Abstract: In a multiple patterning techniques, where two or more exposures are used to form a single layer of a device, the splitting of features in a single layer between the multiple exposures is carried out additionally with reference to features of another associated layer and the splitting of that layer into two or more sets of features for separate exposure. The multiple exposure process can be a process involving repeated litho-etch steps desirably, the alignment scheme utilized during exposure of the split layers is optimized with reference to the splitting approach.

Abstract: An immersion lithographic projection apparatus having a megasonic transducer configured to clean a surface and a method of using megasonic waves through a liquid to clean a surface of an immersion lithographic projection apparatus are disclosed. A flow, desirably a radial flow, is induced in the liquid.

Abstract: A lithographic apparatus is provided that has a sensor at substrate level, the sensor including a radiation receiver, a transmissive plate supporting the radiation receiver, and a radiation detector, wherein the sensor is arranged to avoid loss of radiation between the radiation receiver and a final element of the radiation detector.

Abstract: A radiation source is configured to produce extreme ultraviolet radiation. The radiation source includes a chamber in which, in use, a plasma is generated, and an evaporation surface configured to evaporate a material formed as a by-product from the plasma and that is emitted to the evaporation surface. A method for removing a by-product material in or from a plasma radiation source of a lithographic apparatus includes evaporating a material which, in use, is emitted to that surface from the plasma.

Abstract: A method controls scanning function of a lithographic apparatus. A monitor wafer is exposed to determine baseline control parameters pertaining to the scanning function. The baseline control parameters are retrieved from the monitor wafer. Parameter drift is determined from the baseline control parameters. Compensation is performed based on the determination. A different parameterization is used for control of the scanning control module than for communication between the scanning control module and the lithographic apparatus.

Abstract: A positioning device for positioning an object within a lithographic apparatus, including a support structure for supporting the object, at least two short-stroke units, each connected to the support structure, and a long-stroke unit. In the arrangement, each of the short-stroke units includes a short-stroke actuator system configured to provide independently at least one actuation force between the short-stroke unit and the long-stroke unit, and the long-stroke unit includes a long-stroke actuator system configured to provide at least one actuation force between the long-stroke unit and a reference structure of the lithographic apparatus.

Abstract: A lithographic apparatus with a cover plate formed separately from a substrate table and means for stabilizing a temperature of the substrate table by controlling the temperature of the cover plate is disclosed. A lithographic apparatus with thermal insulation provided between a cover plate and a substrate table so that the cover plate acts as a thermal shield for the substrate table is disclosed. A lithographic apparatus comprising means to determine a substrate table distortion and improve position control of a substrate by reference to the substrate table distortion is disclosed.

Abstract: A method produces at least one monitor wafer for a lithographic apparatus. The monitor wafer is for use in combination with a scanning control module to periodically retrieve measurements defining a baseline from the monitor wafer, thereby determining parameter drift from the baseline. In doing this, allowance and/or correction can be to be made for the drift. The baseline is determined by initially exposing the monitor wafer(s) using the lithographic apparatus to perform multiple exposure passes on each of the monitor wafer(s). An associated lithographic apparatus is also disclosed.

Abstract: Actuation systems and lithographic apparatus which address the issue of uncontrolled return of common mode currents are provided. In an embodiment such systems aim to prevent the occurrence of corona and discharge between high voltage electric cables in low pressure environments. An exemplary actuation system includes comprises an actuator module, a power source and power transmission cables. The actuator module includes an electrical motor and a first plurality of shielded cables configured to connect to the electrical motor at one end. The actuator module is located in a low pressure environment and each shield of the first plurality of cables is grounded. The transmission cables electrically connect the first plurality of cables with power supply, and include an extra cable configured to connect each shield of the first plurality of cables with the first extra cable, via a choke so as to provide a return path for common-mode currents.

Abstract: A lithographic apparatus includes an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; at least three substrate tables that are each constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate, wherein the substrate tables are moveable in a common moving area extending substantially in a plane perpendicular to the patterned radiation beam, the moving area comprising at least three working locations of which at least one working location is arranged for exposure of the substrate to the patterned radiation beam and at least one working location is arranged for non-exposure purposes.

Abstract: In a lithographic apparatus, a slip of a patterning device relative to a support, the support constructed to support the patterning device, may be provided by measuring a position of the support relative to a first structure of the lithographic apparatus; measuring a position of the patterning device relative to a second structure of the lithographic apparatus; determining a correlation between the position of the patterning device and the position of the support from the measured position of the support, the measured position of the patterning device, and the mutual positions of the first and second structures; and deriving from the correlation a slip of the patterning device relative to the support. The structure may include a projection system to project a radiation beam patterned by the patterning device. The projection system may be connected to a frame, such as a metrology frame of the lithographic apparatus.

Abstract: A lithographic apparatus includes a patterning subsystem for transferring a pattern from a patterning device onto a substrate controlled in accordance with recorded measurements of level variations across a surface of the substrate. A level sensor is provided for projecting a level sensing beam of radiation to reflect from a location on the substrate surface and for detecting the reflected sensing beam to record the surface level at said location. The level sensor incorporates at least one moving optical element to scan the substrate surface by optical movement in at least one dimension to obtain measurements of surface level at different locations without mechanical movement between the level sensor and the substrate. Optical path length equalization measures may be employed, using shaped reflectors and/or additional moving mirrors, to avoid focus variation during the scan.

Abstract: System and methods estimate model parameters of a lithographic apparatus and control lithographic processing by a lithographic apparatus. An exposure is performed using a lithographic apparatus across a wafer. A set of predetermined wafer measurement locations is obtained. Discrete orthonormal polynomials are generated using the predetermined substrate measurement locations. The overlay errors arising from the exposure are measured at the predetermined locations to obtain overlay measurements. The estimated model parameters of the lithographic apparatus are calculated from the overlay measurements by using the discrete orthogonal polynomials as a basis function to model the overlay across the wafer. Finally, the estimated model parameters are used to control the lithographic apparatus in order to provide corrected overlay across the wafer.

Abstract: An object holder (100) for a lithographic apparatus has a main body (400) having a surface (400a). A plurality of burls (406) to support an object are formed on the surface or in apertures of a thin-film stack (410, 440, 450). At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.

Abstract: A lithographic reticle is illuminated to transfer a pattern to a substrate, inducing distortions due to heating. The distortions are calculated using reference marks in a peripheral portion of the reticle and measuring changes in their relative positions over time. A plurality of cells are defined for which a system of equations can be solved to calculate a dilation of each cell. In an embodiment, each equation relates positions of pairs of marks to dilations of the cells along a line (s, s1, s2) connecting each pair. Local positional deviations can be calculated for a position by combining calculated dilations for cells between at least one measured peripheral mark and the position. Corrections can be applied in accordance with the result of the calculation. Energy may be applied to the patterning device (for example by thermal input or mechanical actuators) to modify a distribution of the local positional deviations.

Abstract: A fuel stream generator comprising a nozzle connected to a fuel reservoir, wherein the nozzle is provided with a gas inlet configured to provide a sheath of gas around fuel flowing along the nozzle is disclosed. Also disclosed are a method of generating fuel droplets and a lithography apparatus incorporating the fuel stream generator.

Abstract: A lithographic apparatus with a cover plate formed separately from a substrate table and means for stabilizing a temperature of the substrate table by controlling the temperature of the cover plate is disclosed. A lithographic apparatus with thermal insulation provided between a cover plate and a substrate table so that the cover plate acts as a thermal shield for the substrate table is disclosed. A lithographic apparatus comprising means to determine a substrate table distortion and improve position control of a substrate by reference to the substrate table distortion is disclosed.

Abstract: A method for determining an image of a mask pattern in a resist coated on a substrate, the method including determining an aerial image of the mask pattern at substrate level; and convolving the aerial image with at least two orthogonal convolution kernels to determine a resist image that is representative of the mask pattern in the resist.

Abstract: A cover is provided for a substrate table in an immersion lithographic apparatus that covers at least the gap between a substrate and a recess in a substrate table in which the substrate is received.

Abstract: A method and apparatus for cleaning the inside of an immersion lithographic apparatus is disclosed. In particular, a liquid supply system of the lithographic apparatus may be used to introduce a cleaning fluid into a space between the projection system and the substrate table of the lithographic apparatus. Additionally or alternatively, a cleaning device may be provided on the substrate table and an ultrasonic emitter may be provided to create an ultrasonic cleaning liquid.