Abstract: In one example embodiment, a current source is provided to limit noise and offset. In one embodiment, a source transistor is provided, with current sourced at the drain. A feedback network runs from the source node to the gate. The feedback network produces voltage gain by a transconductance, such as a transistor. Appropriate capacitors are also provided, and two pairs of switches are disposed to provide offset cancellation by toggling between gain and clamp modes in the switched capacitor architecture.

Abstract: Embodiments of the present invention may provide a receiver. The receiver may include an RF section and a quadrature mixture, coupled to the RF section, to downconvert a first group of wireless signals directly to baseband frequency quadrature signals and to downconvert a second group of wireless signals to intermediate frequency quadrature signals. The receiver may also include a pair of analog-to-digital converters (ADCs) to convert the downconverted quadrature signals to corresponding digital quadrature signals. Further, the receiver may include a digital section having two paths to perform signal processing on the digital baseband frequency quadrature signals and to downconvert the digital intermediate frequency signals to baseband cancelling a third order harmonic distortion therein. The receiver may be provided on a monolithically integrated circuit.

Abstract: The present disclosure discloses a digital-to-analog converter (DAC) design which is suitable for providing a high output power high-speed DAC, e.g., in radio frequency applications. The DAC design utilizes a parallel DAC structure, e.g., having 8 parallel DACs and an aggregate current output, to provide a high and programmable current output (in some implementations, up to 512 mA or more). The parallel DAC structure alleviates the design problems which exist in trying to output a high amount of current using a single DAC. The DAC design further utilizes a hybrid structure which integrates the signal chain for a more reliable system. In some embodiments, the hybrid structure uses a CMOS process for the current sources and switches and a GaAs cascode stage for combining the outputs to optimally leverage the advantages of both technologies. The result is a highly efficient DAC (with peak output power programmable up to 29 dBm or more).

Abstract: Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

Abstract: A method of forming a MEMS device provides first and second wafers, where at least one of the first and second wafers has a two-dimensional array of MEMS devices. The method deposits a layer of first germanium onto the first wafer, and a layer of aluminum-germanium alloy onto the second wafer. To deposit the alloy, the method deposits a layer of aluminum onto the second wafer and then a layer of second germanium to the second wafer. Specifically, the layer of second germanium is deposited on the layer of aluminum. Next, the method brings the first wafer into contact with the second wafer so that the first germanium in the aluminum-germanium alloy contacts the second germanium. The wafers then are heated when the first and second germanium are in contact, and cooled to form a plurality of conductive hermetic seal rings about the plurality of the MEMS devices.

Abstract: Apparatus and methods for active detection, timing, and protection related to transient electrical events are disclosed. A detection circuit can generate a first activation signal in response to a transient electrical stress event across a first node and a second node. A blocking circuit is configured to bias the base of a first driver bipolar transistor to slow down discharge of accumulated base charge of a first driver bipolar transistor, which permits the first driver bipolar transistor to remain activated for a longer period of time than had the base of the first driver bipolar transistor been biased to the same voltage as the emitter of the first bipolar transistor. Shut-off circuitry can be included in some embodiments to prevent a discharge circuit from activating during normal operating conditions.

Abstract: Apparatus and method for digital configuration of integrated circuits (ICs) are provided herein. In certain implementations, an IC includes an impedance sensing circuit and at least one pin used for digital configuration. The impedance sensing circuit can detect an impedance value of an external passive network electrically connected to the pin, and can digitally configure the IC based on the detected impedance. For example, an end-user can connect an external resistor of a particular resistance to the pin, and the impedance sensing circuit can sense or detect the external resistor's resistance and digitally configure the IC based on the detected resistance. Accordingly, an end-user can digitally configure the IC by connecting a passive external component corresponding to a desired digital configuration to the pin. In certain implementations, the IC includes multiple pins, and the digital configuration is based on the impedances detected on each of the pins.

Abstract: Embodiments of the present invention relate to a battery stack controller system. The system may include a plurality of battery cell stages with cell controller systems (as described above with respect to the first embodiment). The system may also include a stack controller to send charge/discharge commands to the battery stack via a communication network. The stack controller may send the commands to the battery stack based on the requirements of a load or the state of the battery cell stages. The battery cell stages may either comply with the commands or send the commands to neighboring cells via the communication network.

Abstract: Embodiments of the present invention are directed to a battery stack with a leapfrogging communication network. Each cell stage may include a controller, a transmitter, and a pair of receivers. The cell stage in the battery stack may be coupled to the closest two preceding battery cell stages in the stack. In this manner, each cell stage may be able to determine if a fault is present in an immediately preceding cell stage in the stack by monitoring the first preceding cell stage and the second preceding cell stage. If discharge/charge commands transmitted by the second preceding cell stage are not reaching the battery cell stage at issue, the controller may determine that there is a fault in the first preceding cell stage and discharge/charge the cell stage based on the commands transmitted by the second preceding cell stage.

Abstract: Embodiments of the present invention are directed to improved battery packaging designs. The battery pack design may include a battery cell, a plurality of transistors, and a controller. The transistors may be coupled to the terminals of the battery cell in an H-bridge configuration. The controller may control the transistors to bypass the battery cell based on the current flowing between the output terminals of the battery pack. In such a manner, the controller may prevent damage to the battery cell and improve the overall safety of the battery pack in hazardous conditions. Moreover, the design may allow for more efficient charging/discharging of the cells that are most ready to accept/supply current.

Abstract: Embodiments of the present invention are directed to an improved battery packaging design. The battery pack design may include a battery cell, a plurality of transistors, and a controller. The transistors may be coupled to the terminals of the battery cell in an H-bridge configuration. The controller may control the transistors to bypass the battery cell based on the current flowing between the output terminals of the battery pack. In such a manner, the controller may prevent damage to the battery cell and improve the overall safety of the battery pack in hazardous conditions.

Abstract: An electrical circuit includes a comparator that receives a first signal at a first input pin, where the first signal is indicative of a current drawn from a power supply unit (PSU) that delivers power to an electronic component. The comparator substantially simultaneously receives a second signal at a second input pin, where the second signal is indicative of a voltage provided by the PSU to the electronic component and is set to a predetermined threshold. An output of the comparator changes if a difference exists between the first signal and the second signal. The electrical circuit includes a variable gain amplifier that provides the first signal to the comparator, where a gain of the variable gain amplifier is set according to the predetermined threshold.

Abstract: Electronic circuitry comprising operational circuits of active switching type requiring timing signals, and conductive means for distributing said timing signals to the operational circuits, wherein the timing signal distribution means includes a signal path that has different phases of a drive signal are supplied via active means at different positions about the signal path where that path exhibits endless electro-magnetic continuity without signal phase inversion or has interconnections with another signal path having different substantially unidirectional signal flow where there is no endless electromagnetic continuity between those signal paths and generally has non-linear associated circuit means where the signal path is of a transmission line nature.

Abstract: A method for calibrating a clock and data recovery circuit may include configuring a phase detector as a bang-bang phase detector. The bang-bang phase detector may be used to determine a phase difference between a sampling clock provided by an interpolator and a calibration signal. The phase detector may also be configured as a linear phase detector. While using the linear phase detector, a linear phase detector parameter may be adjusted such that the phase difference between the calibration signal and the sampling clock is zero, while keeping the phase of the sampling clock fixed.

Abstract: Packages and methods for 3D integration are disclosed. In various embodiments, a first integrated device die having a hole is attached to a package substrate. A second integrated device die can be stacked on top of the first integrated device die. At least a portion of the second integrated device die can extend into the hole of the first integrated device die. By stacking the two dies such that the portion of the second integrated device die extends into the hole, the overall package height can advantageously be reduced.

Abstract: Harsh electrical environments integrated circuit protection for system-level robustness and methods of forming the same are provided. In one embodiment, a protection system includes dual-polarity high blocking voltage primary and secondary protection devices each electrically connected to a pad. The primary protection device has a current handling capability greater than a current handling capability of the secondary protection devices, and the secondary protection device has a turn-on speed that is faster than a turn-on speed of the primary protection device so as to decrease pad voltage overshoot when a fast transient electrical event occurs on the pad. Additionally, the holding voltage of the primary protection device is less than a holding voltage of the secondary protection device such that once the primary protection device has been activated the primary protection device clamps the pad voltage so as to minimize a flow of high current through the secondary protection device.

Abstract: Apparatus and methods for precision mixed-signal electronic circuit protection are provided. In one embodiment, an apparatus includes a p-well, an n-well, a poly-active diode structure, a p-type active region, and an n-type active region. The poly-active diode structure is formed over the n-well, the p-type active region is formed in the n-well on a first side of the poly-active diode structure, and the n-type active region is formed along a boundary of the p-well and the n-well on a second side of the poly-active diode structure. During a transient electrical event the apparatus is configured to provide conduction paths through and underneath the poly-active diode structure to facilitate injection of carriers in the n-type active region. The protection device can further include another poly-active diode structure formed over the p-well to further enhance carrier injection into the n-type active region.

Abstract: A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to expose the trench using the handling wafer to handle the wafer during such grinding, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer.

Abstract: Various embodiments provide systems and methods that allow a LIDAR system to sense nearby objects with relatively low-cost elements, and fewer elements than traditional LIDAR systems by sampling an infrared pulse at a high sample rate and storing the samples in the analog domain. The samples may then be digitized at a rate slower than the sample rate.

Abstract: A transmission module is provided that includes a transmitter, a loopback receiver, and a QEC controller. In a first state, the QEC controller calibrates the loopback receiver to remove quadrature imbalance in the loopback receiver. In a second state, a communication pathway is provided between the transmitter and the loopback receiver, and the QEC controller identifies quadrature imbalance in the transmitter based at least one a comparison of the data signals at the output of the loopback receiver with data signals at the input of the transmitter. Based on the comparison, the QEC controller can adjust one or more characteristics of the transmitter to correct quadrature errors in the transmitter.