform, a fixed frame, a clamping element, a first driving element, and a second driving element. The carrying platform carries the first body. The fixed frame is pivoted to the carrying platform. The clamping element is pivoted to the fixed frame for clamping the second body. The first driving element is disposed between the carrying platform and the fixed frame for driving the fixed frame to pivot relative to the carrying platform. The second driving element is disposed between the clamping element and the fixed frame for driving the clamping element to pivot relative to the fixed frame.

Abstract: The present invention provides a rescue passage window for a passenger train, comprising an aluminum alloy outer frame, a hollow tempered glass, a movable sash, a fixed sash, a locking device, a rotating device and a sealing device, the aluminum alloy outer frame is a carrier to connect the structures of any other parts, the hollow tempered glass is inlaid on the aluminum alloy outer frame by the sealing device to form the fixed sash and the movable sash, the movable sash is suspended on the cross beam of the aluminum alloy outer frame by the rotating device to realize its connection with the aluminum alloy outer frame, reliable locking between the movable sash and the aluminum alloy outer frame is realized by the locking device, connection and sealing between the movable sash and the aluminum alloy outer frame is realized by the sealing device.

Abstract: An embedded electronic component semiconductor package structure and a packaging process thereof are provided. By providing two or more preformed building blocks, the electronic component can be assembled to the joined building blocks to obtain the embedded component semiconductor package structure.

Abstract: An encoding method for skipped macroblocks in a video image includes the steps of: adding one indication bit into a picture header for indicating a coding mode for skipped macroblocks in a current image; selecting the coding mode for a macroblock type in the current image according to the number of skipped macroblocks, if it is a run_length coding, then setting the indication bit of the picture header as a status indicating a run_length coding, and encoding the macroblock type in the image by the run_length coding mode; if it is a joint coding, then setting the indication bit of the picture header as status indicating a joint coding and encoding the macroblock type in the image by the joint coding mode of the number of skipped macroblocks and the macroblock type; finally, encoding other data in the current macroblock and writing data into a code stream.

Abstract: A connector module and a connector are provided. The connector module includes a connector and a flat cable. The connector includes a body, a terminal assembly, a cover and two protecting members. The body is formed with a connection space. The terminal assembly is disposed in the connection space. The cover is pivoted to the body and adapted to cover the connection space. The cover is adapted to be opened or closed relative to the body along a rotational path. The protecting members are pivoted to the body and respectively located on two sides of the terminal assembly, and are adapted to move between a first position and a second position. The flat cable is inserted into the terminal assembly so as to be electrically connected to the connector.

Abstract: A hollow fiber carbon membrane is provided, which has excellent gas separation performance, unbreakable flexibility and high utility. The hollow fiber carbon membrane comprises carbonized substance obtained by calcination of a hollow fiber-like material formed from a polyphenylene oxide derivative, and has an external diameter in the range of 0.08 mm to 0.25 mm. The polyphenylene oxide derivative substantially comprises repeating units represented by the following (a) and (b) (in the structural formula, R11 and R12 independently represent hydrogen atom or sulfone group, except that R11 and R12 are both hydrogen atoms), wherein the ratio A (%) of the repeating unit (b) to the repeating units (a)+(b) satisfies 15%<A<60%.

Abstract: An emotion engine and an emotion engine system adapted to an electronic device are provided. The emotion engine system includes a behavior control unit, a sensing unit, a time unit, and a behavior data bank. The behavior control unit provides a first behavior mode and a second behavior mode. When the sensing unit is enabled, it generates a trigger sensing signal or an initial sensing signal for the behavior control unit. The time unit generates a timing signal for the behavior control unit. The behavior data bank stores a plurality of behavior data, wherein the first and the second behavior modes are respectively corresponding to at least one of the behavior data. The behavior control unit determines the behavior data corresponding to the second behavior mode according to the timing signal, the trigger sensing signal and the first behavior mode. Additionally, an electronic device control method is also provided.

Abstract: A patterning method is provided. First, a material layer is formed on a substrate. Thereafter, an ashable layer is formed on the material layer. Afterwards, a patterned transfer layer is formed on the ashable layer, wherein the patterned transfer layer has a critical dimension less than the exposure limit dimension. Further, the ashable layer is patterned using the patterned transfer layer or a complementary layer of the patterned transfer layer as a mask, so as to form a patterned ashable layer. The material layer is then patterned using the patterned ashable layer as a mask.

Abstract: A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.

Abstract: A sensor for quantitative testing electromechanical properties and microstructure of nano-materials and a manufacturing method for the sensor are provided. The sensor comprises a suspended structure, pressure-sensitive resistor cantilevers, support beams, bimetallic strip and other components. When the bimetallic strip produces bending deformation, one of the pressure-sensitive resistor cantilevers is actuated and then stretches the low-dimensional nano-materials which drive the other pressure-sensitive resistor cantilever to bend. Through signal changes are outputted by the Wheatstone bridge, the variable stresses of low-dimensional nano-materials are obtained. Meanwhile, the variable strains of low-dimensional nano-materials are obtained by the horizontal displacements between two cantilevers, so the stress-strain curves of low-dimensional nano-materials are worked out. When the low-dimensional nano-materials are measured in the power state, the voltage-current curves are also obtained.

Abstract: An electrostatic discharge protection device for protecting an inner circuit, which is operated in a source voltage, is provided and includes a protection unit and a control unit. The protection unit provides a discharge path for transmitting an electrostatic signal from a pad to a ground line. According to a voltage level at a control end, the protection unit adjusts a holding voltage and a triggering voltage determining whether to conduct the discharge path. When the source voltage is supplied, the control unit transmits the input voltage to the control end of the protection unit, so as to raise the holding and the triggering voltages of the discharge path. When the source voltage is not supplied, the control unit switches the control end of the protection unit to a floating condition by the electrostatic signal, so as to lower the holding and the triggering voltages of the discharge path.

Abstract: A memory including a memory cell array, a word line decoder, a first and a second reference bit line generators are provided. The memory cell array has first and last bit lines respectively disposed at two sides of the memory cell array. The word line decoder generates a pre-word line signal. The first and the second reference bit line generators respectively detect voltage level variations of the first and last bit lines according to the pre-word line signal, so as to generate a first and a second cut-back signals. The first reference bit line generator transmits the first cut-back signal to the second reference bit line generator, the second reference bit line generator transmits the first and the second cut-back signals to the word line decoder, and the word line decoder generates a word line signal according to the first and the second cut-back signals and the pre-word line signal.