Abstract: Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.

Abstract: The invention includes semiconductor processing methods, including trench isolation. In one implementation, an oxide layer is deposited over a substrate. The deposited oxide layer is exposed to a chlorine containing gas effective to getter metals outwardly therefrom. In one implementation, a dielectric layer, for example silicon dioxide, is plasma enhanced chemical vapor deposited over a substrate within a chamber comprising an internal metal surface under conditions effective to incorporate metal from the chamber surface within the dielectric layer. The dielectric layer is then exposed to a chlorine containing gas effective to getter at least some of said metal outwardly therefrom. In one implementation, a trench isolation method comprises forming a series of isolation trenches into a semiconductive substrate. Silicon dioxide is chemical vapor deposited to within the trenches, with the silicon dioxide comprising metal impurity therein.

Abstract: In one aspect, the invention encompasses a semiconductor processing method of forming a material over an uneven surface topology. A substrate having an uneven surface topology is provided. The uneven surface topology comprises a valley between a pair of outwardly projecting features. A layer of material is formed over the uneven surface topology. The layer comprises outwardly projecting portions over the outwardly projecting features of the surface topology and has a gap over the valley. The layer is etched, and the etching forms protective material within the gap while removing an outermost surface of the layer. The etching substantially does not remove the material from the bottom of the gap. In another aspect, the invention encompasses a semiconductor processing method of forming a material over metal-comprising lines. A first insulative material substrate is provided. A pair of spaced metal-comprising lines are formed over the substrate.

Abstract: The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna.

Abstract: Systems and methods for playing live casino-type card games, in particular blackjack. The systems include a presentation unit which has video displays which portray virtual playing cards and other information at gaming tables attended by live participants. Shuffling, cutting, dealing and return of playing cards are accomplished using data processing functions within an electronic game processor or processors which enable these functions to be performed quickly and without manual manipulation of playing cards. The invention allows casinos to speed play and reduce the risk of cheating while maintaining the attractive ambiance of a live table game.

Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract: A log positioning and securing device is described in which a frame supports a log receiving trough with sides positioned to receive and support a log along a longitudinal plane. A log clamp including a pair of log clamp members is movably mounted to the frame. The clamp members are driven to move between an inoperative position in which the log clamp members are separated in a log receiving position, and a log clamping position in which the log clamp members are moved toward one another and toward the longitudinal plane, to clamp and hold a log securely along the rough, with the centerline of the log parallel to or coincidental with the plane.

Abstract: The invention encompasses methods of treating semiconductive material wafers and ingots to alleviate slippage within monocrystalline lattices of the wafers and ingots. The invention further encompasses monocrystalline semiconductive material wafers and monocrystalline semiconductive ingots which are treated to alleviate slippage within a crystalline lattice of the wafers and ingots. In one aspect, the invention includes a method of forming a semiconductive material wafer comprising: a) forming an ingot of semiconductive material, said ingot comprising an outer periphery; b) forming a wafer from the ingot, the wafer comprising said outer periphery; and c) doping said outer periphery with strength-enhancing dopant atoms.

Abstract: Disclosed is an electrical connector assembly wherein an electrical signal transformer is mounted to or within the electrical connector assembly. The electrical connector assembly is mounted to a printed circuit board utilized in a telecommunication network digital cross-connect module. The electrical connector assembly is preferably a BNC, a TNC type or a 1.6/5.6 of electrical connector.

Abstract: A fuel injector comprising a valve needle which is slidable within a bore, a surface associated with the valve needle defining, in part, a control chamber which communicates, through a restriction, with a supply passage. The fuel injector also includes an injection control valve controlling communication between the control chamber and a low pressure reservoir, and a drain valve controlling communication between the supply passage and the low pressure reservoir. The injection control valve and the drain valve include respective armatures moveable under the influence of a common electromagnetic actuator.

Abstract: Communications between an RFID interrogator and an RFID transponder require that no more than one transponder be present in the reading range of the interrogator and transmitting into motion at any given time. If multiple transponders are in the field, then a collision between the return signals of the transponders occurs, rendering the signals unreadable. A method to resolve the collisions and allow for accurate transmission of each transponder's data is given. This method is especially effective over other methods when the transponder is a read-only type of device, whereby there is no communications interrogator on board the read-only transponder.

Abstract: Methods of processing wireless communication include providing at least one interrogator configured for transmitting and receiving wireless communication data. A plurality of identification devices are provided and are configured for receiving wireless communication data transmitted by the interrogator. Responsive to receiving such communication data, the devices are capable of generating and transmitting a reply back to the interrogator. Preferably, transmitted replies are delayed for different determinable amounts of time which enables the interrogator to detect multiple replies. In a preferred implementation, the wireless communication is radio frequency communication. In another preferred implementation, each device is capable of calculating its own delay utilizing a random value generator. Related system circuitry is described.

Abstract: A snowboard instructional attachment is described including a slider plate that is formed to include a top surface and a bottom surface. The top surface is configured to be secured to a base surface of a snowboard and the bottom surface is configured to engage and slide across snow to prevent the side edge of the snowboard from digging into the snow. The slider plate further includes a leading edge joining the bottom surface. It extends upwardly from the bottom surface and is configured to extend above the top deck surface of a snowboard when mounted thereto. A clamp is preferably mounted to the slider plate and is configured to releasably secure the slider plate to a snowboard with the top surface engaging the base surface of the snowboard.

Abstract: A fuel injector includes a first needle, and a second needle slidable within a passage formed in the first needle. The needles are engageable with respective seatings to control fuel delivery through respective groups of outlet openings. A load transmitter is provided whereby movement of the first needle can be transmitted to the second needle. An alternative injector includes a second needle provided with formations defining an integral resilient biasing arrangement.

Abstract: A pump injector comprising a pumping chamber, a valve needle controlling communication between the pumping chamber and one or more outlet openings, and a spill valve controlling communication between the pumping chamber and a low pressure fuel reservoir, in use. The pump injector also comprises an inlet non-return valve arranged to permit fuel to flow from the fuel reservoir to the pumping chamber, in use, but substantially preventing fuel flow in the reverse direction. Alternatively, the pump injector may comprise an abutment piston engageable with the valve needle which defines, in part, a control chamber for fuel, and a control valve controlling communication between the pumping chamber and the control chamber.

Abstract: A fuel system comprising a fuel pump having a pump outlet which communicates with a fuel volume, the volume communicating with the inlets of a plurality of fuel injectors. The fuel flow paths between the pump outlet and the inlet of each injector form substantially equal restrictions to the flow of fuel.

Abstract: In one aspect, the invention provides a method of forming an integrated circuitry memory device. In one preferred implementation, a conductive layer is formed over both memory array areas and peripheral circuitry areas. A refractory metal layer is formed over the conductive layer to provide conductive structure in both areas. According to a preferred aspect of this implementation, the conductive layer which is formed over the memory array provides an electrical contact for a capacitor container to be formed. According to another preferred aspect of this implementation, the conductive layer formed over the peripheral circuitry area constitutes a conductive line which includes at least some of the silicide. In another preferred implementation, the invention provides a method of forming a capacitor container over a substrate. According to a preferred aspect of this implementation, a conductive layer is elevationally interposed between an upper insulating layer and a lower conductive layer over the substrate.

Abstract: A method of forming CMOS integrated circuitry includes, a) providing a series of gate lines over a semiconductor substrate, a first gate line being positioned relative to an area of the substrate for formation of an NMOS transistor, a second gate line being positioned relative to an area of the substrate for formation of a PMOS transistor; b) masking the second gate line and the PMOS substrate area while conducting a p-type halo ion implant into the NMOS substrate area adjacent the first gate line, the p-type halo ion implant being conducted at a first energy level to provide a p-type first impurity concentration at a first depth within the NMOS substrate area; and c) in a common step, blanket ion implanting phosphorus into both the NMOS substrate area and the PMOS substrate area adjacent the first and the second gate lines to form both NMOS LDD regions and PMOS n-type halo regions, respectively, the phosphorus implant being conducted at a second energy level to provide an n-type second impurity concentration

Abstract: A signaling assembly is described and which includes a semitransparent substrate, a light emitting assembly which is disposed in spaced relationship relative to the semitransparent substrate and which when energized emits electromagnetic radiation; and an opaque light orientation assembly which is positioned adjacent to the semitransparent substrate and which permits electromagnetic radiation to pass through the semitransparent substrate at an oblique orientation.

Abstract: Described is an in situ method for producing articles of metal aluminide or silicide by reactive sintering and vacuum hot pressing powders and products, such as sputtering targets, produced.