Abstract: A composite comprises a first metal or alloy component having a thin refractory oxide layer on a first surface thereof. A second metal or alloy component has a second thin refractory oxide on the first surface thereof. Means are provided having a closely matched coefficient of thermal expansion to the first and second metal or alloy components for bonding the first and second thin refractory oxide layers and for electrically insulating the first component from the second component whereby thermal stress between the metal or alloy components and the bonding means is substantially eliminated.

Abstract: The present invention is directed to an interconnect tape for TAB and electronic packages made from the tape. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heatsink. The tape leads, the heat dissipating pad and the support members for the heat dissipating pad are all formed from the same electrically conductive strip.

Abstract: The present invention relates to a device for supplying extra-long lengths of continuous metal strip material to metal processing and/or manufacturing equipment. The device has a central member adapted to receive a plurality of coils of strip material and free to rotate about its longitudinal axis and a plurality of retractable spacing elements for separating adjacent coils of material without interfering with the material feed operation. To insure a supply of material sufficient to enable operation of the equipment for long periods of time, the coils stacked on the central member are interconnected.

Abstract: The process of constructing a multi-layer glass-ceramic circuit is disclosed. One or more glass-ceramic substrates is formed from a slurry or molten glass particles and ceramic which was formed at a temperature wherein the glass particles are molten and the ceramic particles are solid. After an electrical conductor pattern is applied on at least a surface of one of the glass-ceramic structures, at least two glass-ceramic structures are stacked on one another with the electrical conductor pattern therebetween and heated until the glass of each glass-ceramic structure bonds with adjacent glass so as to form the multi-layer structure.

Abstract: A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components from impinging on the housed semiconductor device.

Abstract: Multi-layer circuitry incorporating electronic elements is disclosed. The circuitry comprises a plurality of layers including a metal or alloy substrate formed with a recess on one surface. An electronic element is positioned within the recess and a second electronic element is positioned on the surface. Also, a first dielectric material layer is disposed on the surface. Further, a first layered conductive circuit pattern overlies the first dielectric material layer so as to provide circuitry over a substantial portion of the substrate. The first circuit pattern is electrically connected to the first electronic element. The first circuit pattern also has a cavity therein for receiving the second electronic element. A second layered conductive pattern overlies at least a portion of the first layered conductive circuit pattern and the second electronic element and is electrically connected to the second electronic element.

Abstract: The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.

Abstract: The present invention relates to copper-iron-nickel composite materials having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Composite materials in accordance with the present invention consist essentially of about 10% to 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred composite materials have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1.

Abstract: A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. For extreme bonding conditions, a small amount of copper oxide is dissolved into the glass matrix.

Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from about 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermetallic compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.

Abstract: A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

Abstract: A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essentially of a metal deactivator and a primary antioxidant grafted thereto without cross linking so as to maintain the thermoplastic properties.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.

Abstract: The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper alloy. A low melting point sealing glass composite is disposed between the cover member and the substrate for sealing the lead frame therebetween. The third copper alloy is precipitation hardenable and has excellent softening resistance at glass sealing temperatures as compared with other conventionally used alloys. In another embodiment, a clad composite having a core of the third copper alloy and cladding layer of a copper alloy having a low oxidation rate may be advantageously used for the lead frame.

Abstract: The present invention relates to an optical fiber cable for use in motor vehicle applications. The cable comprises at least one optical fiber encapsulated within a tubular structure formed from a metal or metal alloy having a thermal conductivity in excess of about 20 BTU/ft.sup.2 /ft/hr/.degree.F. at 68.degree. F. The metal tube surrounding the optical fiber(s) functions as a heat sink for conducting heat away from the fiber(s).

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. The glass composite is particularly useful as a semiconductor package sealant.

Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree.C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree.C.