Abstract: A method and apparatus for identifying locations to be inspected on a substrate is disclosed. A defect location prediction model is trained using a training dataset associated with other substrates to generate a prediction of defect or non-defect and a confidence score associated with the prediction for each of the locations based on process-related data associated with the substrates. Those of the locations determined by the defect location prediction model as having confidences scores satisfying a confidence threshold are added to a set of locations to be inspected by an inspection system. After the set of locations are inspected, the inspection results data is obtained, and the defect location prediction model is incrementally trained by using the inspection results data and process-related data for the set of locations as training data.

Abstract: A method to infer a current sampling scheme for one or more current substrates is provided, the method including: obtaining a first model trained to infer an optimal sampling scheme based on inputting context and/or pre-exposure data associated with one or more previous substrates, wherein the first model is trained in dependency of an outcome of a second model configured to discriminate between the inferred optimal sampling scheme and a pre-determined optimal sampling scheme; and using the obtained first model to infer the current sampling scheme based on inputting context and/or pre-exposure data associated with the one or more current substrate.

Abstract: An object table including: a holding surface for holding an object; and an actuator arrangement configured to exert a holding force on the object for holding the object to the holding surface, wherein the actuator arrangement is further configured to decrease a strain in the object caused by the holding force by sequentially detaching and re-attaching portions of the object from the holding surface, while the object is held to the holding surface.

Abstract: There is provided a conditioning system for a lithographic apparatus, said conditioning system being configured to condition one or more optical elements of the lithographic apparatus, wherein the conditioning system is configured to have a sub-atmospheric pressure at the one or more optical elements.

Abstract: A method for aligning a wafer image with a reference image, comprising: searching for a targeted reference position on the wafer image for aligning the wafer image with the reference image; and in response to a determination that the targeted reference position does not exist: defining a current lock position and an area that encloses the current lock position on the wafer image; computing an alignment score of the current lock position; comparing the alignment score of the current lock position with stored alignment scores of positions previously selected in relation to aligning the wafer image with the reference image; and aligning the wafer image with the reference image based on the comparison.

Abstract: The present disclosure describes a detector used in critical dimension scanning electron microscopes (CD-SEM) and review SEM systems. In one embodiment, the detector includes a semiconductor structure having a p-n junction and a hole through which a scanning beam is passed to a target. The detector also includes a top electrode for the p-n junction (e.g., anode or cathode) that provides an active area for detecting electrons or electromagnetic radiation (e.g., backscattering from the target). The top electrode has a doped layer and can also have a buried portion beneath the doped layer to reduce a series resistance of the top electrode without changing the active area. In another embodiment, an isolation structure can be formed in the semiconductor structure near sidewalls of the hole to electrically isolate the active area from the sidewalls. A method for forming the buried portion of the top electrode is also described.

Abstract: A method for modeling measurement data over a substrate area relating to a substrate in a lithographic process. The method includes obtaining measurement data relating to the substrate and performing a combined fitting to fit to the measurement data: at least a first interfield model which describes distortion over the substrate and a field distortion model which describes distortion within an exposure field; wherein either: the at least a first interfield model includes a radial basis function model or an elastic energy minimizing spline model; or the method further includes fitting a radial basis function model or an elastic energy minimizing spline model to a distortion residual of the combined fit of a different interfield model and the field distortion model.

Abstract: A computer program product causes a processor to execute a process of causing an optical system to illuminate at least one structure on a substrate that comprises first repetitive features at a first pitch in a first layer and second repetitive features at a second pitch in a second layer, the first repetitive features at least partially overlapping with the second repetitive features. The first pitch is different from the second pitch. The processor causes the optical system to receive radiation scattered by the at least one structure and transmit a portion of the received scattered radiation to a sensor arranged in an image plane of the optical system or in a plane conjugate with the image plane for detecting the received scattered radiation and configured to detect a characteristic of radiation impinging on the sensor. The processor then determines a characteristic of interest of the structure.

Abstract: A method for generating a mask pattern for a patterning process. The method includes obtaining (i) a subset of target features (e.g., features too close) within a target pattern, the subset of target features having physical characteristic values below a threshold value, and (ii) an initial mask pattern (e.g., using an existing OPC process) associated with the target pattern; and modifying, based on a mask manufacturing constraint and a performance metric of the patterning process, one or more features of the initial mask pattern corresponding to the subset of target features to generate the mask pattern, the modifying including applying a curvature to a portion of the one or more features of the initial mask pattern.

Abstract: Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

Abstract: The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a magnetic field in the vicinity of the specimen to focus the particles of the particle beam on the specimen, a control electrode having a potential for providing a retarding field to the particle beam near the specimen to reduce the energy of the particle beam when the beam collides with the specimen, a deflection system including a plurality of deflection units situated along the optical axis for deflecting the particle beam to allow scanning on the specimen with large area, at least one of the deflection units located in the retarding field of the beam, the remainder of the deflection units located within the central bore of the objective lens, and a detection unit to capture secondary electron (SE) and backscattered electrons (BSE).

Abstract: An electromagnetic motor is described, the electromagnetic motor comprising: a magnet assembly configured to generate a two-dimensional alternating magnetic field having a pitch Pm1 in a first direction and a pitch Pm2 in a second direction; a coil assembly configured to co-operate with the magnet assembly to generate a first force in the first direction and a second force in the second direction, wherein the coil assembly comprises a first coil set comprising a plurality of first coils for generating the first force and a second coil set comprising a plurality of second coils for generating the second force, wherein a ratio R1 of a coil pitch Pc1 in the first coil set in the first direction over Pm1 is different from a ratio R2 of a coil pitch Pc2 in the second coil set in the second direction over Pm2.

Abstract: A passive flow induced vibration reduction system for use in a temperature conditioning system that controls the temperature of at least one component within a lithographic apparatus. This FIV reduction system includes: a conduit that provides a flow path for a liquid through the system; a liquid filled cavity in fluid connection with the conduit, wherein the fluid connection is provided via one or more openings in the wall of the conduit; a membrane configured such that it separates the liquid in the liquid filled cavity from a gas at a substantially ambient pressure and the membrane is configured such that compliance of the membrane reduces at least low frequency flow induced vibrations in the liquid flowing through the conduit; and an end-stop located on the gas side of the membrane, wherein the end-stop is configured to limit an extent of deflection of the membrane.

Abstract: The invention relates a method for manufacturing a damper device including a first part and a second part, said method comprising the following steps: a) providing a damping material in a space in between the first part and the second part, such that the damping material is in a compressed state in the space; and b) heating the device to a predetermined temperature in order to adhere the damping material to the first part and the second part.

Abstract: A method of determining a relationship between a stochastic variation of a characteristic of an aerial image or a resist image and one or more design variables, the method including: measuring values of the characteristic from a plurality of aerial images and/or resist images for each of a plurality of sets of values of the design variables; determining a value of the stochastic variation, for each of the plurality of sets of values of the design variables, from a distribution of the values of the characteristic for that set of values of the design variables; and determining the relationship by fitting one or more parameters from the values of the stochastic variation and the plurality of sets of values of the design variables.

Abstract: Disclosed herein is a residual gas analyser for detecting gas in a vacuum tool, the residual gas analyser comprising: one or more ion sources configured to ionise a gas in the residual gas analyser; one or more detectors configured to detect an ionised gas by the ion source; and one or more gas generating filaments configured to generate gas within the residual gas analyser.

Abstract: Systems, apparatuses, and methods are provided for manufacturing a substrate table. An example method can include forming a vacuum sheet including a plurality of vacuum connections and a plurality of recesses configured to receive a plurality of burls disposed on a core body for supporting an object such as a wafer. Optionally, at least one burl can be surrounded, partially or wholly, by a trench. The example method can further include using the vacuum sheet to mount the core body to an electrostatic sheet including a plurality of apertures configured to receive the plurality of burls. Optionally, the example method can include using the vacuum sheet to mount the core body to the electrostatic sheet such that the plurality of recesses of the vacuum sheet line up with the plurality of burls of the core body and the plurality of apertures of the electrostatic sheet.

Abstract: A lithographic apparatus is disclosed. The lithographic apparatus comprises a substrate table configured to support a substrate; actuators configurable to move the substrate table in a plane substantially parallel to the surface of the substrate; a projection system configured to pattern the substrate with fields aligned in a scanning exposure direction; a level sensor configured to sense a height of the substrate using a plurality of measurement spots; and a controller configured to control the actuators to generate strokes of relative movement between the substrate and the level sensor for mapping the height of the substrate, said strokes being at an angle of less than 20 degrees relative to the scanning exposure direction. Also disclosed is an associated method of mapping the height of a substrate.

Abstract: The invention provides a support with first and second end portions. The second end portion is on the side opposite to the first end portion in a longitudinal direction of the support. A coil spring is arranged between the first and second end portions. The coil spring comprises a first spiral member that extends between the first and second end portions in a circumferential direction of the support, and a second spiral member that extends between the first and second end portions in a circumferential direction of the support. The first and second spiral members extend in the longitudinal direction around a longitudinal axis of the support, wherein the first spiral member of the coil spring and the second spiral member of the coil spring are moveable relative to each other, and wherein the support further comprises a damper device that is attached to the first spiral member.

Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.