Patents Assigned to Advanced Semiconductor Engineering, Inc.
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20230215810
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
  • ELECTRONIC PACKAGE
    Publication number: 20230216174
    Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chung Ju YU, Shao-Lun YANG, Chun-Hung YEH, Hong Jie CHEN, Tsung-Wei LU, Wei Shuen KAO
  • ELECTRONIC PACKAGE
    Publication number: 20230215822
    Abstract: An electronic package is provided. The electronic package includes an amplifier component, a control component, and a first circuit layer. The control component is disposed above the amplifier component. The first circuit layer is disposed between the amplifier component and the control component. The control component is configured to transmit a first signal to the amplifier component and to output a second signal amplified by the amplifier component.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Meng-Wei HSIEH, Hung-Yi LIN, Hsu-Chiang SHIH, Cheng-Yuan KUNG
  • PACKAGE STRUCTURE
    Publication number: 20230215816
    Abstract: A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hsu-Chiang SHIH, Hung-Yi LIN, Chien-Mei HUANG
  • Package structure including pillars and method for manufacturing the same
    Patent number: 11694984
    Abstract: A package structure includes a base material, at least one electronic device, at least one encapsulant and a plurality of dummy pillars. The electronic device is electrically connected to the base material. The encapsulant covers the electronic device. The dummy pillars are embedded in the encapsulant. At least two of the dummy pillars have different heights.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: July 4, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • SEMICONDUCTOR PACKAGE
    Publication number: 20230207524
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
    Publication number: 20230207521
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a first substrate with a first surface and a second surface opposite to the first surface, a second substrate adjacent to the first surface of the first substrate, and an encapsulant encapsulating the first substrate and the second substrate. The first substrate defines a space. The second substrate covers the space. The second surface of the first substrate is exposed by the encapsulant. A surface of the encapsulant is coplanar with the second surface of the first substrate or protrudes beyond the second surface of the first substrate.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Hsing CHANG, Wen-Hsin LIN
  • ELECTRONIC DEVICE WITH ELECTROMAGNET
    Publication number: 20230208175
    Abstract: An electronic device package and a method for manufacturing the electronic device are provided. The electronic device includes a charging element, a housing covering the charging element and a sensing element electrically connected to the housing. The sensing element is configured to detect an external device and to drive the charging element.
    Type: Application
    Filed: December 23, 2021
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Hao Chang
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230207729
    Abstract: A semiconductor device package includes a carrier, an emitting element and a first package body. The carrier includes a first surface and a second surface opposite to the first surface. The emitting element is disposed on the first surface of the carrier. The first package body is disposed over the first surface of the carrier and spaced apart from the first surface of the carrier.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tang-Yuan CHEN, Meng-Wei HSIEH, Cheng-Yuan KUNG
  • ELECTRONIC PACKAGE STRUCTURE
    Publication number: 20230208394
    Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Kuo-Hua LAI, Hui-Chung LIU
  • Semiconductor device package and acoustic device including the same
    Patent number: 11689839
    Abstract: A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: June 27, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Ming-Tau Huang
  • ELECTRONIC MODULE
    Publication number: 20230194807
    Abstract: An electronic module is provided. The electronic module includes a carrier, a movable component and an optical component. The movable component is on the carrier and configured to be movable with respect to the carrier. The optical component is configured to detect a movement of the movable component by an optical coupling between the optical component and the movable component.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 22, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Shih-Chieh TANG
  • PACKAGE STRUCTURE
    Publication number: 20230197600
    Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 22, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Shun CHANG, Sheng-Wen YANG, Teck-Chong LEE, Yen-Liang HUANG
  • WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
    Publication number: 20230197487
    Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 22, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Bo Hua CHEN, Yan Ting SHEN, Fu Tang CHU, Wen-Pin HUANG
  • ELECTRONIC MODULE HAVING TRANSDUCERS RADIATING ULTRASONIC WAVES
    Publication number: 20230199378
    Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih Lung LIN, Kuei-Hao TSENG, Kai Hung WANG
  • WEARABLE COMPONENT, EAR TIP, AND METHOD OF MANUFACTURING A WEARABLE COMPONENT
    Publication number: 20230199362
    Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 22, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Yi WU, Hung Yi LIN, Jenchun CHEN
  • Semiconductor device package and method for manufacturing the same
    Patent number: 11682656
    Abstract: A semiconductor device package includes a substrate, a stacked structure and an encapsulation layer. The substrate includes a circuit layer, a first surface and a second surface opposite to the first surface. The substrate defines at least one cavity through the substrate. The stacked structure includes a first semiconductor die disposed on the first surface and electrically connected on the circuit layer, and at least one second semiconductor die stacked on the first semiconductor die and electrically connected to the first semiconductor die. The second semiconductor die is at least partially inserted into the cavity. The encapsulation layer is disposed in the cavity and at least entirely encapsulating the second semiconductor die.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: You-Lung Yen, Bernd Karl Appelt, Kay Stefan Essig
  • Manufacturing process steps of a semiconductor device package
    Patent number: 11682631
    Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Zheng Wei Wu
  • Semiconductor device package and method for manufacturing the same
    Patent number: 11682653
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Ming Hung, Meng-Jen Wang, Tsung-Yueh Tsai, Jen-Kai Ou
  • Semiconductor device package
    Patent number: 11682601
    Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant. The spacer is disposed between the first device and the second device and configured to define a distance between the first device and the second device.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wei-Tung Chang