Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract: A planar board for attachment to a chassis and the resulting attachment structure and method of forming the resulting structure is provided. The planar board has components on one face thereof oriented toward one face of the chassis. The chassis has at least one standoff extending from the one face thereof and the planar board has a structure cooperating with each standoff on the chassis mounting the planar board in a standoff relationship at an installed distance. At least one spacer member is mounted on the one face of the planar board and extends from that one face a distance equal to the installed distance to engage the one face of the chassis in the installed condition.

Abstract: A method and resulting electronic package in which a heat sink is secured to the package's dielectric material (e.g., overmold). The surface of the dielectric is roughened (e.g., using an abrasive paper or pad) to enhance the subsequent dielectric-heat sink bond in which an adhesive is used. The dielectric material's roughened external surface(s), typically containing silicone material (e.g., silicone residue) which is an inherent by-product of many dielectric materials of the type used in such packaging, is (are) able to still be securely attached to the heat sink, despite the presence of said silicone. In another embodiment, the roughened surface enhances the marking of dielectric material of this type (e.g., using ink).

Abstract: A modem structure for connection to a line carrying both DSL signals and CTS signals, and a method of operation thereof, are provided. The modem structure includes a DSL modem connectable through a filter to remove the CTS frequencies on said line, and connected to network port. A diagnostic device is connected to the DSL modem to diagnose problems stored with the DSL modem. An analog modem is also provided that is connectable to said wire through a filter that filters out DSL signals on the line, and selectively connectable to said diagnostic device to read information in the diagnostic device and transmit the readings, In operation, the network port is continuously connected to DSL signals to operate network devices at high frequency, and said diagnostic device is selectively connected to the CTS device for diagnostic purposes using low frequency signals.

Abstract: A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

Abstract: A method and device for removing particulate matter from a liquid medium, especially a molten salt bath. The structure includes a device for capturing and removing particulate matter from a liquid medium. In operation, the device is inserted into the liquid having the particulate matter, with a particulate matter collector in the particle collecting position. An agitator circulates the liquid having the particulate matter therein. A portion of the particulate matter is collected in the particulate matter collector during the circulation. Thereafter, the circulation is ceased and the device is removed from the liquid with the particulate matter in the particulate matter collector. The device is moved to a discharge position, and the particulate matter collector is moved to a particle discharge position to discharge the particulate matter.

Abstract: A backplane system allowing a very large number of interconnections between high-connectivity printed circuit boards and a backplane is disclosed. The backplane is fragmented into a plurality of backplane parts that comprise connectors on their edges to mate connectors arranged on the high-connectivity printed circuit boards. These backplane parts may also include other connectors on their edges to couple to extension printed circuit boards requiring less interconnections or cables. Interposers can be used to link several backplane parts and provide enhanced air circulation.

Abstract: A substrate and a method of making the substrate is provided. The substrate includes a layer of metal with at least one through hole therein, the layer of metal having an adhesion promoting layer thereon. A layer of a partially cured low-loss polymer or polymer precursor is positioned on the adhesion promoting layer and a plurality of conductive circuit lines are positioned on a portion of the partially cured dielectric layer. The substrate can be used as a building block in the fabrication of a multilayered printed circuit board.

Abstract: A method for joining a semiconductor integrated circuit chip in a flip chip configuration, via solder balls, to solderable metal contact pads, leads or circuit lines on the circuitized surface of an organic chip carrier substrate, as well as the resulting chip package, are disclosed. The inventive method does not require the use of a solder mask, does not require the melting of the bulk of any of the solder balls and does not require the use of a fluxing agent.

Abstract: A molding device and method utilizes a cavity including fast and second parts for molding an article having one or more convex portions and a gate for injecting mold resin into the cavity. The gate in turn includes one or more gate sides for injecting resin into a concave portion of one part and a gate base for injecting resin into a second of the parts in which no concave portions are located, both resin injections occurring simultaneously and substantially encapsulating a semiconductor element to form a molded article having a convex lens.

Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract: A method and system for spraying scale conditioning aqueous solutions onto opposite sides of a metal strip for scale conditioning is provided. The system includes a housing which defines a chamber through which the moving strip passes on the strip pass line. A nozzle maintenance station is provided which is disposed off the strip pass line. Sets of spray nozzles are provided and the sets are independently movable between the maintenance station and spraying portion on opposite sides of the strip. Thus, each set can be utilized independently to spray a strip or be worked on in the maintenance station without shutting down the line.

Abstract: A slider head assembly is provided which includes a slider head for reading/writing data on the surface of a rotating disc. The slider head is disposed in spaced relationship with respect to the disc for read/write (R/W) operations. The slider head assembly is comprised of a body portion having an essentially planar surface positioned to co-act with the surface of the disc with a proximal end and a distal end. The proximal end or trailing slider surface of the head assembly has a read/write element thereat. The distal end or leading slider surface of the assembly has an actuation device mounted thereon, having a surface the position of which can be modified by an external signal to change the position of the head with respect to the planar or air bearing surface (ABS) of the head assembly. This will change the characteristics of the boundary layer of air between the rotating disc and the head, causing the head assembly to move closer to or farther from the rotating disc when actuated by the external signal.

Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.

Abstract: A semiconductor chip module and forming method is provided. The module includes a support member having at least one well being open to receive a semiconductor chip. Each well depth is substantially equal to the thickness of a chip. The support member has a planar region surrounding each well. A chip is in each well. A dielectric sheet of material is laminated over each chip and extends onto the planar area surrounding the wells and has a face oriented away from the chip. Electrical circuitry including capture pads is formed on the face of the dielectric sheet and extends onto the sheet that overlies the planar region. Conducting vias are formed in the dielectric sheet connecting the electrical circuitry on the dielectric sheet with the contact pads on the chip. A multilayer, circuitized laminate having a fan-out pattern is laminated to the dielectric sheet.

Abstract: A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted ante substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed an the substrate. The stiffener member has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

Abstract: A semiconductor chip module and forming method is provided. The module includes a support member having at least one well being open to receive a semiconductor chip. Each well depth is substantially equal to the thickness of a chip. The support member has a planar region surrounding each well. A chip is in each well. A dielectric sheet of material is laminated over each chip and extends onto the planar area surrounding the wells and has a face oriented away from the chip. Electrical circuitry including capture pads is formed on the face of the dielectric sheet and extends onto the sheet that overlies the planar region. Conducting vias are formed in the dielectric sheet connecting the electrical circuitry on the dielectric sheet with the contact pads on the chip. A multilayer, circuitized laminate having a fan-out pattern is laminated to the dielectric sheet.

Abstract: A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials and connected to the vias and plated through holes. A border may be around the board or card including a metal layer terminating in from the edge of one of the dielectric layers. A copper foil is provided with clearance holes. First and second layers of photoimageable curable dielectric material is disposed on opposite sides of the copper which are photoimageable material. The patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. At the clearance holes in the copper, through holes are developed where holes were patterned in both dielectric layers.

Abstract: A composition for nitrocarburizing stainless steel parts and a method for producing a nitride or hard case on such parts using the composition, are provided. The composition includes alkali metal cyanate and alkali metal carbonate, wherein the cyanate ion is present in a weight percentage of greater than 45% and less than 55.2%. The composition is fused and maintained between about 750° F. and about 950° F. depending upon the type of stainless steel to be treated. The workpiece is immersed in the fused bath and left in until a satisfactory compound layer or case is formed. With austenitic stainless steel, the piece is immersed from about four hours to about six hours at temperatures between about 750° F. and about 950° F., preferably between 750° F. and 850° F. to maintain corrosion resistance. With 400 series stainless steel, increased corrosion resistance is achieved by immersion for between four and six hours at 950° F.