Abstract: A method for manufacturing an LED includes steps: providing a base and an LED chip disposed on the base; providing an optical element and disposing the optical element on the base to cover the LED chip; providing a phosphor film and disposing the phosphor film on the optical element; providing a holding plate with capillary holes and disposing the base on the holding plate; providing a mold, wherein the mold and the holding plate cooperatively form a receiving room which receives the base, the LED chip, the optical element and the phosphor film therein; extracting air from the receiving room through the capillary holes of the holding plate, and/or, blowing air toward the phosphor film, whereby the phosphor film is conformably attached onto the optical element; and solidifying the phosphor film on the optical element.

Abstract: An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N1 , while the first translucent structure has a radius of r, wherein R, r and N1 satisfy the following relation: N1<R/(2r?R).

Abstract: An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.

Abstract: A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages.

Abstract: The present invention generally relates to blends that contain alkoxylated, lipophilic polyol compounds having about three moles of lipophilic, substituents per mole of polyol which are polyethylene glycol methyl glucose trioleate and polyethylene glycol methyl glucose dioleate and, more specifically, to the use of such compounds as thickeners in liquid surfactant compositions.

Abstract: A side-view LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, a reflective cup formed on the substrate, an opening defined at a lateral side of the reflective cup, an encapsulation formed on the substrate to cover the LED die, and a reflective layer coated on a top of the encapsulation and a top of the reflective cup, wherein part of light emitting from the LED die is reflected by the reflective cup and the reflective layer and then emits out of the side-view LED package from the opening. The present disclosure also provides a method for manufacturing the side-view LED package described above.

Abstract: The invention is directed to certain droplet actuated molecular techniques. In one embodiment, the invention provides droplet actuator methods for detection of single nucleotide polymorphisms (SNPs) in a DNA sequence using digital microfluidics, including droplet actuator-based sample preparation and SNP analysis. In another embodiment, the invention provides droplet actuator devices and methods for providing integrated sample preparation and multiplexed detection of an infectious agent, such as HIV. In yet another embodiment, the invention provides droplet actuator devices and techniques for PCR amplification and detection of specific nucleic acid sequences using digital microfluidics, including droplet actuator-based sample preparation and target nucleic acid analysis. In yet another embodiment the invention provides methods for performing hot-start PCR on a droplet actuator.

Abstract: An object of the present invention is to develop and provide a lung cancer differential marker with which lung cancer can be diagnosed conveniently and highly sensitively without depending only on increase or decrease in protein expression level between cancer patients and healthy persons. Another object of the present invention is to develop and provide a glycan marker capable of distinguishing histological types of lung cancer. Of serum glycoproteins, glycopeptide and glycoprotein groups whose glycan structures were altered specifically in lung cancer cell culture supernatants were identified, and they are provided as lung cancer differential markers.

Abstract: Provided are an apparatus and method for stabilizing a pulse of a fiber-type femtosecond laser, and more particularly, to an apparatus for stabilizing a pulse of a fiber-type femtosecond laser, which adjusts a distance between a saturable absorption material and an optical fiber connection unit of the femtosecond laser to automatically perform mode-locking, thereby obtaining a laser pulse stabilized for a long time, and a method for stabilizing the pulse of the fiber-type femtosecond laser. The apparatus for stabilizing a pulse of a fiber-type femtosecond laser in a fiber-type femtosecond laser system including a pump laser (100) and a fiber cavity (200) includes a distance adjustment part (300) adjusting a distance (d) between a saturable absorption material (700) and a connection unit of an optical fiber (310) which are provided within the fiber cavity (200).

Abstract: A method for manufacturing an LED package includes providing a substrate including an insulating layer inlayed with first and second electrodes. The first and second electrodes define a chip fastening area. An LED chip is fastened on the chip fastening area and electrically connected to the first and second electrodes. A buffer layer including a shelter and grooves is brought to be located over the substrate wherein the shelter covers the chip fastening area and the grooves are located over portions of the substrate beside the first and second electrodes. A reflecting layer is formed in the grooves of the buffer layer by injecting liquid material into the grooves. The buffer layer is removed after the liquid material is solidified and a through hole is defined. An encapsulant is formed to cover the LED chip by injecting the encapsulant into the through hole and the chip fastening area.

Abstract: A method of separating blood by providing a horizontal substrate having a plurality of oxygen plasma-treated polypropylene pillars extending from the surface of a polypropylene film, depositing a whole blood sample on an upper surface of the substrate, collecting red blood cells on the upper surface of the pillars and permitting remaining components of said whole blood sample to flow downward and through the pillars.

Abstract: An LED package structure includes a substrate and an LED chip formed on the substrate. The substrate has a first electrode and a second electrode formed on an upper surface thereof. The LED chip is formed on the first electrode of the substrate and electrically connected with the first electrode and the second electrode respectively. The substrate is made of a composite including a base material and ceramic fibers mixed in the base material.

Abstract: An exemplary method for manufacturing an LED includes steps: providing a substrate with a first electrode and a second electrode; providing an isosceles trapezoidal LED chip and making the LED chip electrically connecting the first electrode and the second electrode; providing a mold with a cavity and setting the mold on the substrate to make the LED chip received in the cavity, an outer periphery of the LED chip spaced from confronting edges of the mold defining the cavity to define a channel therebetween, and a width of the channel being uniform; providing phosphor glue and filling the phosphor glue in the channel to make the phosphor glue enclose the LED chip therein; solidifying the phosphor glue to form a phosphor layer covering the LED chip and removing the mold.

Abstract: A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed.

Abstract: A rotating device includes a shaft body that includes a lower rod and an upper rod formed with a retainer hole encircling a part of the lower rod and fixing the lower rod, a bearing body including a shaft encircling member that encircles the shaft body, and freely rotatable relative to the shaft body, a radial dynamic pressure generating groove which is provided in either one of the shaft body and the bearing body and which generates dynamic pressure in a radial direction, a thrust dynamic pressure generating groove which is provided in either one of the shaft body and the bearing body and which generates dynamic pressure in a thrust direction, and a lubrication medium present in a gap between the shaft body and the bearing body.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: A heatshield assembly for a metal barrel of a firearm includes a heatshield body provided with a rear end extending to a front end, and configured to overlie the barrel of the firearm. An insulating mounting arrangement is frictionally attached to and located within the heatshield body. The mounting arrangement is separate from the heatshield body for mounting the heatshield body to the barrel of a firearm in a continuous spaced relationship therefrom without damaging the barrel. With the heatshield body constructed of a metal material, the mounting arrangement is particularly constructed to prevent metal-to-metal contact between the heatshield body and the barrel.

Abstract: Methods of reducing the capillary forces experienced by fragile high aspect ratio structures during drying to substantially prevent damage to said high aspect ratio structures during drying. They include modifying the surface of the high aspect ratio structures such that the forces are sufficiently minimized and as such less than 10% of the high aspect ratio features will have bent or collapsed during drying of the structure having said features thereon.

Abstract: A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.

Abstract: An LED light emitting apparatus includes an LED light source, a light guiding device and an emitting window. The emitting window is covered with a phosphor layer. Light emitted directly from the LED light source is first transmitted to the light guiding device and then guided by the light guiding device towards the emitting window to evenly excite the phosphor layer.