Abstract: The present disclosure provides an impedance measurement circuit for measuring and detecting variations in an impedance under test, and methods of operating the impedance measurement circuit. The impedance measurement circuit comprises a plurality of converts, including at least two digital-to-analog converters (DACs). The DACs together alternate between a first mode of operation and a second mode of operation. In the first mode, a first one of the DACs is operational to convert a first digital input signal to a first analog output using a first hardware component, and a second one of the DACs is operational to convert a second digital input signal to a second analog output using a second hardware component.

Abstract: The present disclosure provides a current-to-voltage signal converter which may operate at an adjusted voltage. The current-to-voltage converter includes a trans-impedance amplifier which converts a current input into a voltage output. The voltage output may operate around an undesirable predetermined voltage, and must therefore be adjusted in order to make it suitable for any downstream signal processing circuitry, such as an ADC. As such, a subtractor circuit is coupled to the output of the trans-impedance amplifier. At the input of the subtractor circuit, a voltage adjustment circuit is employed, to adjust the voltage input to the subtractor circuit. As such, the input to the subtractor is adjusted between a first predetermined voltage threshold and a second predetermined voltage threshold, and the subtractor circuit may therefore be a low-voltage component.

Abstract: A multi-stage transimpedance amplifier (TIA) with an adjustable input linear range is disclosed. The TIA includes a first stage, configured to convert a single-ended current signal from an optical sensor of a receiver signal chain to a single-ended voltage signal, and a second stage, configured to convert the single-ended voltage signal provided by the first stage to a differential signal. In such a TIA, the input linear range may be adjusted using a clamp that is programmable with an output offset current to keep the second stage of the TIA from overloading and to maintain a linear transfer function without compression.

Abstract: Disclosed herein are some examples of analog-to-digital converters (ADCs) that can perform auto-zeroing with amplifying a signal for improvement of a signal-to-noise ratio. The ADCs may produce a first digital code to represent an analog input signal and a second digital code based on a residue from the first digital code, and may combine the first digital code and the second digital code to produce a digital output code to represent the analog input signal. The ADC may utilize a first observation and a second observation of an analog residue value representing the residue to produce the second digital code.

Abstract: The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

Abstract: An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.

Abstract: An example analog signal multiplexer includes two differential input signal ports for receiving a first and a second differential input signals, IN1 and IN2. The multiplexer further includes a differential output signal port with two output terminals OUT+ and OUT?, for outputting a signal based on one or more of the input signals IN1 and IN2. Furthermore, the multiplexer includes a pair of load elements, and an additional differential output signal port that has two output terminals TERM+ and TERM?. The load elements are not coupled directly to the output terminals OUT+ and OUT?, but, rather, are coupled to the output terminals of the additional output signal port, TERM+ and TERM?, enabling a modular approach where multiple instances of the multiplexer may be combined on an “as-needed” basis to realize multiplexing between a larger number of differential inputs that a single multiplexer would allow.

Abstract: Embodiments may relate to techniques or circuitry for the control of a clock signal by a phase-locked loop (PLL) circuit. The technique may include the identification of a first parameter related to a gain of a digitally controlled oscillator (DCO) and a second parameter related to a resolution of a time-to-digital converter (TDC). The technique may then include the identification of a third parameter related to filter coefficients of a loop filter of the PLL circuit based on the first and second parameter. The circuit may then output a clock signal based on the first, second, and third parameters. Other embodiments may be described or claimed.

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.

Abstract: An apparatus that implements DPD in a manner that can address OOB instability issues, PE instability issues, or both, is disclosed. The apparatus includes an actuator circuit configured to use a model of a power amplifier (PA) to apply a predistortion to at least a portion of an input signal, and an error correction circuit configured to generate an error signal indicative of a deviation of the output of the actuator circuit from the target output, e.g., in terms of OOB or PE. The apparatus also includes an adaptation circuit configured to update the model based on the error signal. By using such an error in adapting the model used for the DPD, undesirable effects of performing DPD, such as creation or amplification of OOB frequency components, or increasing amplitude of some samples, may be reduced or eliminated.

Abstract: Time of Flight (ToF) image processing methods include collecting correlation samples to calculate a phase estimate. Systems and methods are provided for collecting correlation samples from multiple pixels. An image processing system for continuous waves includes a light source configured to emit light, an image sensor having a plurality of pixels, and a processor configured to collect correlation samples from a subset of the plurality of pixels in the image sensor.

Abstract: Disclosed herein are transconductance circuits, as well as related methods and devices. In some embodiments, a transconductance circuit may include an amplifier having a first input coupled to a voltage input of the transconductance circuit, and a switch coupled between an output of the amplifier and a second input of the amplifier.

Abstract: An image processing system for time-of-flight depth imaging includes a processor for determining depth measurements using different modes of operation. The processor determines depth measurements in a first set of frames using a second set of frames. The first mode is a continuous wave modulation mode without depth linearization and the second mode is a continuous wave modulation mode with depth linearization. The depth estimates collected in the second mode using depth linearization are used to correct the depth estimates collected in the first mode.

Abstract: Herein disclosed is an example analog-to-digital converter (ADC) and methods that may be performed by the ADC. The ADC may derive a first code that approximates a combination of an analog input value of the ADC and a dither value for the ADC sampled on a capacitor array. The ADC may further derive a second code to represent a residue of the combination with respect to the first code applied to the capacitor array. The ADC may combine the numerical value of the first code and the numerical value of the second code to produce a combined code applied to the capacitor array for deriving a digital output code. Combining the numerical value of the first code and the numerical value of the second code in the digital domain can provide for greater analog-to-digital (A/D) conversion linearity.

Abstract: Bias arrangements for amplifiers are disclosed. An example arrangement includes a bias circuit, configured to produce a bias signal for the amplifier, and a linearization circuit, configured to improve linearity of the amplifier by modifying the bias signal based on an RF signal indicative of an RF input signal to be amplified by the amplifier. The linearization circuit includes a bias signal input for receiving the bias signal, an RF signal input for receiving the RF signal, and an output for providing a modified bias signal. The linearization circuit further includes at least a first linearization transistor, having a first terminal, a second terminal, and a third terminal, where each of the bias signal input and the RF signal input of the linearization circuit is coupled to the first terminal of the first linearization transistor, and the output of the linearization circuit is coupled to the third terminal of the first linearization transistor.

Abstract: Systems and methods are provided for reducing power in in-memory computing, matrix-vector computations, and neural networks. An apparatus for in-memory computing using charge-domain circuit operation includes transistors configured as memory bit cells, transistors configured to perform in-memory computing using the memory bit cells, capacitors configured to store a result of in-memory computing from the memory bit cells, and switches, wherein, based on a setting of each of the switches, the charges on at least a portion of the plurality of capacitors are shorted together. Shorting together the plurality of capacitors yields a computation result.

Abstract: Thermal temperature sensors for power amplifiers are provided herein. In certain implementations, a semiconductor die includes a compound semiconductor substrate, and a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal. The plurality of FETs are arranged on the compound semiconductor substrate as a transistor array. The semiconductor die further includes a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array. The semiconductor resistor is located adjacent to one end of the transistor array.

Abstract: Apparatus and methods for rotary traveling wave oscillators (RTWOs) are disclosed. In certain embodiments, an RTWO system include an RTWO ring that carries a traveling wave, a plurality of selectable capacitors distributed around the RTWO ring and each operable in a selected state and an unselected state, and a decoder system that controls selection of the plurality of selectable capacitors based on a frequency tuning code. The frequency tuning code includes a fine tuning code and a coarse tuning code, and the decoder system is operable to maintain a constant number of capacitors that toggle state for each value of the fine tuning code.

Abstract: Bias arrangements for amplifiers are disclosed. An example bias arrangement for an amplifier includes a bias circuit, configured to produce a bias signal for the amplifier; a linearization circuit, configured to improve linearity of the amplifier by modifying the bias signal produced by the bias circuit to produce a modified bias signal to be provided to the amplifier; and a coupling circuit, configured to couple the bias circuit and the linearization circuit. Providing separate bias and linearization circuits coupled to one another by a coupling circuit allows separating a linearization operation from a biasing loop to overcome some drawbacks of prior art bias arrangements that utilize a single biasing loop.