Abstract: The present invention provides an HDP-CVD tool using simultaneous deposition and sputtering of doped and undoped silicon dioxide capable of excellent gap fill and blanket film deposition on wafers. The tool of the present invention includes: a dual RF zone inductively coupled plasma source; a dual zone gas distribution system; temperature controlled surfaces within the tool; a symmetrically shaped turbomolecular pumped chamber body; a dual cooling zone electrostatic chuck; an all ceramic/aluminum alloy chamber; and a remote plasma chamber cleaning system.

Abstract: A method and apparatus for forming thin copolymer layers having low dielectric constants on semiconductor substrates includes in situ formation of p-xylylenes, or derivatives thereof, from solid or liquid precursors such as cyclic p-xylylene dimer, p-xylene, 1,4-bis(formatomethyl)benzene, or 1,4-bis(N-methyl-aminomethyl)benzene. P-xylylene is copolymerized with a comonomer having labile groups that are converted to dispersed gas bubbles after the copolymer layer is deposited on the substrate. Preferred comonomers comprise diazocyclopentadienyl, diazoquinoyl, formyloxy, or glyoxyloyloxy groups.

Abstract: An apparatus for positioning an object at multiple positions within an enclosure has a moveable positioning member attached to a linear motor, both of which are positioned within the enclosure. The moveable positioning member is adapted to receive and support the object. A control signal directs the motion of the linear motor which moves the moveable positioning member and, thus, the object. An insulated conductor extends through the wall of the enclosure and allows electrical communication through the enclosure wall. The insulated conductor communicates with a power supply and a control mechanism exterior the enclosure. A flexible connection line, adapted to avoid contact with the enclosure, provides communication between an insulated conductor and the linear motor so that the linear motor is in communication with the power supply and the control mechanism.

Abstract: A polymer film comprising at least first and second contiguous and coextruded portions, wherein the first portion is extruded from a first polymer composition containing a filler material in an amount sufficient to increase the water vapor permeability of the first portion relative to the second portion, and the second portion is extruded from a second polymer composition such that a tensile strength of the second portion is greater than the tensile strength of the first portion. Such polymer films allow for highly vapor permeability, while providing portions with sufficient strength to allow for taping or attachment of fastening devices.

Abstract: The present invention generally provides a precleaning process prior to metallization for submicron features on substrates. The method includes cleaning the submicron features with radicals from a plasma of a reactive gas such as oxygen, a mixture of CF.sub.4 /O.sub.2, or a mixture of He/NF.sub.3, wherein the plasma is preferably generated by a remote plasma source and the radicals are delivered to a chamber in which the substrate is disposed. Native oxides remaining in the submicron features are preferably reduced in a second step by treatment with radicals from a plasma containing hydrogen. Following the first or both precleaning steps, the features can be filled with metal by available metallization techniques which typically include depositing a barrier/liner layer on exposed dielectric surfaces prior to deposition of aluminum, copper, or tungsten. The precleaning and metallization steps can be conducted on available integrated processing platforms.

Abstract: Vacuum CVD chambers are disclosed which provide a more uniformly deposited thin film on a substrate. The chamber susceptor mount for the substrate is heated resistively with a single coil firmly contacting the metal of the susceptor on all sides, providing uniform temperatures across the susceptor mount for a substrate. A purge gas line is connected to openings in the susceptor outside of the periphery of the substrate to prevent edge and backside contamination of the substrate. A vacuum feed line mounts the substrate to the susceptor plate during processing. A refractory purge guide, or a plurality of placement pins, maintain a fixed gap passage for the purge gases to pass alongside the edge of the wafer and into the processing area of the chamber. An exhaust pumping plate improves the uniformity of exhaustion of spent gases from the chamber.

Abstract: An electrostatic chuck including a body of ceramic and a metal backing portion for mounting the chuck directly to a metal pedestal and a process of manufacturing the electrostatic chuck using sintering. The electrostatic chuck contains a metal backing portion having at least one hole extending therethrough and the body of ceramic includes at least one portion extending through the hole.

Abstract: A spectrometer and method of spectroscopy are provided for surface analysis. The spectrometer comprises an energy analyser for analysing the energies of charged particles liberated from a sample, a lens arranged to project a diffraction image of the analysis area at the image plane of the lens and a detector for detecting the charged particles. The analyser and lens are arranged to generate an image at the detector in which the charged particles are distributed along a first direction according to their emission angles and are distributed along another direction according to their energies. The detector is arranged to detect the distribution of charged particles in the image along the first direction to provide angle resolved energy spectra.

Abstract: A method and apparatus for discharging a residual charge from an electrostatic chuck having one or more electrodes. The discharge process involves exposing a surface of the electrostatic chuck to energetic particles such as photons. The discharge apparatus includes a source of energetic particles as part of a semiconductor wafer processing system controlled by a computer. The source of energetic particles may be lamps such as "bakeout" lamps that are generally located within the process chamber. Photons in the form of infrared radiation from the lamps excite certain dopant atoms within the chuck material causing the material to exhibit the photoconductive effect. Such a photoconductive state will allow any residual charge on the surface of the chuck to be conducted away through the chuck electrodes.

Abstract: The present invention provides a vacuum chamber that reduces the amount of time required to draw a vacuum after replacing consumables or performing routine maintenance by preserving the vacuum in a portion of the chamber. More particularly, the chamber isolates a frequently replaced consumable or component in a first portion of the chamber so that only the first portion of the chamber is exposed to the surrounding environment and the volume of gas or air that must be re-evacuated is reduced. A gate valve is provided to form a seal with a valve seat that is either formed into the chamber wall or provided by a valve body. Once the second portion is sealed, a lid to the first portion may be opened for access.

Abstract: The invention relates to an apparatus and process for the vaporization of liquid precursors and deposition of a film on a suitable substrate. Particularly contemplated is an apparatus and process for the deposition of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules.

Abstract: The invention provides generally a method and an apparatus for in situ cleaning of a surface in a semiconductor substrate processing chamber which operates quickly and reduces the downtime for chamber cleaning. The apparatus comprises an ultraviolet (UV) radiation plate moveable between a cleaning position and a storage position and at least one UV radiation source disposed on the UV radiation plate. Preferably, the apparatus includes a reflector disposed adjacent the UV radiation source to focus emitted UV radiation and a rotary actuator pivotally attached to a transport arm to move the UV radiation plate between the cleaning position and the storage position. The method comprises: providing a UV radiation plate having at least one UV radiation source disposed thereon, moving the UV radiation plate into a cleaning position, introducing a cleaning gas into the processing chamber and exposing the surface to UV radiation.

Abstract: Method and apparatus for restoring a support surface of a substrate support to a pre-process condition. The method comprises the steps of providing a surrogate substrate on the degraded support surface, providing the surrogate substrate with a ground connection and establishing an electric field between the support surface and the surrogate substrate to remove accumulated charges in the support surface. The apparatus comprises a process chamber having a surrogate substrate on a the support surface and connected to ground. The surrogate substrate is a semiconductor wafer or a plate or sheet of metallic material. The ground connection is established by striking a plasma that contacts the surrogate substrate and an electrical ground reference. The electric field established between the support surface and the surrogate substrate "pushes" any accumulated charges out of the support surface. Removal of the accumulated charges improves and extends the chucking ability of the support surface.

Abstract: The invention provides a vacuum processing system comprising a vacuum processing chamber and a turbo-molecular pump having a rotor and/or stator comprised of metal matrix composites. Another aspect of the invention provides a turbo-molecular pump having a rotor and/or a stator comprised of metal matrix composites. Because metal matrix composites are able to withstand higher operating temperatures than the aluminum alloys currently used in rotors and stators, the rotor vanes and the stator vanes that are made of metal matrix composites can provide a higher exhaust capacity with faster rotor rotations.

Abstract: The invention relates to an apparatus and process for the vaporization of liquid precursors and deposition of a film on a suitable substrate. Particularly contemplated is an apparatus and process for the deposition of a metal-oxide film, such as a barium, strontium, titanium oxide (BST) film, on a silicon wafer to make integrated circuit capacitors useful in high capacity dynamic memory modules.

Abstract: Method and apparatus for reducing contamination of a substrate in a substrate processing system. The apparatus has a substrate support, a gas directing shield circumscribing the substrate support and a shadow ring disposed vertically above the substrate support and gas directing shield for retaining the substrate. The gas directing shield and substrate support define an annular channel that is provided with an edge purge gas. The edge purge gas imparts a force at the edge of a substrate resting on the substrate support the lifts it off the substrate supports and against the shadow ring. The shadow ring further has a plurality of conduits extending from its upper surface to its sidewall to provide a path for the edge purge gas to vent and to impede the flow of process gases under the backside and around the edge of the substrate.

Abstract: A mask for covering a substrate for performing capacitance-voltage measurements on the substrate is a full-faced mask covering substantially all of the substrate and having a thin outer section and a thicker inner section, so that the outer section is thin enough to permit desired clearance tolerances when inserting the substrate/mask assembly into or removing it from a cassette, and the inner section is thick enough to provide structural stability to the mask to ensure proper contact between the mask and the test substrate. The mask may include a ring with one or more strips across the ring with holes in the strips for target material deposition. In an alternative embodiment, the mask may be a disk with holes at various locations across the disk. In either embodiment, the mask generally conforms to the shape of the substrate, so that the clamp ring of the PVD chamber seats on the mask or on the substrate, so little or none of the plasma or sputtered material can escape between the substrate and clamp ring.

Abstract: The present invention generally provides a modular substrate cassette used to store substrates. The modular substrate cassette is designed to use different components that may be collectively assembled into different cassette configurations while substantially reducing or eliminating custom and complex fabrication costs. The modular substrate cassette may accommodate multiple substrate sizes, including 100 mm, 200 mm, and 300 mm substrates, as well as a variety of substrate shapes, including circular, square, and rectangular. In a preferred embodiment, the substrate supports use materials from standard geometries of bar stock and/or plate stock to minimize the costs of production. Also, in a preferred embodiment, the substrate cassette is designed to allow multi-directional access to substrates stored in the cassette.

Abstract: The present invention provides methods and apparatus for separating fluids using one or more hydrocyclone separators and a mixer disposed upstream from the hydrocyclone separators. The mixers are preferably static or rotary type mixers which mix the fluids prior to their delivery into the hydrocyclone separator. Using mixers provides a more homogeneous mixture of oil and water to the hydrocyclone separators in order to increase the efficiency of the separation. By controlling the degree of mixing it is also possible to substantially avoid the formation of emulsions.

Abstract: A vacuum processing system may have a two-piece slit valve door, including a seal plate mounted on a mounting member, for closing the slit valve in a vacuum chamber. The seal plate, the piece that actually contacts the slit valve, may have a molded-in-place seal for making the contact and preventing metal-to-metal contact between the door and the valve. The seal may have a parabolic profile and be adhesively bonded within a groove in order to enhance its compressive and sealing capabilities. The seal plate may be removable for ease of service or replacement. Any particles generated by metal-to-metal contact between the seal plate and its mounting member may be captured by an O-ring statically sealed around the periphery between the two pieces.