Patents Represented by Attorney, Agent or Law Firm Trask, Britt & Rossa
  • Patent number: 6117793
    Abstract: A layered trace configuration comprising a conductive trace capped with a silicide material which allows for removal of oxide polymer residues forming in vias used for interlayer contacts in a multilayer semiconductor device and eliminates or greatly reduces the formation of metal polymer residues in the vias. The formation of an interlayer contact according to one embodiment of the present invention comprises providing a trace formed on a semiconductor substrate and a silicide layer capping the conductive layer. An interlayer dielectric is deposited over the silicide capped trace and the substrate. A via is etched through the interlayer dielectric, wherein the etch is selectively stopped on the silicide layer. Any residue forming in the via is removed and a conductive material is deposited in the via to form the interlayer contact.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: September 12, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Sanh D. Tang
  • Patent number: 6112836
    Abstract: A rotary drag bit being suitable for directional drilling. The bit includes a bit body from which extend radially-oriented blades carrying PDC cutters. The blades extend to primary gage pads, above which secondary gage pads are either longitudinally spaced or rotationally spaced, or both, defining a gap or discontinuity between the primary and secondary gage pads through which drilling fluid from adjacent junk slots may communicate laterally or circumferentially. Longitudinally leading edges of the secondary gage pads may carry cutters for smoothing the sidewall of the borehole. The tandem primary and secondary gage pads provide enhanced bit stability and reduced side cutting tendencies. The discontinuities between the primary and secondary gage pads enhance fluid flow from the bit face to the borehole annulus above the bit, promoting formation cuttings removal. The tandem gage arrangement also has utility in conventional bits not designed specifically for directional drilling.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: September 5, 2000
    Assignee: Baker Hughes Incorporated
    Inventors: John R. Spaar, James A. Norris, Christopher C. Beuershausen, Rudolf C. O. Pessier, Michael P. Ohanian, Roland Illerhaus, Jeffrey B. Lund, Michael L. Doster
  • Patent number: 6112940
    Abstract: An apparatus for dispensing, receiving or storing packaged integrated circuit devices using at least one vertically-oriented, removable, tubular magazine disposed above a controllably-driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: September 5, 2000
    Assignee: Micron Electronics, Inc.
    Inventor: Robert L. Canella
  • Patent number: 6114756
    Abstract: A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated capacitor may be placed as a LOC type lead frame member between electrical bond pads on the die. The capacitor sections comprise Vcc and Vss bus bars.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: September 5, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Larry D. Kinsman
  • Patent number: 6114627
    Abstract: An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die, extending from the bonding location of the die and the edge of the die, in order to prevent filler particles from lodging between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The seal created by the underfill material reduces point stresses on the active surface of the die usually caused by the filler particles. The decreased flexure in the leads further enhances the locking of the leads in position with respect to the die.
    Type: Grant
    Filed: August 20, 1997
    Date of Patent: September 5, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Walter L. Moden
  • Patent number: 6113572
    Abstract: A catheter connection system is defined by a rigid, tubular stem attached at a proximal end thereof to a medical device. The stem has a plurality of engagement barbs encircling and radially, outwardly extending on an exterior surface of the stem. The engagement barbs can be configured having a variety of different sizes and positions. A locking barb also encircles and radially, outwardly extends on the surface of the stem between the medical device and the engagement barbs. A variety of fastening assemblies are provided for inwardly compressing a portion of a body wall of a selected catheter against the engagement barbs on the stem, when the stem is received in the lumen of the selected catheter. The fastening assemblies create a mechanical joinder and liquid-tight seal between the selected catheter and the stem. The selected catheter can be chosen from one of three or more catheters each having a combination of size and material composition distinct from the other of the catheters.
    Type: Grant
    Filed: February 12, 1996
    Date of Patent: September 5, 2000
    Assignee: C. R. Bard, Inc.
    Inventors: Robert Nelson Gailey, Kelly B. Powers, Kelly J. Christian, Kenneth Arden Eliasen, Donald James Jones
  • Patent number: 6108963
    Abstract: A device which functions to influence, either by attracting or repelling marine life includes a mechanism structured and arranged to shuttle a slug, i.e. an iron ball or other element having magnetic properties, between first and second positions in a manner which creates sound audible to marine life, such as fish, which it is desired to attract or repel. In one embodiment, an iron ball is shuttled between an electromagnet and a permanent magnet attached to an acoustic amplification plate.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: August 29, 2000
    Assignee: SoundBite Corporation
    Inventors: Michael Lucas, Thomas J. Barron
  • Patent number: 6105846
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: August 22, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Patent number: 6107677
    Abstract: An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: August 22, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Aaron Schoenfeld, Jerry M. Brooks
  • Patent number: 6107680
    Abstract: A structure and method for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die or dice atop an EMR-penetrable element using an adhesive layer, the stickiness, adhesiveness or coefficient of friction of which is alterable by exposure to EMR of a predetermined wavelength range, such as ultraviolet light. Once the structure reaches its destination, prior to removal of the dice, the adhesive layer is exposed to EMR, such as ultraviolet light, through the element. This exposure reduces the stickiness, adhesiveness, or coefficient of friction of the adhesive to facilitate die removal. The EMR-sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and modified die-pac designs having UV light penetrable die transport portions, or tape-and-reel type die transport structures.
    Type: Grant
    Filed: September 8, 1998
    Date of Patent: August 22, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Joe W. Hodges
  • Patent number: 6107214
    Abstract: A method for depositing highly conformal silicate glass layers via chemical vapor deposition through the reaction of TEOS and O.sub.3 is disclosed. The entire method, which can be performed in a single cluster tool and even in a single chamber, begins by placing an in-process semiconductor wafer having multiple surface constituents in a plasma-enhanced chemical vapor deposition chamber. A "clean" silicate glass base layer that is substantially free of carbon particle impurities on an upper surface is then formed on the wafer surface in one of two ways. The first employs plasma-enhanced chemical vapor deposition using TEOS and diatomic oxygen gases as precursors to first deposit a "dirty" silicate glass base layer having carbon particle impurities imbedded on an upper surface.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: August 22, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Ravi Iyer
  • Patent number: 6104645
    Abstract: A row repair system for replacing a defective primary memory row with a redundant memory row within an entire section of an integrated circuit memory chip. The system comprises a dedicated match circuit for each redundant row in a given section. The match circuit analyzes incoming address information to determine whether the address corresponds to a memory location in a specific defective row in any one of a number of sub-array blocks within the section. When such a critical address is detected, the match circuit activates circuitry which inhibits access to the defective row and enables access to its dedicated redundant row.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: August 15, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Adrian Ong, Paul S. Zagar
  • Patent number: 6101846
    Abstract: A process for fabricating a face plate for a flat panel display such as a field emission cathode type display, the face plate having integral spacer support structures is disclosed. Also disclosed is a product made by the aforesaid process. The support structures are designed to be load bearing so as to prevent implosion of a planar, transparent face plate toward a parallel spaced-apart base plate when the space between the face plate and the base plate is sealed at the edges of the display to form a chamber, and the chamber is evacuated in the presence of atmospheric pressure outside the chamber. Unlike most spacer support structures proposed for such flat panel displays, the support structures are made from the same material as the substrate from which the face plate is fabricated. For a preferred embodiment of the process, a perforated laminar template is sealably sandwiched between a laminar silicate glass substrate and a manifold block to form a temporary sandwich assembly.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: August 15, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Jason B. Elledge
  • Patent number: 6103547
    Abstract: Devices and methods for reducing lead inductance in integrated circuit (IC) packages. More specifically to an integrated circuit package configuration for high speed applications where the inductance of the leads is reduced or minimized in high capacity semiconductor device packages. The integrated circuit package assembly comprises a substrate, semiconductor device, insulating covering or coating, if desired, a semiconductor device retainer, lead frame, and wire bond interconnections.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: August 15, 2000
    Assignee: Micron Technology, Inc.
    Inventors: David J. Corisis, Brent Keeth
  • Patent number: 6105152
    Abstract: Methods for testing semiconductor memory devices are performed during the writing and reading of test information to and from memory cells. During the tests, operational parameters such as commencement of timing signals and the voltage levels thereof which are employed to activate components of a memory device are controllably adjusted in an effort to intentionally imbalance or alter the voltage differential appearing on the bit lines. If the memory device has a defect, the voltage levels on the bit lines are altered to such a degree that the sense amplifier, although properly sensing the voltage differential, incorrectly senses the intended test information stored in the memory cells. As the parameters are manipulated, the test information written into the memory cells is compared with the test information written from the memory cell and error signals are generated when the information is not the same.
    Type: Grant
    Filed: March 20, 1997
    Date of Patent: August 15, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Kevin G. Duesman, Edward J. Heitzeberg
  • Patent number: 6101870
    Abstract: A device for monitoring the air pressure of a wheel. The device prevents a decrease in the transmission level of radio waves caused by impedance mismatch between an antenna, which radiates the radio waves, and a circuit, which produces signals that are to be radiated as the radio waves. The device includes a valve stem through which air is charged. The valve stem extends through a vehicle wheel. A transmitter is secured to the wheel to transmit a signal representing the air pressure of the wheel to a receiver installed in the vehicle. The device further includes a case attached to the wheel. The case is connected to the valve stem. An electric circuit is accommodated in the case to detect the air pressure and convert the detected pressure to an electric signal. An antenna radiates the signal produced by the electric circuit and is arranged about the valve stem. A conveying mechanism conveys the signals produced by the electric circuit to the antenna.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: August 15, 2000
    Assignee: Pacific Industrial Co., Ltd.
    Inventors: Michiya Kato, Katsumi Orito
  • Patent number: 6101375
    Abstract: A method for reducing the dynamic range required of an automatic gain control (AGC) circuit in a remote transceiver in 2-way communication between local and remote transceivers. By repeatedly transmitting a signal with successively increasing power from one transceiver until a response is received from the other transceiver, the dynamic range and hence complexity of the receiving circuit may be greatly reduced. The operating power of the remote transmitter can then be adjusted according to the level used by the local transmitter, thereby promoting the efficent use of the remote's power supply.
    Type: Grant
    Filed: July 7, 1998
    Date of Patent: August 8, 2000
    Assignee: Micron Technology, Inc.
    Inventors: John R. Tuttle, Charles K. Snodgrass
  • Patent number: D429315
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: August 8, 2000
    Assignee: Pacific Industrial Co., Ltd.
    Inventors: Satoru Okada, Kiyotaka Kasugai
  • Patent number: RE36817
    Abstract: A reaming apparatus for enlarging a borehole, including a tubular body having one or more longitudinally and generally radially extending blades circumferentially spaced thereabout. Each of the blades carries highly exposed cutting elements, on the order of fifty percent exposure, on its profile substantially all the way to the gage. At least one of the blades is a primary blade for cutting the full or drill diameter of the borehole, while one or more others of the blades may be secondary blades which extend a lesser radial distance from the body than the primary blade. A secondary blade initially shares a large portion of the cutting load with the primary blade while the borehole size is in transition between a smaller, pass through diameter and drill diameter. It functions to enhance the rapidity of the transition while balancing side reaction forces, and reduces vibration and borehole eccentricity.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: August 15, 2000
    Assignee: Baker Hughes Incorporated
    Inventors: Paul E. Pastusek, Corey S. Thayn
  • Patent number: RE36843
    Abstract: Improved polymer batteries and improved methods of manufacturing such polymer batteries are provided. One improved method of manufacture involves the formation of a laminated array structure that includes a number of individual battery cells. After formation of the laminated array the individual batteries are singulated from the array by cutting, shearing or stamping. Other manufacturing improvements include the use of a printing process (e.g. stenciling) to form the cathodes, the use of permanent mask layers to contain and insulate the cathodes and anodes, and the use of a molten lithium deposition process for forming the anodes.
    Type: Grant
    Filed: September 26, 1996
    Date of Patent: August 29, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Rickie C. Lake, John R. Tuttle