Abstract: A method of separating blood by providing a horizontal substrate having a plurality of oxygen plasma-treated polypropylene pillars extending from the surface of a polypropylene film, depositing a whole blood sample on an upper surface of the substrate, collecting red blood cells on the upper surface of the pillars and permitting remaining components of said whole blood sample to flow downward and through the pillars.

Abstract: An LED package structure includes a substrate and an LED chip formed on the substrate. The substrate has a first electrode and a second electrode formed on an upper surface thereof. The LED chip is formed on the first electrode of the substrate and electrically connected with the first electrode and the second electrode respectively. The substrate is made of a composite including a base material and ceramic fibers mixed in the base material.

Abstract: An exemplary method for manufacturing an LED includes steps: providing a substrate with a first electrode and a second electrode; providing an isosceles trapezoidal LED chip and making the LED chip electrically connecting the first electrode and the second electrode; providing a mold with a cavity and setting the mold on the substrate to make the LED chip received in the cavity, an outer periphery of the LED chip spaced from confronting edges of the mold defining the cavity to define a channel therebetween, and a width of the channel being uniform; providing phosphor glue and filling the phosphor glue in the channel to make the phosphor glue enclose the LED chip therein; solidifying the phosphor glue to form a phosphor layer covering the LED chip and removing the mold.

Abstract: A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed.

Abstract: A rotating device includes a shaft body that includes a lower rod and an upper rod formed with a retainer hole encircling a part of the lower rod and fixing the lower rod, a bearing body including a shaft encircling member that encircles the shaft body, and freely rotatable relative to the shaft body, a radial dynamic pressure generating groove which is provided in either one of the shaft body and the bearing body and which generates dynamic pressure in a radial direction, a thrust dynamic pressure generating groove which is provided in either one of the shaft body and the bearing body and which generates dynamic pressure in a thrust direction, and a lubrication medium present in a gap between the shaft body and the bearing body.

Abstract: Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

Abstract: A heatshield assembly for a metal barrel of a firearm includes a heatshield body provided with a rear end extending to a front end, and configured to overlie the barrel of the firearm. An insulating mounting arrangement is frictionally attached to and located within the heatshield body. The mounting arrangement is separate from the heatshield body for mounting the heatshield body to the barrel of a firearm in a continuous spaced relationship therefrom without damaging the barrel. With the heatshield body constructed of a metal material, the mounting arrangement is particularly constructed to prevent metal-to-metal contact between the heatshield body and the barrel.

Abstract: Methods of reducing the capillary forces experienced by fragile high aspect ratio structures during drying to substantially prevent damage to said high aspect ratio structures during drying. They include modifying the surface of the high aspect ratio structures such that the forces are sufficiently minimized and as such less than 10% of the high aspect ratio features will have bent or collapsed during drying of the structure having said features thereon.

Abstract: A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.

Abstract: An LED light emitting apparatus includes an LED light source, a light guiding device and an emitting window. The emitting window is covered with a phosphor layer. Light emitted directly from the LED light source is first transmitted to the light guiding device and then guided by the light guiding device towards the emitting window to evenly excite the phosphor layer.

Abstract: A gas generator includes a lower shell, an upper shell, a holding portion, an igniter, and a filter. The lower shell is made of a press-formed product formed by press-working one plate-shaped member made of metal, and includes a protruding cylindrical portion and an opening provided in the protruding cylindrical portion. The holding portion is formed from a resin-molded portion formed by attaching an insulating fluid resin material to a bottom plate portion so as to reach a part of an outer surface from a part of an inner surface of the bottom plate portion of the lower shell through the opening and solidifying the same, and includes an accommodation recess portion in a portion opposed to a top plate portion. The igniter is held by the holding portion while it is inserted in the accommodation recess portion from a side of the top plate portion and fitted therein.

Abstract: The present invention relates to a method for combining images of a graphic user interface with a stereoscopic video content. The latter comprises at least a pair of video images intended respectively for a right and a left eye, while the graphic user interface comprises at least a pair of graphic images. The method comprises the steps of generating combined video images by blending each video image of said pair of video images with a respective graphic image of said pair of graphic images, so that the each combined video image comprises a first region (1 100) comprising only pixels from the video image and a second region (1200) wherein the blended video image appears in transparency behind the blended graphic image with a transparency that decreases according to a monotone law moving away from the first region (1100). A video processing unit adapted to implement the method is also disclosed.

Abstract: An LED module comprises an LED and a lens matching with the LED. The lens comprises a light-guiding portion and a plurality of retaining portions protruded from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate. A plurality of through holes is defined in the first electrode and a second electrode, respectively. Each retaining portion includes a rugged portion. The retaining portions are inserted into the through holes correspondingly, and the rugged portion abuts the substrate. Glue is applied between the rugged portion and the substrate.

Abstract: An LED die comprises a substrate and an epitaxial layer formed thereon. The epitaxial layer comprises a first n-type semiconductor layer, an active layer and a p-type semiconductor layer grown on the substrate in sequence. The LED die defines a receiving recess formed in a center of a top face of the p-type semiconductor layer. The receiving recess extends through the p-type semiconductor layer, the active layer and into the n-type semiconductor layer along a top-to-bottom direction of the epitaxial layer. A pair of p-pads are located at two opposite sides of the p-type semiconductor layer, respectively. A first n-pad is received in the receiving recess and located on the n-type layer.

Abstract: An LED (light emitting diode) lighting apparatus includes an LED, a light adjusting device and a shell. The LED includes a main lighting surface and a heat dissipating surface. The shell receives the LED and the light adjusting device therein, the shell having a light emitting window for light emitted from the LED to transmit therethrough after the light is directed by the light adjusting device. The heat dissipating surface of the LED connects the light emitting window, and heat generated by the LED is transferred from the heat dissipating surface to the light emitting window to prevent snow from accumulating on the light emitting window.

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract: A power controller can set the power state of a processor bridge based on which processor modules are in a communicative state. In addition, for a power state where selected processor modules are expected to be non-communicative, the power controller can set the supplied voltage to have a reduced voltage guard band as compared to other power states. These power management techniques can reduce the power consumed by the processor.

Abstract: A solution for selectively etching copper or a copper alloy from a microelectronic device, wherein the device simultaneously includes copper or a copper alloy and nickel-containing material, the solution being an etching solution for copper or a copper alloy comprising a chelating agent having an acid group in a molecule, hydrogen peroxide, and a surfactant having an oxyethylene chain in a molecule.

Abstract: A secondary battery includes: a fiber negative electrode having a surface on which a negative electrode active material coating is formed, the coating containing a compound of AaMbXcZd; a fiber positive electrode including a positive electrode active material coating containing nickel hydroxide; an aqueous electrolyte solution; and a separator. The negative electrode coating has an uncoated surface. A is selected from the group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, and Ba; M is selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Nb, Mo, Ru, Pd, Ag, Ta, W, Pr, Sm, Eu, and Pb; X is selected from the group consisting of B, Al, Si, P, S, Ga, and Ge; Z is selected from the group consisting of O, S, N, F, Cl, Br, and I; and 0?a?6, 1?b?5, 0?c?4, 0<d?12, and 0?a/b?4.

Abstract: A temperature sensor that senses a temperature on the basis of a relaxation oscillator, includes: a bias circuit unit that outputs a bias current increasing with an increase in temperature; a capacitor voltage unit that charges a capacitor with the bias current and discharges the current when receiving a control signal; a pulse generating unit that outputs a pulse when the voltage of the capacitor is higher than a reference voltage, changes the pulse width of the pulse, and transmits the pulse corresponding to the control signal to the capacitor voltage unit; and a counter unit that counts and outputs, as a digital value, the number of pulses outputted from the pulse generating unit, on the basis of a reference frequency.