Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: A network media gateway is disclosed with a processor configured to include a plurality of decoder channels, a plurality of overlay channels, an overlay renderer, a video mixer, and an encoder channel. A digital signal processor embedded in a network media gateway is also disclosed, and a mixing method implemented on a digital signal processor is also disclosed.

Abstract: A packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least one land pad thereon and a first dielectric layer positioned lateral to the land pad and a non-die attach region. The non-die attach region includes a second dielectric layer, wherein a thickness of the second dielectric layer is>a thickness of the first dielectric layer by at least 5 ?m. An IC die has a top semiconductor surface including active circuitry and at least one bonding conductor formed on the top semiconductor surface, and a bottom surface, wherein the bonding conductor of the IC die is joined to the land pad of the package substrate. An underfill layer is between the IC die and the die attach region.

Abstract: A system and method for protecting a wireless device including co-located network transceivers from uplink starvation are disclosed herein. A wireless device includes a first wireless transceiver and a second wireless transceiver respectively configured for communication via a first wireless network and a second wireless network. The wireless device further includes logic that determines which of the first and second transceivers is enabled to transmit at a given time. The logic determines a duration of a pending transmission via the first transceiver, and determines a predicted start time of a predicted transmission via the second transceiver. Based on the duration and the predicted start time, the logic transmits a notification signal indicating that a receiving device should refrain from transmitting on the first network for a reserved time ending after the pending transmission starts. The pending transmission starts following completion of the predicted transmission.

Abstract: Embodiments achieve favorable performance-complexity trade-offs in MIMO detection for three or more channel inputs. Some embodiments describe systems and methods comprising a leaf node predictor for receiving a processed communications stream, determining at least one channel metric corresponding to the communications stream for a given channel realization, and generating at least three instructions to output, which at least one instruction corresponds to at least one predicted best leaf node candidate for the given channel realization. Further embodiments alternatively describe systems and methods which enumerate N1 best values of a first symbol, enumerate N2(i) best values of a second symbol for an i-th best value of the first symbol, enumerate N3(i, j) best values of a third symbol for an i-th best value of the first symbol and j-th best value of the second symbol, combine enumerated best values of each symbol into a leaf-node value, and compute the cost of each leaf-node value enumerated.

Abstract: A method of manufacturing a semiconductor package includes providing a metallic leadframe having a plurality of cantilever leads and a mounting area for mounting a die, and disposing one or more non-conductive supports adjacent to a recessed surface of the cantilever leads to support the leads during die mount, wire bond, and encapsulation processes. The method further includes mounting the die in the mounting area and electrically connecting the die to the cantilever leads, and then encapsulating at least a portion of the die, the leadframe, and the supports with an encapsulant.

Abstract: Embodiments of the invention provide a method of detecting movement to aid GNSS receivers. By detecting when the user is stationary, the Doppler frequency estimation can be corrected or the SNR can be boosted more both of which lead to improved performance. The embodiments allow a GNSS receiver to process signals in when the signal level would otherwise be too low—for example indoors. The embodiments can improve performance when one or more satellites are temporarily blocked but one or more satellites are still being tracked.

Abstract: A high speed add-compare-select (ACS) circuit for a Viterbi decoder or a turbo decoder has a lower critical path delay than that achievable using a traditional ACS circuit. According to one embodiment of the invention, the path and branch metrics are split into most-significant and least-significant portions, such portions separately added in order to reduce the propagation delay.

Abstract: An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer substrate has bottom metal land pads and top metal land pads, interposer vias, and an open receptacle region formed through the interposer substrate. The substrate top surface is positioned relative to the interposer so that the molded IC die is within the open receptacle region to align the bottom metal land pads and substrate contact pads. An underfill layer is between the substrate top surface and the bottom side of the interposer substrate. A step height from the mold cap height minus a height of the top metal land pads is generally from 0 to 0.2 mm.

Abstract: A system and method for authenticating and encrypting messages for secure transmission is disclosed. A frame to be transmitted between devices comprises a frame header and a frame body. The frame body includes a security sequence number (SSN), frame payload, and message integrity code (MIC). The SSN is incremented by one for each frame transmitted using a same pairwise temporal key (PTK). A nonce is formed using the frame header and the SSN. Counter blocks Ctri and a first input block B0 are created using the nonce. Payload blocks Bi are created from the frame payload. The frame payload encrypted by sequentially applying the blocks of payload data Bi and corresponding counter blocks Ctri to a cipher function. The MIC is computed by cipher block chaining a cipher function applied to blocks B0 and Bi, and counter block Ctr0. The cipher functions all use the PTK.

Abstract: A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

Abstract: A die to die bonding system and method includes an upper die having a front side, a back side, and a fully filled thru silicon via, a portion of the fully filled thru silicon via protruding from the back side of the upper die. A lower die includes a front side, a back side, and a partially filled thru silicon via formed to define a via opening exposed to the front side of the die, a portion of the partially filled thru silicon via protruding from the back side of the lower die. An interconnect bonds an outer surface of the protruding portion of the upper die thru silicon via with an inner surface of via opening in the lower die.

Abstract: A system and method for providing a continuous wave (“CW”) ultrasonic drive signal and a B-mode ultrasonic drive signal from an ultrasonic transmitter are disclosed herein. An ultrasonic transmitter includes a first shunt transistor and a second shunt transistor. The first shunt transistor shunts positive transmitter output voltage to ground. The second shunt transistor shunts negative transmitter output voltage to ground. The shunt transistors include control inputs that, when modulated, cause the shunt transistors to produce a CW ultrasonic drive signal on a transmitter output. The ultrasonic transmitter also includes a first CW control transistor coupled to the first shunt transistor, and a second CW control transistor coupled to the second shunt transistor. The first and second CW control transistors respectively provide negative and positive CW drive voltage to the first and second shunt transistors.

Abstract: A method for providing communication in a wireless network comprising one or more simultaneously operating pico networks includes dividing UWB spectrum into a plurality of frequency bands. These bands are formed into band groups. At least one band group is assigned to each one of the pico networks. At least pne time frequency code is assigned to symbols associated with each one of the pico networks on a transmission-by-transmission basis. A system for channelization of the spectrum includes a frequency-synthesized oscillator and a time frequency code generator configured to assign time-frequency codes to successive transmissions of a pico network such that the successive transmissions are transmitted in all frequency bands of a band group assigned to the pico network.

Abstract: A semiconductor device includes an integrated circuit (IC) die including a substrate, and at least one through substrate via (TSV) that extends through the substrate to a protruding integral tip that includes sidewalls and a distal end. The protruding integral tip has a tip height between 1 and 50 ?m. A metal layer is on the bottom surface of the IC die, and the sidewalls and the distal end of the protruding integral tips. A semiconductor device can include an IC die that includes TSVs and a package substrate such as a lead-frame, where the IC die includes a metal layer and an electrically conductive die attach adhesive layer, such as a solder filled polymer wherein the solder is arranged in an electrically interconnected network, between the metal layer and the die pad of the lead-frame.

Abstract: Embodiments of the invention provide methods for maximizing the bandwidth utilization in the uplink of a communication system supporting time division multiplexing between unicast and multicast/broadcast communication modes during transmission time intervals in the downlink of a communication system. This is accomplished by multiplexing at least unicast control signaling for UL scheduling assignments in TTIs supporting the multicast/broadcast communication mode. Moreover, multiplexing of unicast control signaling can also be accomplished by splitting a symbol of the multicast/broadcast TTI into two shorter symbols with the first of these two shorter symbols carrying at least unicast control signaling and the second of these shorter symbols carrying multicast/broadcast signaling.

Abstract: Various exemplary embodiments provide probes, systems and methods for measuring an effective electrical resistance/resistivity with high sensitivity. In one embodiment, the measuring system can include an upper probe set and a similar lower probe set having a sample device sandwiched there-between. The device-under-test (DUT) samples can be sandwiched between two conductors of the sample device. Each probe set can have an inner voltage sense probe coaxially configured inside an electrically-isolated outer current source probe that has a large contact area with the sample device. The measuring system can also include a computer readable medium for storing circuit simulations including such as FEM simulations for extracting a bulk through-plane electrical resistivity and an interface resistivity for an effective electrical z-resistivity of the DUT, in some cases, having sub-micro-ohm resistance.

Abstract: A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include two-dimensional arrays of spots (401) comprising a central area (402) below the original surface (400) and a piled ring (403) above the original surface. The piled ring (403) consists of the leadframe material in amorphous configuration.

Abstract: A timing skew estimation system is disclosed that includes a plurality of interleaved analog-to-digital converter circuits (ADCs), a timing mismatch estimation unit, and a correction unit. The timing mismatch estimation unit calculates a correlation between each of the plurality of ADCs. Then the timing mismatch estimation unit calculates a cost function for each of the plurality of ADCs, except the reference ADC. The timing mismatch estimation unit further calculates a gradient for each of the plurality of ADCs, except the reference ADC.

Abstract: Systems and methods for providing multiple-input multiple-output (MIMO) detection, comprising a leaf node predictor for receiving a processed communications stream, computing at least one channel metric corresponding to the communications stream for a given channel realization by optimizing a predetermined probability, and analytically generating at least one parameter to output, which at least one parameter corresponds to at least one predicted best leaf node candidate for the given channel realization. The leaf-node predictor may generate, in real-time and without using a look-up table, at least one parameter directly from a given channel metric. Some embodiments analytically generate at least one parameter value for use by a MIMO detector corresponding to a channel metric and store the generated at least one parameter value and corresponding channel metric in a look-up table.