Abstract: A duty cycle correction circuit of a semiconductor memory apparatus includes a duty correction unit configured to determine a duty correction range in response to a duty correction range control signal, correct a duty of an inputted clock in response to duty correction codes to fall in the determined duty correction range, and generate a duty corrected clock; a duty detection unit configured to detect a duty of the duty corrected clock and output duty information; and a duty correction code generation unit configured to generate the duty correction codes based on the duty information.

Abstract: A semiconductor apparatus comprises a power-up signal generation section configured to generate a power-up signal, a driver configured to drive and output the power-up signal, and a main circuit block configured to perform predetermined functions in response to an output from the driver, wherein the power-up signal generation section and an input terminal of the driver are connected by a disconnectable element.

Abstract: A nonvolatile memory device is operated by receiving a dual plane read command for simultaneously reading first and second planes, each comprising memory cells, receiving an MSB read address for reading data stored in the memory cells, checking whether an MSB program operation has been performed on each of the first and second planes, and performing the read operation on the first and second planes according to a result of the check and outputting the read data.

Abstract: A semiconductor device includes an insulating layer and an undoped polysilicon layer that are stacked over a semiconductor substrate. The semiconductor substrate is exposed by removing the portions of the undoped polysilicon layer and the insulating layer. The trenches are formed by etching the exposed semiconductor substrate. Isolation layers are formed in the trenches, and a doped polysilicon layer is formed by implanting impurities into the undoped polysilicon layer.

Abstract: A method for fabricating an etching barrier includes forming wall bodies with a trench in between the wall bodies in a semiconductor substrate. An etching barrier is formed by performing a deposition having a directionality in an oblique direction with respect to the surface of the semiconductor substrate, wherein one of two bottom edge portions of the trench is not covered by the deposition due to a shadow effect by upper portions of the wall bodies.

Abstract: Disclosed probe test control circuit includes: a bank active circuit configured to generate a bank active signal in response to a bank address and bank-by-bank test control signals; and a mat active circuit configured to generate a mat-by-mat sub-wordline selection signal and provide the mat-by-mat sub-wordline selection signal to a selected memory bank, in response to a row address signal, a row address enable signal and a mat-by-mat test control signal.

Abstract: Various embodiments of a test mode signal generating device are disclosed. The device includes first and second test mode signal generating units. The first test mode signal generating unit is configured to receive test address signals to generate a first test mode signal when a first mode conversion signal is enabled. The first test mode signal generating unit is also configured to enable a second mode conversion signal when the test address signals correspond to a first predetermined combination. The second test mode signal generating unit is configured to receive the test address signals to generate a second test mode signal when the second mode conversion signal is enabled. The second test mode signal generating unit is also configured to enable the first mode conversion signal when the test address signals correspond to a second predetermined combination.

Abstract: A semiconductor apparatus having a plurality of stacked chips includes: a plurality of latch units, each of which is disposed in a corresponding one of the plurality of chips and is configured to latch a clock signal and a frequency-divided signal at mutually different points of time to generate an chip identification signal of the corresponding one of the plurality of chips; and a plurality of chip selection signal generating units, each of which is disposed in the corresponding one of the plurality of chips and is configured to compare the chip identification signal of the corresponding one of the plurality of chips with a chip selection identification signal to generate a chip selection signal of the corresponding one of the plurality of chips, wherein the chip selection signal is configured to enable the corresponding one of the plurality of chips when the chip identification signal matches the chip selection identification signal.

Abstract: An impedance control signal generation circuit includes an impedance control signal generation unit configured to generate an impedance control signal in response to a command, a storage unit configured to latch and output the impedance control signal in response to an update pulse signal, a control unit configured to determine whether the impedance control signal is within a predetermined range and generate an update enable signal according to a determination result, and a prohibition unit configured to control input of the update pulse signal to the storage unit in response to the update enable signal.

Abstract: An integrated circuit for controlling data output impedance includes an address decoder, a selection signal decoder, and a transfer control unit. The address decoder is configured to decode an address signal and generate a selection mode signal and a first adjustment mode signal. The selection signal decoder is configured to decode a selection signal and generate an enable signal and a disable signal. The transfer control unit is configured to transfer a pull-up signal and a pull-down signal as a selection pull-up signal and a selection pull-down signal.

Abstract: A test mode signal generation device includes a pulse address generation unit configured to convert test address signals into pulse signals and generate pulse address signals, a pulse address split unit configured to generate converted test address signals in response to the pulse address signals, and a test mode signal generation unit configured to generate a test mode signal in response to the converted test address signals.

Abstract: An internal clock frequency control circuit of a semiconductor memory apparatus includes a mode register set configured to receive a mode register set control signal and output a mode register set signal; a delay unit configured to generate an enable signal when a predetermined cycle has elapsed after the mode register set signal was activated; a division command decoder configured to receive and decode a synchronization command to generate a division start signal when the enable signal is activated; and a division selection unit configured to receive an input clock having a first frequency and output a selection clock having a second frequency, wherein a value of the second frequency is substantially the same as the first frequency or lower than the first frequency depending on a level of the division start signal.

Abstract: A semiconductor memory apparatus includes: a line calibration unit configured to selectively output one signal from the group of code signals for calibrating termination resistance values and test mode signals for testing a chip of the semiconductor memory apparatus to a common global line based on the level of a line calibration signal.

Abstract: Provided is a semiconductor integrated circuit. The semiconductor integrated circuit comprises: a pair of interconnections; a fuse connecting the pair of interconnections; and one or more heat dissipation patterns connecting the pair of interconnections and are disposed around the fuse.

Abstract: A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: an address pad; an address pad buffer section configured to selectively receive a signal of the address pad; a data input buffer section configured to selectively receive the signal of the address pad; and a signal control section configured to selectively provide a path of the signal of the address pad to the address buffer section and the data input buffer section.

Abstract: A nonvolatile memory device is operated by, inter alia, performing a program operation on memory cells belonging to a page selected from among a plurality of pages, performing a verification operation on the programmed memory cells, loading a start loop value of a fail bit count set to the selected page, from among start loop values of fail bit counts set to the respective pages, and if a loop value of the program operation is greater than or equal to the start loop value, counting a number of fail bits included in data of the programmed memory cells detected in the verification operation.

Abstract: A semiconductor apparatus having a plurality of stacked chips includes: a through silicon via (TSV) configured to couple the plurality of chips together and configured to be coupled in series to a plurality of voltage drop units; a plurality of signal conversion units, each of which is configured to convert a voltage outputted from the voltage drop unit of the corresponding one of the plurality of chips to a digital code signal and provide the digital code signal as chip identification signal of the corresponding one of the plurality of chips; and a plurality of chip selection signal generating units, each of which is configured to compare the chip identification signal with a chip selection identification signal to generate a chip selection signal of the corresponding one of the plurality of chips.

Abstract: An internal voltage generator and a method of generating an internal voltage are disclosed. The internal voltage generator includes: a charge pumping block configured to perform charge pumping base on a period pulse signal to generate an internal voltage, and output the generated internal voltage to an interval voltage terminal; a voltage detection block configured to detect the voltage level of the internal voltage terminal; a driving voltage supply block configured to supply a first power supply voltage or a second power supply voltage having a higher voltage level than the first power supply voltage as a driving voltage, depending on the detection result of the voltage detection block; and a period pulse generation block configured to drive the period pulse signal to the is driving voltage supplied from the driving voltage supply block. The period pulse signal driven by the second power supply voltage has a longer pulsing period than the period pulse signal driven by the first power supply voltage.

Abstract: Various embodiments of a semiconductor memory apparatus and a related driving method are disclosed. According to one exemplary embodiment, a semiconductor memory apparatus may include a switching unit and a switching control unit. The switching unit couples or decouples a cell plate voltage line to or from a cell plate electrode in response to a control signal. The switching control unit is configured to enable the control signal at a first timing and disable the control signal at a second timing.

Abstract: A semiconductor integrated circuit includes a first node through which an input signal passes and an adjustment block including at least one delay unit electrically connected to the first node. The semiconductor integrated circuit also includes a correction block configured to generate a control signal which controls whether to activate a delay unit.