Abstract: An analog-to-digital converter includes a delta circuit, a sigma circuit, and a quantizer circuit and further includes a feedback circuit that modulates a reference voltage provided to the quantizer circuit based on the quantizer circuit output. Modulation of the quantizer reference voltage dithers the quantizer circuit to effectively reduce or avoid lock bands. The analog-to-digital converter may be used in combination with a microelectromechanical (MEMS) device such as a gyroscope, an accelerometer, or a pressure sensor.

Abstract: A differential current output driver and a method for overvoltage protection of a differential current output driver circuit are provided. The output driver includes a differential current output driver circuit operable by a power supply voltage and including first and second driver transistors in a differential current configuration and first and second output pads, and an overvoltage protection circuit configured to generate a protected voltage in response to a voltage on at least one of the first and second output pads and an absence of the power supply voltage, and to apply the protected voltage to at least one transistor of the differential current output driver circuit.

Abstract: The invention is directed to an amplifier including an absolute value circuit. The absolute value circuit may be driven by differential potentials and may include a first pair of transistors modulating a tail current of the amplifier when a differential input voltage goes high, and a second pair of transistors modulating the tail current of the amplifier when a differential input voltage goes low.

Abstract: The intercept of a logarithmic amplifier is temperature stabilized by generating a signal having the form H log H where H is a function of temperature such as T/T0. The first H factor is cancelled, thereby generating a correction signal having the form Y log H. The cancellation may be implemented with a transconductance cell having a hyperbolic tangent function. The H log H function may be generated by a pair of junctions biased by one temperature-stable current and one temperature-dependent current. The pair of junctions and the transconductance cell may be coupled together in a translinear loop. A user-accessible terminal may allow adjustment of the correction signal for different operating frequencies.

Abstract: An H-bridge buck-boost converter includes a first half-bridge portion having at least one first transistor, an inductor portion connected to the first half-bridge portion at a first connection, a second half-bride portion connected to the inductor portion at a second connection, the second half-bridge portion having at least one second transistor, and a control portion configured to provide a first switching signal to a gate of the first transistor of the first half-bridge portion as a function of a voltage at the first connection.

Abstract: A bootstrapped switch circuit can include a switch transistor, having a drain configured as an input terminal to receive an input signal, and a voltage-controlled voltage source, configured to provide predetermined constant voltages between a gate and a source of the switch transistor in response to a control signal received at a control terminal. The predetermined constant voltages can include a first predetermined constant voltage to turn on the switch transistor and pass the input signal to the source and a second predetermined constant voltage to turn off the switch transistor. The first and second predetermined constant voltages can be independent of the magnitude of a signal passed to the source of the switch transistor based on the input signal at the drain.

Abstract: A bootstrapped switch circuit can include a switch transistor, having a drain configured as an input terminal to receive an input signal, and a voltage-controlled voltage source, configured to provide predetermined constant voltages between a gate and a source of the switch transistor in response to a control signal received at a control terminal. The predetermined constant voltages can include a first predetermined constant voltage to turn on the switch transistor and pass the input signal to the source and a second predetermined constant voltage to turn off the switch transistor. The first and second predetermined constant voltages can be independent of the magnitude of a signal passed to the source of the switch transistor based on the input signal at the drain.

Abstract: A system for converting an analog signal to a digital codeword having N bit positions that includes a dual DAC structure having a small DAC and a large DAC. At least one comparator is coupled to the small DAC and large DAC. The small DAC performs bit trials to calculate bit positions 1 to M, and the large DAC with performs bit trial calculates bit positions M+1 to N after having been set with bit decisions from the bit trials of the small DAC.

Abstract: Detecting and/or mitigating the presence of particle contaminants in a MEMS device involves including MEMS structures that in normal operation are robust against the presence of particles but which can be made sensitive to that presence during a test mode prior to use, e.g.

Abstract: An analog to digital converter, comprising a first converter adapted to perform a first, more significant, part of a conversion as a successive approximation conversion, a pipeline conversion or a flash conversion to generate a first conversion result and a residue. The ADC also comprising a second converter adapted to perform a second, least significant, part of the conversion as a sigma-delta conversion by sampling the residue to generate a second conversion result, and a processor adapted to combine the first conversion result and the second conversion result to generate a final conversion result.

Abstract: A device for amplifying signals over a wide frequency range features stacked amplifying modules connected between a DC voltage source and an electrical ground. The stacking configuration reuses the DC current produced the voltage source, and thus reduces the amount of operational DC current permitting the use of lower voltage, higher frequency devices to be used. The amplifying modules are fed signals which are different versions of an input signal, and the output signals are AC coupled using capacitors to balance out gain imbalances and asymmetries between the amplifying modules.

Abstract: A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.

Abstract: An embodiment of a voltage-measuring circuit includes: a first resistor connected to a first measurement node; a second resistor connected to the first resistor and a second measurement node; a configuration switch configured to, in response to a control signal, selectively interconnect the first and second resistors, during enable and disable phases of the control signal respectively, into and out of either a parallel or a series configuration; and a control and measurement circuit configured to provide the control signal, receive a first measurement voltage from the first and second measurement nodes during the enable phase, and receive a second measurement voltage from the first and second measurement nodes during the disable phase.

Abstract: A microphone system has a package with an interior, a MEMS microphone within the package interior and forming a backvolume between it and the package interior, and a MEMS valve coupled with at least one input aperture in the package. The package defines at least one input aperture (e.g., the prior noted aperture) for receiving an acoustic signal, and the MEMS microphone is mechanically coupled to at least a portion of one input aperture. The valve has a valve opening generally circumscribed by a valve seat. The valve is considered as having an open mode for permitting acoustic signal access into the package interior through the valve opening, and a closed mode for substantially preventing acoustic signal access into the package interior through the valve opening. The valve has a movable member configured to contact the valve seat when in the closed mode. This movable member is configured to move between the open mode and the closed mode in a direction that is generally perpendicular to the valve seat.

Abstract: A sealed capacitive sensor includes a substrate having a diaphragm forming a first plate of a capacitor; a second fixed plate of the capacitor spaced from the diaphragm and defining a predetermined dielectric gap and a sealing medium connecting together the substrate and fixed plate in an integrated structure and hermetically sealing the gap.

Abstract: An electronics package includes a wafer die substrate containing electronic circuits and having a top surface and a bottom surface. A top protective layer is substantially thinner than the substrate and covers the top surface. A bottom protective layer is substantially thinner than the substrate and covers the bottom surface. Circuit contacts are distributed about the bottom protective layer for electrically coupling the substrate electronic circuits to external electronic circuits.

Abstract: A low-temperature inorganic dielectric ALD film (e.g., Al2O3 and TiO2) is deposited on a packaged or unpackaged chip device so as to coat the device including any exposed electrical contacts. Such a low-temperature ALD film generally can be deposited without damaging the packaged chip device. The ALD film is typically deposited at a sufficient thickness to provide desired qualities (e.g., hermeticity for the entire packaged chip device, passivation for the electrical contacts, biocompatibility, etc.) but still allow for electrical connections to be made to the electrical contacts (e.g., by soldering or otherwise) directly through the ALD film without having to expose the electrical contacts.

Abstract: Methods and apparatus are provided for performing a jump operation in a pipelined digital processor. The method includes writing target addresses of jump instructions to be executed to a memory table, detecting a first jump instruction being executed by the processor, the first jump instruction referencing a pointer to a first target address in the memory table, the processor executing the first jump instruction by jumping to the first target address and modifying the pointer to point to a second target address in the memory table, the second target address corresponding to a second jump instruction. The execution of the first jump instruction may include prefetching at least one future target address from the memory table and writing the future target address in a local memory. The second target address may be accessed in the local memory in response to detection of the second jump instruction.

Abstract: A bipolar transistor comprising an emitter region, a base region and a collector region, and a guard region spaced from and surrounding the base. The guard region can be formed in the same steps that form the base, and can serve to spread out the depletion layer in operation.

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.