Abstract: A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The metal layer interconnected with an internal substrate of the semiconductor package by blind vias laser-ablated through the encapsulation and filled with metal. The vias extend from the top surface to an internal package substrate or through the encapsulation to form bottom-side terminals. The metal layer may be formed by circuit patterns and/or terminals embedded within the encapsulation conformal to the top surface by laser-ablating channels in the top surface of the encapsulation and filling the channels with metal. A conformal coating may be applied to the top surface of the semiconductor package over the metal layer to prevent solder bridging to circuit patterns of the metal layer.

Abstract: A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and the first side surface of the substrate inward of the pads. A layer of a solder is fused to each of the pads. A lateral distance between immediately adjacent pads is selected to be greater than a lateral distance between sidewalls of the encapsulant and immediately adjacent pads, and a height of the solder layers relative to the first side surface is selected to be less than a height of the sidewalls of the encapsulant, so that misalignment of a semiconductor package stacked on the solder layers/pads is self-correcting when juxtaposed ones of the solder layers and respective solder balls of the second semiconductor package are reflowed and fused together.

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<½×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

Abstract: Unknown malicious code is heuristically detected on a host computer system. A virus signature for the malicious code is created locally on the host computer system. A blacklist on the host computer system is updated with the virus signature for the heuristically detected malicious code. Accordingly, the blacklist is updated with the virus signature of the heuristically detected malicious code without distribution of the virus signature to the general public. Further, the host computer system is scanned for other instances of the heuristically detected malicious code using the created virus signature. Accordingly, file based detection and remediation of the malicious code is achieved without requiring execution of the malicious code for detection and the associated risks.

Abstract: Financial data associated with one or more “contributing consumers” is obtained from one or more sources. The financial data includes data associated with specific financial transactions and the specific financial transactions are tagged as sharable by the contributing consumers. The financial data, and/or specific financial transactions are categorized by the contributing consumers, and/or associated with a specific purchase of a parent product and/or service. The financial data obtained from one or more contributing consumers is then aggregated, processed, and/or categorized, according to the parent product and/or service associated with the financial data. A “user consumer” then initiates a request for financial data associated with the purchase of a specified product and/or service.

Abstract: A method includes decreasing a suspicion of a negative action by an application if the application has previously performed a positive action. The positive action is an action that is never or rarely taken by malicious code. In one example, the positive action is use of a user interface element by the application to have a user interaction with a user of the computer system. By taking into consideration the positive action by the application, the occurrence of false positives is minimized.

Abstract: A method and system for providing relative financial position data whereby actual financial data, such as, but not limited to, overall financial position data, income and asset data, expense data, and transactional data, and/or demographic data for various individuals is obtained from one or more sources. A given individual's actual financial transaction data is then compared with other individuals that are determined to be similarly situated with the given individual. The given individual is then provided one or more graphical displays and/or data displays showing a comparison between the given individual's own financial data and/or position and the average financial data and/or position of similarly situated individuals.

Abstract: A system and method for determining the actual cost of a product and/or service includes a process for determining the actual cost of a product and/or service whereby financial data associated with one or more “contributing consumers” is obtained from one or more sources. The financial data includes data associated with specific financial transactions. The financial data, and/or specific financial transactions are categorized and/or associated with a specific purchase of a product and/or service. The financial data obtained from one or more contributing consumers is then aggregated, processed, and/or categorized, according to the identified and specific product and/or service associated with the financial data. A “user consumer” then initiates a request for financial data associated with the purchase of a specified product and/or service.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: A method includes creating an intercept function for a tracked DLL function of a DLL being loaded into a suspicious module. Upon a determination that the tracked DLL function is invoked, a determination is made as to whether a return address of a caller of the tracked DLL function is within a legitimate return address range. The legitimate return address range includes an address range of the intercept function and excludes an address range of the suspicious module. If the return address is within the suspicious module, the suspicious module called the tracked DLL function directly. This indicates that the suspicious module is malicious and so protective action is taken.

Abstract: A method and system for providing a healthcare expense donation network whereby a third party provided healthcare management system, such as a computing system or on-line implemented healthcare expense tacking and/or payment system provides a service through which a healthcare consumer can create a verified patient need profile indicating a need for help in paying their healthcare expenses and requesting donations to this end. At least part of the healthcare consumer's patient need profile data is verified, as well as any other financial and/or personal data associated with the submitted patient need profile that a potential donor, the patient, and/or the provider of the process for providing a healthcare expense donation network desires to be verified. Once the healthcare patient need profile data is verified, the verified patient need profile is made available to potential donors and the potential donors are provided the ability to securely make donations to the patient's healthcare expenses directly.

Abstract: A system and method for projecting a flexible spending account (FSA) allocation for a consumer may be dependent on historical healthcare-related claim information, including health insurance claim information and FSA reimbursement claim information. The method may be implemented as a web-based service or as a stand-alone software application. An FSA allocation application may identify, in historical claim information, recurring expenses predicted to be incurred in a given future time period, and may estimate an initial allocation for the time period based on these recurring expenses. The FSA allocation application may produce a recommended allocation by adjusting the initial allocation dependent on expected changes in the consumer's health insurance plan, the consumer's dependents, the health of one or more family members, tax regulations, or costs of medical services.

Abstract: A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first level RDL die assembly. The first level RDL die assembly includes a first die comprising bond pads, a first fan out support extending outwardly from sides of the first die, and first traces electrically connected to the bond pads, the first traces being supported by the first fan out support. Similarly, the second level RDL die assembly includes a second die comprising bond pads, a second fan out support extending outwardly from sides of the second die, and second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.

Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

Abstract: A method includes determining whether a transaction request has occurred during a transaction session. Upon a determination that a transaction request has occurred, the method includes parsing critical values from the transaction request and determining whether the critical values are legitimate. If the critical values are found to be suspicious instead of legitimate, the method further includes seeking approval of the transaction request from the user of the host computer system. Upon approval of the transaction request, the transaction request is allowed. Conversely, upon denial of the transaction request, the transaction request is determined to be malicious, and protective action is taken including terminating the transaction request.

Abstract: A system and method for providing scroll bar enabled bookmarks in electronic document displays whereby a bookmark enabled scroll bar is provided as a feature associated with a displayed electronic document. The bookmark enabled scroll bar includes one or more bookmark sequencing buttons. When a user desires to mark a portion of an electronic document for future reference, the user activates the bookmark enabled scroll bar and places/creates a bookmark/breakpoint at a location in the bookmark enabled scroll bar corresponding the portion of the electronic document the user wishes to bookmark for future reference. Once the user activates the bookmark enabled scroll bar and creates the bookmark, a visual indicator appears in the bookmark enabled scroll bar at the selected location corresponding to the portion of the electronic document the user wishes to bookmark for future reference.

Abstract: A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.

Abstract: A network communication corresponding to a malicious network signature associated with malicious code is detected on a host computer system. A determination is made whether or not the malicious network signature is validated as associated with a non-malicious code process. Upon a determination that the malicious network signature is not validated, the corresponding network communication is blocked, and the associated malicious code is located on the host computer system and removed from the host computer system. In some embodiments, the host computer system is further evaluated for the presence of residual artifacts of the malicious code on the host computer system.

Abstract: A system and method for providing real-time appointment rescheduling by providing access to one or more computer-based appointment scheduling systems and a virtual open appointment wait-list associated with one or more appointment slots in the scheduling systems. One or more service consumers request to be placed on the wait-list. When an appointment becomes available, wait-list data is searched to find the first consumer that is next on the wait-list and whose wait-list data is consistent with the newly available appointment. The first consumer is then contacted with a designated period of time to respond and accept the appointment. After the designated period of time has passed with no response from the first consumer, the wait-list data is searched again to find the second service consumer that is next on the wait-list. The process is repeated automatically until the newly available appointment is accepted.

Abstract: A semiconductor device is provided. The semiconductor device comprises a semiconductor die having bond pads, each of which consists of a first bond pad made of a material whose ionization tendency is relatively low and a second bond pad made of a material whose ionization tendency is relatively high. The second bond pads function as sacrificial anodes to prevent the occurrence of galvanic corrosion at the interfaces between the first bond pads and conductive wires. In an embodiment, the upper surfaces of the second bond pads are marked instead of those of the first bond pads, which reduces the number of defects in the first bond pads. A method for fabricating the semiconductor device is also provided.