Abstract: An imprint lithography apparatus is disclosed that includes a support structure configured to hold an imprint template. The apparatus further includes an actuator located between the support structure and a side of the imprint template, when the imprint template is held by the support structure, configured to apply a force to the imprint template and a force sensor between the support structure and a side of the imprint template, when the imprint template is held by the support structure.

Abstract: The present invention relates to lithographic apparatuses and processes, and more particularly to tools for optimizing illumination sources and masks for use in lithographic apparatuses and processes. According to certain aspects, the present invention significantly speeds up the convergence of the optimization by allowing direct computation of gradient of the cost function. According to other aspects, the present invention allows for simultaneous optimization of both source and mask, thereby significantly speeding the overall convergence. According to still further aspects, the present invention allows for free-form optimization, without the constraints required by conventional optimization techniques.

Abstract: According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.

Abstract: A lithographic apparatus is provided with a sensor. The sensor comprises a frame that defines a space that is crossed multiple times by wire. Detection electronics are connected to the wire and configured to detect a change of temperature of the wire due to infrared radiation being incident upon the wire. The detection electronics are further configured to provide an output signal in the event that a change of temperature of the wire is detected.

Abstract: A method for configuring an illumination source of a lithographic apparatus is presented. The method includes dividing the illumination source into pixel groups, each pixel group including one or more illumination source points; selecting an illumination shape to expose a pattern, the illumination shape formed with at least one pixel group; iteratively calculating a lithographic metric as a result of a change of state of a pixel group in the illumination source, the change of the state of the pixel group creating a modified illumination shape; and adjusting the illumination shape based on the iterative results of calculations.

Abstract: An extreme ultraviolet exposure apparatus includes a radiation system configured to supply a beam of extreme ultraviolet radiation; a support configured to support a patterning device, the patterning device configured to pattern the beam of extreme ultraviolet radiation according to a desired pattern; a substrate table having an area configured to support a substrate; a projection system configured to project the patterned beam of extreme ultraviolet radiation onto a target portion of the substrate, the projection system comprising a reflective optical system; wherein at least a part of the apparatus that during use of the apparatus is exposed to the beam of extreme ultraviolet radiation is coated with a coating, the coating comprising a metal oxide, or a photocatalyst, or a semiconductor, or any combination thereof.

Abstract: A method for generating radiation includes supplying a fuel to a discharge space, creating a discharge in the fuel to form a plasma, and reducing a volume defined by the plasma by controlling radiation emission by the plasma. The reducing includes supplying a substance including at least one of Ga, In, Bi, Pb or Al to the plasma to control the radiation emission.

Abstract: Systems and methods for tuning photolithographic processes are described. A model of a target scanner is maintained defining sensitivity of the target scanner with reference to a set of tunable parameters. A differential model represents deviations of the target scanner from the reference. The target scanner may be tuned based on the settings of the reference scanner and the differential model. Performance of a family of related scanners may be characterized relative to the performance of a reference scanner. Differential models may include information such as parametric offsets and other differences that may be used to simulate the difference in imaging behavior.

Abstract: A lithographic projection apparatus including a support structure configured to support a patterning device, the patterning device configured to impart a beam of radiation with a pattern in its cross-section; a substrate holder configured to hold a substrate; a projection system configured to expose the patterned beam of radiation on a target portion of the substrate; and a system configured to compensate one or more perturbation factors by providing an additional beam of radiation to be exposed on the target portion of the substrate, the additional beam of radiation being imparted in its cross-section with an additional pattern which is based on the pattern of the patterning device and on lithographic projection apparatus property data, the lithographic projection apparatus property data characterizing a level and nature of one or more systematic perturbation factors of different lithographic apparatus.

Abstract: A method includes providing a controller to control a speed of a substrate table in a scan direction, the controller including a first input to receive a first signal representative of a first time period of a movement of the substrate table in a step direction, a second input to receive a second signal representative of a distance in the scan direction to be covered by the substrate table during a scan movement thereof, and a third input to receive a third signal representative of an acceleration of the substrate table. The controller includes an output to provide an output signal to control the speed of the substrate table in the scan direction. The method includes calculating the speed of the substrate table in the scan direction from the first, second and third signal, and compensating the output signal for the calculated speed of the substrate table.

Abstract: A method for decomposing a target pattern containing features to be printed on a wafer into multiple patterns. The method includes the steps of segmenting the target pattern into a plurality of patches; identifying critical features within each patch which violate minimum spacing requirements; generating a critical group graph for each of the plurality of patches having critical features, where the critical group graph of a given patch defines a coloring scheme of the critical features within the given patch, and the critical group graph identifies critical features extending into adjacent patches to the given patch; generating a global critical group graph for the target pattern, where the global critical group graph includes the critical group graphs of each of the plurality of patches, and an identification of the features extending into adjacent patches; and coloring the target pattern based on the coloring scheme defined by the global critical group graph.

Abstract: An immersion lithography apparatus includes a liquid supply system configured to supply a liquid to a space through which a beam of radiation passes, the liquid having an optical property that can be tuned by a tuner. The space may be located between the projection system and the substrate. The tuner is arranged to adjust one or more properties of the liquid such as the shape, composition, refractive index and/or absorptivity as a function of space and/or time in order to change the imaging performance of the lithography apparatus.

Abstract: Methods for calibrating a photolithographic system are disclosed. A cold lens contour for a reticle design and at least one hot lens contour for the reticle design are generated from which a process window is defined. Aberrations induced by a lens manipulator are characterized in a manipulator model and the process window is optimized using the manipulator model. Aberrations are characterized by identifying variations in critical dimensions caused by lens manipulation for a plurality of manipulator settings and by modeling behavior of the manipulator as a relationship between manipulator settings and aberrations. The process window may be optimized by minimizing a cost function for a set of critical locations.

Abstract: A method and system are described for determining lithographic processing conditions for a lithographic process. After obtaining input, a first optimization is made for illumination source and mask design under conditions of allowing non-rectangular sub-resolution assist features. Thereafter, mask design is optimized in one or more further optimizations for which only rectangular sub-resolution assist features are allowed. The latter results in good lithographic processing while limiting the complexity of the mask design.

Abstract: An imprinting method is disclosed that, in embodiment, includes contacting first and second spaced target regions of an imprintable medium on a substrate with first and second templates respectively to form respective first and second imprints in the medium and separating the first and second templates from the imprinted medium.

Abstract: A lithographic apparatus is arranged to transfer a pattern from a patterning device onto a substrate, in which a measuring subsystem includes one or (preferably) more alignment & level sensors (AS, LS) directed at the substrate near a patterning location of a patterning subsystem. The alignment sensor(s) is operable to recognize and measure alignment marks (P1) on the substrate passing by the sensor during relative motion of the substrate and patterning subsystem under control of the positioning subsystem. A processor combines measurements of relative locations of a plurality of said marks to provide measurement results with an accuracy sufficient for the positioning subsystem to position at least a first substrate portion at said patterning location relative to said alignment marks. A preliminary step obtains position relative to a known pattern (M1) on the patterning device. Measurements are taken and updated in real time during exposure of successive substrate portions.

Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.

Abstract: A lithographic apparatus can include a component and a positioning system operatively coupled and configured to move the component along a first axis. The positioning system can be configured to measure a position of the component along a second axis or a third axis. The positioning system can also be configured to control movement of the component so as to compensate for an effect of eigenmode coupling between the movement of the component along the first axis and the measured position of the component along the second axis or the third axis. In some embodiments, the component is a reticle stage or a wafer stage.

Abstract: A substrate table is disclosed in which heaters are provided to account for a heat load which may be applied to the substrate. The heaters are grouped in segments to improve control. A temperature sensor per segment may be provided. The temperature sensor may be embedded in the substrate table.

Abstract: A method of cleaning an immersion lithographic apparatus is disclosed in which a cleaner is added to immersion liquid for use during exposure of a substrate. The cleaner may be a combination of a soap and a solvent. The cleaner maybe present at a concentration of less than 300 ppb.