Abstract: Data is received that characterizes an integrated circuit and which includes a plurality of Standard Test Interface Language (STIL) codes and at least one file defining physical and/or logical parameters of the integrated circuit. Thereafter, using the received data, a power integrity analysis of the integrated circuit is performed to estimate power induced noise in a double glitch capture mode. Data is then provided that characterizes the performed double glitch capture mode power integrity analysis of the integrated circuit. Related apparatus, systems, techniques and articles are also described.
Type:
Grant
Filed:
February 18, 2020
Date of Patent:
January 4, 2022
Assignee:
ANSYS, Inc.
Inventors:
Sooyong Kim, Wenliang Zhang, Xiaoqin Liu, Yaowei Jia
Abstract: Machine assisted systems and methods for use in a solver are described. These systems and methods can use the solver to perform a setup phase, based on left-looking incomplete inverse fast multipole (LL-IFMM) operation on matrix A, and perform a solve phase for calculating a matrix-vector product for the matrix A based on a forward and backward substitution (FBS) method. The parallelization of the setup phase and the solve phase based on an elimination tree method. The parallelization of the setup phase and the solve phase being implemented using hybrid scheduling. The solver, once implemented, can provide timely solutions for ill-conditioned problems, such as circuits with thin conductors. The solver can also enhance a parasitic extractor accuracy when solving problems with a very large number of right-hand sides (RHS).
Type:
Grant
Filed:
October 18, 2019
Date of Patent:
December 28, 2021
Assignee:
ANSYS, INC.
Inventors:
Indranil Chowdhury, David Fernandez Becerra
Abstract: Example systems and methods are disclosed for performing a timing analysis on a circuit design. A plurality of switching scenarios are identified for the circuit design. One or more predictive models are applied to predict a subset of the plurality of switching scenarios that are likely to cause timing paths with critical timing problems. A dynamic voltage analysis is performed on timing paths based on the subset of switching scenarios. The one or more predictive models are applied to predict a set of critical timing paths based on the subset of switching scenarios that are likely to cause critical timing problems, the one or more predictive models taking into account the dynamic voltage analysis. A timing analysis is the performed on the set of critical timing paths.
Abstract: Systems and methods are provided for performing a thermal simulation of an additive manufacturing process. In embodiments, one or more data sets (such as a temperature dependent thermal conductivity matrix and a temperature dependent heat capacity matric) characterize an ease of heat flow through a three-dimensional (3D) geometry. The one or more data sets are used to determine a thermal solution for an explicit solution length, where the explicit solution length is a length along a scan line of one two dimensional (2D) slice of the 3D geometry. A thermal solution for the scan line is generated by propagating the thermal solution for the explicit solution length along sequential time steps of the scan line and using Eigenmodal cooling to adjust for cooling of a heat residual between sequential time steps.
Abstract: Existing tetrahedral meshing which require watertight and intersection free triangular mesh as input can be enhanced to tolerate and respect self-intersecting boundaries. After an initial tetrahedral mesh constructed with all input nodes, intersecting faces can be recovered using the proposed method. Starting from one of the intersecting faces, a set of intersecting faces around it can be detected, and a surrounding region can be sculpted out to form a void. Two intersection-free and topologically separate cavities can then be defined within the void and meshed independently. After stitching the meshes from the two cavities back to the original initial mesh, the existing tetrahedral meshing can continue with the regular meshing steps such as refinement etc. to finish tetrahedral meshing.
Abstract: In one embodiment, a system derives non-equilibrium thermophysical values for phase property changes of a material from equilibrium thermophysical values of the material for a manufacturing process which involves heating and/or cooling of the material (such as an additive manufacturing, 3D printing, welding, or joining process). The system performs a simulation of the manufacturing process based upon the derived non-equilibrium and/or equilibrium thermophysical values. The system generates a set of results based on the simulation, the set of results indicating predicted physical properties of the material for the manufacturing process.
Abstract: Systems and methods are provided for the refining and coarsening of a polyhedra mesh. The refinement includes identifying a plurality of polyhedral cells within a polyhedra mesh. A plurality of parent faces having a plurality of parent face edges are extracted for each polyhedral cell within the polyhedra mesh. For each parent face, a plurality of nodes are defined and connected either isotropically or anisotropically. A plurality of non-overlapping child faces are generated with a perimeter defined by a combination of parent face edges and child face edges. A plurality of child cells are generated from the connection of child faces of the plurality of non-overlapping child faces. Subsequent coarsening of the plurality of child cells occurs by the simultaneous agglomeration into each respective parent cell.
Abstract: A method and apparatus for extending, customizing and validating a simulation-based digital twin model is described. In an exemplary embodiment, the device transmits a model to a client, where the model is a simulation-based digital twin model. In addition, the device receives a customization to the model, the where the customization adds a functionality to the model. Furthermore, the device deploys the model in a model platform, where the model is used in a simulation with the model platform and the model is coupled with the model platform.
Type:
Grant
Filed:
December 20, 2019
Date of Patent:
November 2, 2021
Assignee:
ANSYS, INC.
Inventors:
Adriano Kurz Maron, Xiao Li, Sameer Kher
Abstract: Systems and methods are provided for providing real-time interactive design and simulation of a physical system to generate comparisons of varying system configurations under different physical conditions. A display is generated on a graphical user interface that displays a part in a physical system according to characteristic data. An initial simulation of the physical system is executed to determine an initial value for a metric of the initial design. The initial value is displayed on the graphical user interface. A change of the characteristic data or the environment condition is received through a user interface. The simulation of the physical system is recalculated to determine a next value for the metric based on the change, the next value for the metric being displayed on the graphical user interface along with the initial value in real time relative to the received change.
Abstract: Systems and methods are provided herein for interfacing between a solver and one or more models. Data comprising at least one solver function is received from a solver interface. Data comprising at least one modeling function corresponding to the solver function is provided to a model interface. The presence of an event occurrence is detected based on interface functions. The interface functions are mapped to the at least one solver function and the at least one modeling function. The interface functions are provided to the solver interface to determine a solution. The solution is initiated for rendering on a graphical user interface.
Abstract: Machine assisted system and method for changing the shape of a faceted surface using points that move in their local coordinate system collectively are described. The method can include receiving a model having a predefined faceted geometry, the model representing a physical structure that is designed or simulated in a data processing system; generating points surrounding the predefined faceted geometry to be morphed; automatically assigning each of the generated points a respective local coordinate system; selecting a control point among the generated points for controlling a movement of the generated points; and displacing the selected control point in a local coordinate system assigned to the selected control point to cause each point to move based on movement of the selected control point according to the assigned local coordinate system, wherein the displacement of the selected control point guides a morphing of the predefined faceted geometry in the model.
Abstract: A chip package system comprising N multiple processor cores can be tested by receiving a data file characterizing the chip package system. Thereafter, simulation testing is conducted for each core for each of Mi . . . j states using the data file such that each core is active in each state while all other cores are inactive. Each simulation test results in a simulation. The simulations are then combined to result in a composite test covering MN*j combinations. Related apparatus, systems, techniques and articles are also described.
Type:
Grant
Filed:
March 22, 2018
Date of Patent:
June 22, 2021
Assignee:
Ansys, Inc.
Inventors:
John Lee, Aveek Sarkar, Altan Odabasi, Scott Johnson, Murat Becer, William Mullen
Abstract: Systems and methods are provided for a computer-implemented method for generating a display of radar returns. A geometry data structure is accessed that identifies characteristics of a region of interest including dimensions and movement of one or more objects in the region of interest. A pulse of a plurality of rays is transmitted from an antenna position into the region of interest and the velocities of returns of the rays are captured at a receiver position after the rays have interacted with the one or more objects. Each ray return is assigned into one of a plurality of bins based on the velocity of that ray. A Fourier transform is performed using the binned data to obtain a system response at discrete time intervals. The system response at the discrete time intervals is transformed into Doppler velocity data, and the Doppler velocity data is stored and displayed on a graphical user interface.
Abstract: This disclosure describes methods, systems and media for analyzing voltage drops in a power delivery network in a simulated design of an electrical circuit. In one embodiment, a system determines, for a victim element (“victim”), a voltage drop caused by each aggressor element (“aggressor”) in a set of aggressors in the design and creates a data structure that includes, for each victim, at least one of: (1) each voltage drop caused by each aggressor in the set of aggressors or (2) a sum of the voltage drops on the victim caused by all of the aggressors in the set of aggressors. The system can then compute a set of simulations based on random inputs to generate a distribution of possible voltage drops for each victim using data in the data structure.
Abstract: Systems and methods are provided for generating a state space model of a physical system. A matrix decomposition module is configured to receive input data and determine a size of an input matrix based on the input data. When the input matrix size is below a threshold, a singular value decomposition of the input matrix is determined using a first technique. When the input matrix size is above the threshold the input matrix is subdivided into a plurality of subparts. For each subpart, a separability value of that subpart is determined. When the separability value indicates that the subpart is well separated, a singular value decomposition of that subpart is determined using a second technique. When the separability value indicates that the subpart is not well separated, data associated with that subpart is provided to the matrix decomposition module via a recursive call.
Abstract: Systems and methods are provided for performing parallel transient simulations for an electrical circuit. A plurality of segments are generated from a simulation length, and simulations are performed using a plurality of processors for the segments to generate simulation results. An output is generated based at least in part on the simulation results.
Abstract: Data is received that characterizes a chip in the package system (CPS) having a plurality of wires and vias. Thereafter, using the received data, a chip power calculation is performed. The chip power calculated is used to generate a thermal-aware power map. Further, package and system level thermal analysis is performed using the power map to generate a tile-based CPS thermal profile. A plurality of chip finite element sub-models are then generated that each correspond to a different tile. A thermal field solution is solved for each sub-model so that, for each wire, wire temperature rises are extracted from the corresponding the chip sub-model analysis and combined with temperature values from the CPS thermal profile. This extracting and combining is then used to generate a back-annotation file covering each metal wire and via in the CPS.
Type:
Grant
Filed:
January 23, 2020
Date of Patent:
April 6, 2021
Assignee:
ANSYS, Inc
Inventors:
Hsiming Pan, Zhigang Feng, Norman Chang
Abstract: Computer-implemented systems and methods are described herein for determining mechanical properties of an electronic assembly. An input specification for a model of the electronic assembly is received, wherein the input specification includes a compressible body and a surrounding component in the electronic assembly. A geometric interference between the compressible body and the surrounding component is identified. A displacement is generated for the compressible body to account for the geometric interference. A non-linear contact is then generated between the displaced compressible body and the surrounding component. The model is updated with the displacement and the non-linear contact. Then, a resulting force equilibrium is determined within the electronic assembly based on the updated model, wherein the resulting force equilibrium is determined by removing the displacement from the updated model.
Inventors:
Frank Edward DeSimone, Glyn Russell Jarvis, Sanjaykumar Ranganayakulu, Jared Anthony Pryor, Andrea Woolfe Felix, Gregory Mark Alldredge, Richard Franklin Kutz