Patents Assigned to ADVANCED
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Publication number: 20130292699Abstract: The present invention prevents breakage of a gate insulating film of a MOS device and provides a nitride semiconductor device having improved reliability. An SBD metal electrode provided between a drain electrode and a gate electrode is configured to form a Schottky junction with an AlGaN layer. Further, the SBD metal electrode and a source electrode are connected and electrically short-circuited. Consequently, when an off signal is inputted to the gate electrode, a MOSFET part is turned off and the drain-side voltage of the MOSFET part becomes close to the drain electrode voltage. When the drain electrode voltage increases, the SBD metal electrode voltage becomes lower than the drain-side voltage of the MOSFET part, thus the drain side of the MOSFET part and the drain electrode are electrically disconnected by the SBD metal electrode.Type: ApplicationFiled: October 26, 2011Publication date: November 7, 2013Applicant: ADVANCED POWER DEVICE RESEARCH ASSOCIATIONInventors: Katsunori Ueno, Shusuke Kaya
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Publication number: 20130294480Abstract: The present invention provides a measuring method and a measuring system that are capable of accurately measuring the surface temperature of a surface to be measured, without being influenced by the emissivity distribution of the surface to be measured.Type: ApplicationFiled: December 9, 2011Publication date: November 7, 2013Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Yoshiro Yamada, Juntaro Ishii
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Publication number: 20130292808Abstract: A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package body encapsulates the semiconductor die. The electromagnetic interference shield is formed on the package body. The dielectric structure encapsulates the electromagnetic interference shield. The antenna element is formed on the dielectric structure and electrically connecting the grounding segment of the substrate and the feeding point.Type: ApplicationFiled: May 4, 2012Publication date: November 7, 2013Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Han-Chee Yen, Chi-Sheng Chung, Kuo-Hsien Liao, Yung-I Yeh
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Publication number: 20130296994Abstract: Cochlear implant headpieces with improved moisture resistance. The headpiece comprises a housing (102) including a housing microphone aperture (124), a microphone (108) within the housing, a membrane (148) between the housing microphone aperture and the microphone, a cap (104) including a sound port (158) and a shield (168), the cap being removably connectable to the housing and the headpiece being protected from particulate and moisture ingress.Type: ApplicationFiled: January 11, 2012Publication date: November 7, 2013Applicant: ADVANCED BIONICS AGInventor: Manish Vaishya
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Publication number: 20130294826Abstract: The invention provides an apparatus for securing an object on a frame, wherein the object comprises a surface for displaying a sample. The apparatus can comprise a first clamping member movably mounted on a frame, wherein the first clamping member changes from an open position to a closed position to secure an object on the frame.Type: ApplicationFiled: May 3, 2013Publication date: November 7, 2013Applicant: ADVANCED CELL DIAGNOSTICS, INC.Inventor: Shiping CHEN
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Publication number: 20130296214Abstract: Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.Type: ApplicationFiled: July 15, 2011Publication date: November 7, 2013Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Jeffrey A. Barnes, Steven Lippy, Peng Zhang, Rekha Rajaram
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Publication number: 20130296971Abstract: Sound processor housings, sound processors and systems including sound processors are disclosed.Type: ApplicationFiled: November 19, 2011Publication date: November 7, 2013Applicant: ADVANCED BIONICS AGInventors: James P. Goodman, Adam Smith
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Publication number: 20130292496Abstract: Disclosed is a micro flow control injector for use in an ultramicro mono-propellant based pneumatic generator, including: a first check valve installed on a first supply pipe connected to a fuel tank charged with a mono-propellant and preventing a flow from the first supply pipe to the fuel tank; a small-sized driver connected with the first supply pipe and minutely controlling the supplied flow while repeatedly generating a decompression state and a pressurization state in the first supply pipe by a reciprocating movement; a second supply pipe connected to a cylinder of the small-sized driver to discharge fuel to a reactor in a pressurization state; and a second check valve installed on the second supply pipe and preventing a flow from the second supply pipe to the small-sized driver and the first supply pipe, in order to minutely control a flow.Type: ApplicationFiled: June 6, 2012Publication date: November 7, 2013Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Kyung-Soo Kim, Soohyun Kim, Kyungrok Kim, Young June Shin, Chang Wan Ha, Jonghyun Lee
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Publication number: 20130285096Abstract: A method for manufacturing a light emitting diode (LED) package comprises: providing a substrate having a first electrode and a second electrode electrically insulated from the first electrode, wherein an LED die is mounted on the first electrode and electrically connected to the first electrode and the second electrode; forming a first encapsulant layer on the substrate to encapsulate the LED die therein, the first encapsulant layer being colloidal; forming a nitride compound phosphor layer distributed on an outer face of the first encapsulant layer; and heating the first encapsulant layer to solidify the first encapsulant layer. A second encapsulant layer is formed on the nitride compound phosphor layer to encapsulate the first encapsulant layer. An LED package formed by the method is also provided.Type: ApplicationFiled: April 18, 2013Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: YU-FANG TSENG, CHIA-WEN HSIAO
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Publication number: 20130284965Abstract: A unidirectional ceramic control valve includes a valve shell, a shaft, a ring unit, an upper ceramic piece, a lower ceramic piece, a valve base and at least one anti-leak ring. Lower section of the valve shell has two hook holes, and two notches are formed therebelow. A receiving trough is formed at an inner portion of lower section of the shaft to provide a space for the ring unit and the upper ceramic piece. The ring unit is a ring-shaped body with low friction coefficient, and when the ring unit is disposed between the shaft and upper ceramic piece, it prevents the shaft from directly contacting the upper ceramic piece to generate wear. The upper ceramic piece has two symmetric water holes, while the lower ceramic piece has two symmetric circulating holes. A first protruding unit and a second protruding unit are correspondingly formed at the valve base.Type: ApplicationFiled: April 30, 2012Publication date: October 31, 2013Applicant: GRAND ADVANCED TECHNOLOGIES CO., LTD.Inventor: Tung-Hsin Sun
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Publication number: 20130288408Abstract: A method for manufacturing an LED includes steps: providing a base and an LED chip disposed on the base; providing an optical element and disposing the optical element on the base to cover the LED chip; providing a phosphor film and disposing the phosphor film on the optical element; providing a holding plate with capillary holes and disposing the base on the holding plate; providing a mold, wherein the mold and the holding plate cooperatively form a receiving room which receives the base, the LED chip, the optical element and the phosphor film therein; extracting air from the receiving room through the capillary holes of the holding plate, and/or, blowing air toward the phosphor film, whereby the phosphor film is conformably attached onto the optical element; and solidifying the phosphor film on the optical element.Type: ApplicationFiled: April 17, 2013Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHIEH-LING CHANG, HSING-FEN LO
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Publication number: 20130284068Abstract: The present invention generally relates to blends that contain alkoxylated, lipophilic polyol compounds having about three moles of lipophilic, substituents per mole of polyol which are polyethylene glycol methyl glucose trioleate and polyethylene glycol methyl glucose dioleate and, more specifically, to the use of such compounds as thickeners in liquid surfactant compositions.Type: ApplicationFiled: September 7, 2011Publication date: October 31, 2013Applicant: LUBRIZOL ADVANCED MATERIALS, INC.Inventors: Duane G. Krzysik, Virginia L. Gibson, William J. Reiman, Timothy J. Roach
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Publication number: 20130285530Abstract: An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.Type: ApplicationFiled: December 21, 2012Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: CHIH-YUNG LIN, MIN-TSUN HSIEH, CHING-LIEN YEH, CHIA-CHEN CHANG, CHUAN-FU YANG
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Publication number: 20130285097Abstract: A side-view LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, a reflective cup formed on the substrate, an opening defined at a lateral side of the reflective cup, an encapsulation formed on the substrate to cover the LED die, and a reflective layer coated on a top of the encapsulation and a top of the reflective cup, wherein part of light emitting from the LED die is reflected by the reflective cup and the reflective layer and then emits out of the side-view LED package from the opening. The present disclosure also provides a method for manufacturing the side-view LED package described above.Type: ApplicationFiled: April 23, 2013Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventors: LUNG-HSIN CHEN, HSING-FEN LO, WEN-LIANG TSENG
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Publication number: 20130288406Abstract: A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages.Type: ApplicationFiled: March 5, 2013Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Publication number: 20130285094Abstract: An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N1 , while the first translucent structure has a radius of r, wherein R, r and N1 satisfy the following relation: N1<R/(2r?R).Type: ApplicationFiled: December 28, 2012Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: Advanced Optoelectronic Technology, Inc.
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Publication number: 20130288272Abstract: An object of the present invention is to develop and provide a lung cancer differential marker with which lung cancer can be diagnosed conveniently and highly sensitively without depending only on increase or decrease in protein expression level between cancer patients and healthy persons. Another object of the present invention is to develop and provide a glycan marker capable of distinguishing histological types of lung cancer. Of serum glycoproteins, glycopeptide and glycoprotein groups whose glycan structures were altered specifically in lung cancer cell culture supernatants were identified, and they are provided as lung cancer differential markers.Type: ApplicationFiled: September 9, 2011Publication date: October 31, 2013Applicants: TOKYO MEDICAL UNIVERSITY, NATIONAL INSTIUTE OF ADVANCED INDUSTRIAL SCIENCE AInventors: Hisashi Narimatsu, Akira Togayachi, Yuzuru Ikehara, Hiroyuki Kaji, Atsushi Kuno, Takashi Ohkura, Hideki Matsuzaki, Yoshitoshi Hirao, Jun Iwaki, Minako Abe, Masaharu Nomura, Masayuki Noguchi
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Publication number: 20130288254Abstract: The invention is directed to certain droplet actuated molecular techniques. In one embodiment, the invention provides droplet actuator methods for detection of single nucleotide polymorphisms (SNPs) in a DNA sequence using digital microfluidics, including droplet actuator-based sample preparation and SNP analysis. In another embodiment, the invention provides droplet actuator devices and methods for providing integrated sample preparation and multiplexed detection of an infectious agent, such as HIV. In yet another embodiment, the invention provides droplet actuator devices and techniques for PCR amplification and detection of specific nucleic acid sequences using digital microfluidics, including droplet actuator-based sample preparation and target nucleic acid analysis. In yet another embodiment the invention provides methods for performing hot-start PCR on a droplet actuator.Type: ApplicationFiled: August 13, 2010Publication date: October 31, 2013Applicant: ADVANCED LIQUID LOGIC, INC.Inventors: Michael G. Pollack, Vijay Srinivasan, Allen E. Eckhardt, Prasanna Thwar, Zhishan Hua, Arjun Sudarsan, Theodore Winger
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Publication number: 20130287051Abstract: Provided are an apparatus and method for stabilizing a pulse of a fiber-type femtosecond laser, and more particularly, to an apparatus for stabilizing a pulse of a fiber-type femtosecond laser, which adjusts a distance between a saturable absorption material and an optical fiber connection unit of the femtosecond laser to automatically perform mode-locking, thereby obtaining a laser pulse stabilized for a long time, and a method for stabilizing the pulse of the fiber-type femtosecond laser. The apparatus for stabilizing a pulse of a fiber-type femtosecond laser in a fiber-type femtosecond laser system including a pump laser (100) and a fiber cavity (200) includes a distance adjustment part (300) adjusting a distance (d) between a saturable absorption material (700) and a connection unit of an optical fiber (310) which are provided within the fiber cavity (200).Type: ApplicationFiled: April 9, 2013Publication date: October 31, 2013Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Soo Hyun KIM, Kyung-Soo KIM, Sung Yoon RYU, Won Sik KWON, Hyub LEE, Jin Hwan KIM, Jin Doo CHOI, Seung Hwan JO, Sang Wook Lee, Seung Ryeol OH
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Publication number: 20130288407Abstract: A method for manufacturing an LED package includes providing a substrate including an insulating layer inlayed with first and second electrodes. The first and second electrodes define a chip fastening area. An LED chip is fastened on the chip fastening area and electrically connected to the first and second electrodes. A buffer layer including a shelter and grooves is brought to be located over the substrate wherein the shelter covers the chip fastening area and the grooves are located over portions of the substrate beside the first and second electrodes. A reflecting layer is formed in the grooves of the buffer layer by injecting liquid material into the grooves. The buffer layer is removed after the liquid material is solidified and a through hole is defined. An encapsulant is formed to cover the LED chip by injecting the encapsulant into the through hole and the chip fastening area.Type: ApplicationFiled: April 12, 2013Publication date: October 31, 2013Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.Inventor: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
