Abstract: A method for cleaning a semiconductor substrate is provided. The method initiates with introducing a liquid onto the top surface of the semiconductor substrate. Then, a bottom surface of a resonator is coupled to a top surface of a semiconductor substrate through the liquid. Next, sonic energy is transmitted through the resonator to the liquid. Then, the liquid is heated through the bottom surface of the resonator. A method for applying localized heating to a cleaning chemistry during a cleaning operation of a semiconductor substrate is also provided. The method initiates with positioning a resonator to contact a surface of a cleaning chemistry applied to a semiconductor substrate. Then, heat energy is simultaneously applied with the sonic energy through the resonator to clean the semiconductor substrate. A device for cleaning a semiconductor substrate and system for cleaning a semiconductor substrate are also provided.

Abstract: A system and method for comparing performance of two or more devices is disclosed. The method includes defining a workload. A workload object is provided. The workload object includes a transaction generator. A first test case is applied to a first device. Executing the transaction generator on a first test object produces the first test case. The first test object includes multiple first interface properties. Executing the transaction generator on the first test object produces a first set of transactions according to the first interface properties. The first set of transactions stimulates the defined workload in the first device. A second test case is applied to a second device. Executing the transaction generator on a second test object produces the second test case. The second test object includes multiple second interface properties. Executing the transaction generator on the second test object produces a second set of transactions according to the second interface properties.

Abstract: A fin structure is disclosed. The fin structure includes a first concavo-convex portion formed with a concave on a first surface of the fin in the direction of thickness and a corresponding convex on a second surface of the fin in the direction of thickness. Besides, a second concavo-convex portion formed with a first concave and second concave on the first surface of the fin in the direction of thickness and a corresponding first convex and a corresponding second convex on the second surface of the fin in the direction of thickness is included as well. Specifically, the first and second concavo-convex portions are symmetrical respect to the center of the fin. Furthermore, the second convex of the second concavo-convex portion on one fin can be exactly received by the concave of the first concavo-convex portion on another fin.

Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.

Abstract: An optical device includes a first input port, a first output port, a second output port, at least one filter, at least one reflector, a first reflection unit and a second reflection unit. The filter receives optical signals having wavelengths of &lgr;1 to &lgr;n from the first input port, selectively transmits the optical signal having a wavelength of &lgr;i, and reflects other optical signals, wherein 1≦i≦n. The first reflection unit reflects the optical signal having the wavelength of &lgr;i back to the filter, so that the optical signal having the wavelength of &lgr;i can pass through the filter and can be output from the first output port. The reflector reflects the optical signals having the wavelengths of &lgr;1 to &lgr;n except for &lgr;i from the filter.

Abstract: A memory device that is capable of automatically repairing itself includes a working cell array, a redundancy cell array, a control logic, and a lookup table. The working cell array includes a plurality of working memory cells and the redundancy cell array includes a plurality of redundancy memory cells. The control logic controls reading and writing of data to the working cell array and the redundancy cell array. The lookup table stores addresses of the data stored in the redundancy cell array. In a method for automatically repairing a defective memory cell, when a working memory cell is determined to be defective, the data is written to a redundancy memory cell and the address of the redundancy memory cell and an address of the working memory cell are updated in the lookup table. A method for accessing a memory device also is described.

Abstract: Chemical mechanical polishing systems and methods are disclosed. The system includes a polishing pad that is configured to move from a first point to a second point. A carrier is also included and is configured to hold a substrate to be polished over the polishing pad. The carrier is designed to apply the substrate to the polishing pad in a polish location that is between the first point and the second point. A first sensor is located at the first point and oriented so as to sense an IN temperature of the polishing pad, and a second sensor is located a the second point and oriented so as to sense an OUT temperature of the polishing pad. The sensing of the IN and OUT temperatures is configured to produce a temperature differential that allows monitoring the process state and the state of the wafer surface for purposes of switching the process steps while processing wafers by chemical mechanical planarization.

Abstract: The resources of a partitioned cache memory are dynamically allocated between two or more processors on a multi-processor unit (MPU). In one embodiment, the MPU includes first and second processors, and the cache memory includes first and second partitions. A cache access circuit selectively transfers data between the cache memory partitions to maximize cache resources. In one mode, both processors are active and may simultaneously execute separate instruction threads. In this mode, the cache access circuit allocates the first cache memory partition as dedicated cache memory for the first processor, and allocates the second cache memory partition as dedicated cache memory for the second processor. In another mode, one processor is active, and the other processor is inactive. In this mode, the cache access circuit allocates both the first and second cache memory partitions as cache memory for the active processor.

Abstract: A system and method of for determining multiple uniformity metrics of a semiconductor wafer manufacturing process includes collecting a quantity across each one of a group of semiconductor wafers. The collected quantity data is scaled and a principal component analysis (PCA) is performed on the collected, scaled quantity data to produce a first set of metrics for the first group of semiconductor wafers. The first set of metrics including a first loads matrix and a first scores matrix.

Abstract: A die bonder includes a conveyor, a pre-heater, at least one carrier, a paste-dispensing mechanism, a die taking/placing mechanism, and a heater. The conveyor continuously operates in a ring-shaped manner. The carrier is carried on the conveyor to position the substrate. The pre-heater heats the substrate to eliminate the moisture in the substrate. The paste-dispensing mechanism dispenses an adhesive agent onto the substrate. Then, the die taking/placing mechanism places a die onto the substrate at a position where the adhesive agent is dispensed. Finally, the heater is used to cure the adhesive agent so as to bond the die to the substrate.

Abstract: A controller fault recovery system recovers from faults that cause unscheduled stops for a distributed file system operating on an array storage system having multiple controllers. A proxy arrangement protects data integrity in the event of an unscheduled stop on just one controller in the array storage system. An atomic data/parity update arrangement protects data integrity in the event of an unscheduled stop of more than one controller.

Abstract: CMP systems and methods in which a polishing pad is moved relative to a wafer and a retainer ring implement instructions for applying required pressure to the wafer for CMP operations. Accuracy of computations of the pressures, and of conversion of the pressure to force, is improved without use of high resolution components, such as high resolution digital devices. Such improved accuracy is achieved using both digital and analog operations, and by converting values of required pressure or force from one set of units to a second set of units and then back to the first set of units. A quantization process is performed using data processed by average resolution digital devices. The process transfers both pressure/force scale and pressure/force set point data between separate processors to obtain computed values of pressure and force having acceptable accuracy, such that quantization errors are eliminated or significantly reduced.

Abstract: An adjustable suspension system includes a torsion spring, four Scott-Russell linkages for each wheel of the vehicle, and a worm gear for rotating the torsion spring. At least one of the Scott-Russell linkages for each wheel is responsive to the torsion spring to adjust the ride height of the vehicle while maintaining a substantially constant camber angle for the wheel. In one exemplary method for adjusting the ride height of a vehicle, a dynamic parameter of the vehicle is sensed and, based on the sensed dynamic parameter, the torsion spring is automatically rotated to change the orientation of the Scott-Russell linkages and thereby adjust the ride height of the vehicle. The dynamic parameter may be the speed of the vehicle, the pitch and body roll of the vehicle, or the lateral acceleration of the vehicle. The operation of automatically rotating the torsion spring may be controlled by a microprocessor.

Abstract: This invention discloses apparatus and a method for producing a moving picture including providing a digital image including the content of a multiplicity of individual images defining a view window which may be selectably superimposed over at least a portion of the digital image at a given time, and moving the view window over the digital image such as to view at least portions of the multiplicity of the individual images in a desired sequence thereby to define the moving picture.

Abstract: A system by which resource adapters may be utilized in client server computer configurations utilizing enterprise information systems is disclosed. A connector provider develops a set of Java interfaces and classes as part of its implementation of a resource adapter. These Java classes implement connector architecture specified contracts and implement EIS specific functionality provided by the resource adapter. The development of a resource adapter can also require use of native libraries that are specific to the underlying EIS. The Java interfaces and classes and native libraries, help files, documentation and other resources (as necessary) are then packaged together with a deployment descriptor to create a resource adapter module. The resource adapter module defines the contract between a connector provider and deployer for the deployment of a resource adapter in the client server environment.

Abstract: The invention provides a boost circuit including a first capacitor, a transformer, a sensing resistor and a second capacitor. The transformer has a boost side coil with its one end connected in series with the first capacitor. The sensing resistor is connected in series with the other end of the boost side coil of the transformer, and one end of the second capacitor is connected in parallel with the transformer. Also, the invention provides a power supply converter including a boost circuit and a detection circuit. The boost circuit is used to produce a voltage and output a detection signal to detect the occurrence of a spark. The detection circuit is electrically connected with the boost circuit and is used to receive the detection signal output by the boost circuit. When the detection circuit detects the detection signal contains an inrush signal, it determines that a spark is occurring within the boost circuit and outputs a control signal according to the inrush signal.

Abstract: A chemical mechanical planarization (CMP) system having a polishing pad, a carrier body for holding a wafer, a retaining ring, and an active retaining ring support is provided. The active retaining ring is defined by a circular ring having a thickness and a width. The circular ring is defined by an elastomeric material. The circular ring is configured to be placed between the retaining ring and the carrier body. The circular ring has a plurality of voids therein, and the plurality of voids are defined in locations around the circular ring. The circular ring has a compressibility level that is set by the elastomeric material and the plurality of voids.

Abstract: An assembly package includes a substrate, a first die, at least one signal transmission plate, at least one second die, a plurality of conductive wires, and a molding compound. The first die is electrically connected with the substrate using flip-chip bonding. The signal transmission plate is provided on the first die and includes an insulating layer, a layout wire layer, and a solder mask layer. The layout wire layer is formed on the insulating layer, and the solder mask layer is formed on the layout wire layer. The solder mask exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads. The second die is electrically connected with the die bonding pads using flip-chip bonding, and the wire bonding pads are electrically connected with the substrate via the conductive wires so that the signals from the second die are transmitted to the substrate.

Abstract: Methods and computer readable media generate a page file representing a compact disc label sheet having label blanks thereon for one or both of a compact disc case or a compact disc. The sheet may have a label for one or both of the compact disc case and the compact disc. The method provides such sheet, wherein the sheet supports the labels at any of a plurality of locations. The sheet with the labels supported at particular locations define a particular geometric layout configuration. One or more images may also be on the sheet. Operations of the method optically accent the particular configuration, and then scan the optically accented configuration to generate a digital representation of the sheet. All of the images are then excluded from the digital representation so that the remaining digital representation represents only the labels. The remaining digital representation is analyzed to determine the location on the sheet of the labels.

Abstract: Contention-based method and system are provided for generating reduced number of interrupts upon completing one or more commands. Each interrupt indicates the availability of data for transfer from a host adapter to a processor. The host adapter is coupled to one or more I/O devices over a bus. One or more I/O commands are received for transferring data between the processor and one or more I/O devices. Then, the contention for the bus among the I/O devices is monitored to determine how many devices are arbitrating for the bus.