Abstract: A positioning device configured to displace an object is disclosed. The positioning device comprises a stage to support the object, an actuator to move the stage with respect to a reference in a direction of movement, a balance mass arranged between the actuator and the reference to reduce transfer of reaction forces from the actuator to the reference, a support device arranged between the reference and the balance mass to support the balance mass, and a gravity compensator acting between the reference and the balance mass to exert a lifting force on the balance mass to reduce a gravitational support force to be provided by the support device to support the balance mass.
Type:
Grant
Filed:
December 20, 2019
Date of Patent:
September 28, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Michaƫl Johannes Christiaan Ronde, Johannes Hubertus Antonius Van De Rijdt, Maarten Frans Janus Kremers, Erik Maria Rekkers
Abstract: Methods of measuring variation across multiple instances of a pattern on a substrate or substrates after a step in a device manufacturing process are disclosed. In one arrangement, data representing a set of images is received. Each image represents a different instance of the pattern, wherein the pattern includes a plurality of pattern elements. The set of images are registered relative to each other to superimpose the instances of the pattern. The registration includes applying different weightings to two or more of the plurality of pattern elements, wherein the weightings control the extent to which each pattern element contributes to the registration of the set of images and each weighting is based on an expected variation of the pattern element to which the weighting is applied. Variation in the pattern is measured using the registered set of images.
Type:
Grant
Filed:
February 7, 2018
Date of Patent:
September 28, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Antoine Gaston Marie Kiers, Scott Anderson Middlebrooks, Jan-Willem Gemmink
Abstract: A process to model post-exposure effects in patterning processes, the process including: obtaining values based on measurements of structures formed on one or more substrates by a post-exposure process and values of a pair of process parameters by which process conditions were varied; modeling, by a processor system, as a surface, correlation between the values based on measurements of the structures and the values of the pair of process parameters; and storing the model in memory.
Type:
Application
Filed:
July 27, 2017
Publication date:
September 23, 2021
Applicant:
ASML NETHERLANDS B.V.
Inventors:
Yongfa FAN, Mu FENG, Leiwu ZHENG, Qian ZHAO, Jen-Shiang WANG
Abstract: A method including: simulating an image or characteristics thereof, using characteristics of a design layout and of a patterning process, determining deviations between the image or characteristics thereof and the design layout or characteristics thereof; aligning a metrology image obtained from a patterned substrate and the design layout based on the deviations, wherein the patterned substrate includes a pattern produced from the design layout using the patterning process; and determining a parameter of a patterned substrate from the metrology image aligned with the design layout.
Abstract: There is described an optical system (400) for focusing a beam of radiation (B) on a region of interest of a substrate in a metrology apparatus. The beam of radiation comprises radiation in a soft X-ray or Extreme Ultraviolet spectral range. The optical system comprises a first reflector system (410) and a second reflector system (412). Each of the first and second reflector systems (410, 412) comprises a finite-to-finite Wolter reflector system. The optical system (400) is configured to form, on the region of interest, a demagnified image (414) of an object (416) comprising an apparent source of the beam of radiation (B).
Abstract: A patterning device, includes: an absorber layer on a patterning device substrate; and a reflective or transmissive layer on the patterning device substrate, wherein the absorber layer and the reflective or transmissive layer together define a pattern layout having a main feature and an attenuated sub-resolution assist feature paired with the main feature, wherein: the main feature is configured to generate, upon transferring the device pattern to a layer of patterning material on a substrate, the main feature in the layer of patterning material, and upon the transferring the pattern to the layer of patterning material, the attenuated sub-resolution assist feature is configured to avoid generating a feature in the layer of patterning material and to produce a different radiation intensity than the main feature.
Abstract: A method for scanning a sample by a charged particle beam tool is provided. The method includes providing the sample having a scanning area including a plurality of unit areas, scanning a unit area of the plurality of unit areas, blanking a next unit area of the plurality of unit areas adjacent to the scanned unit area, and performing the scanning and the blanking the plurality of unit areas until all of the unit areas are scanned.
Abstract: A method is proposed involving obtaining data regarding an expected focus offset during a patterning process due to topography of a region of a substrate surface. A modification of, e.g., a transmission or reflection of a region of a patterning device associated with the region of the substrate surface is determined based on the data. Using the patterning device modified according the determined modification during the patterning process mitigates an impact of the substrate topography on a parameter of the patterning process.
Type:
Grant
Filed:
May 17, 2017
Date of Patent:
September 21, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Richard Johannes Franciscus Van Haren, Reiner Maria Jungblut, Leon Paul Van Dijk, Willem Seine Christian Roelofs, Wim Tjibbo Tel, Stefan Hunsche, Maurits Van Der Schaar
Abstract: Systems and methods are provided for dynamically compensating position errors of a sample. The system can comprise one or more sensing units configured to generate a signal based on a position of a sample and a controller. The controller can be configured to determine the position of the sample based on the signal and in response to the determined position, provide information associated with the determined position for control of one of a first handling unit in a first chamber, a second handling unit in a second chamber, and a beam location unit in the second chamber.
Abstract: A method for determining corrections to features of a mask. The method includes obtaining (i) a pattern group for a design layout, and (ii) defect inspection data of a substrate imaged using the mask used in the patterning process for the design layout; determining, based on the defect inspection data, a defect map associated with the pattern group, wherein the defect map comprises locations of assist features having a relatively higher probability of being printed on the substrate compared to other patterns of the design layout; and determining, via simulating an optical proximity correction process using data associated with the defect map, corrections to the features of the mask.
Abstract: A method of determining a relationship between a stochastic variation of a characteristic of an aerial image or a resist image and one or more design variables, the method including: measuring values of the characteristic from a plurality of aerial images and/or resist images for each of a plurality of sets of values of the design variables; determining a value of the stochastic variation, for each of the plurality of sets of values of the design variables, from a distribution of the values of the characteristic for that set of values of the design variables; and determining the relationship by fitting one or more parameters from the values of the stochastic variation and the plurality of sets of values of the design variables.
Abstract: A method including: determining a value of a characteristic of a patterning process or a product thereof, at a current value of a processing parameter; determining whether a termination criterion is met by the value of the characteristic; if the termination criterion is not met, determining a new value of the processing parameter from the current value of the processing parameter and a prior value of the processing parameter, and setting the current value to the new value and repeating the determining steps; and if the termination criterion is met, providing the current value of the processing parameter as an approximation of a value of the processing parameter at which the characteristic has a target value.
Type:
Grant
Filed:
October 7, 2016
Date of Patent:
September 21, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Lin Lee Cheong, Wenjin Huang, Bruno La Fontaine
Abstract: Disclosed is a method for obtaining a computationally determined interference electric field describing scattering of radiation by a pair of structures comprising a first structure and a second structure on a substrate. The method comprises determining a first electric field relating to first radiation scattered by the first structure; determining a second electric field relating to second radiation scattered by the second structure; and computationally determining the interference of the first electric field and second electric field, to obtain a computationally determined interference electric field.
Type:
Grant
Filed:
July 31, 2019
Date of Patent:
September 21, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Patricius Aloysius Jacobus Tinnemans, Patrick Warnaar, Vasco Tomas Tenner, Maurits Van der Schaar
Abstract: A method of calibrating a projection system heating model to predict an aberration in a projection system in a lithographic apparatus, the method comprising passing exposure radiation through a projection system to expose one or more exposure fields on a substrate provided on a substrate table, making measurements of the aberration in the projection system caused by the exposure radiation, wherein the time period between measurements is less than the time period that would be taken to expose all exposure fields on the substrate.
Type:
Grant
Filed:
January 28, 2019
Date of Patent:
September 21, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Martijn Cornelis Schaafsma, Mhamed Akhssay, James Robert Downes
Abstract: An apparatus (300) for removing contaminant particles (205) from a component (202, 204) of an apparatus (140, MT), the contaminant particles giving rise to an ambient electric field (E), the apparatus comprising: a collection region (301) for attracting the particles, wherein the ambient electric field is at least between the component and the collection region; and an electric field generator configured to establish an applied electric field between the collection region and the component to cause the particles to be transported from the component to the collection region, wherein the electric field generator is configured to determine the polarity of the applied electric field based on the ambient electric field.
Type:
Grant
Filed:
December 27, 2018
Date of Patent:
September 21, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Tim Peter Johan Gerard Maas, Bartolomeus Martinus Johannes Van Hout, Henricus Wilhelmus Maria Van Buel, Floris Zoethout
Abstract: Methods and apparatus are disclosed for determining a characteristic of a structure. In one arrangement, the structure is illuminated with first illumination radiation to generate first scattered radiation. A first interference pattern is formed by interference between a portion of the first scattered radiation reaching a sensor and first reference radiation. The structure is also illuminated with second illumination radiation from a different direction. A second interference pattern is formed using second reference radiation. The first and second interference patterns are used to determine the characteristic of the structure. Azimuthal angles of the first and second reference radiations onto the sensor are different.
Type:
Grant
Filed:
April 5, 2019
Date of Patent:
September 14, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Johannes Fitzgerald De Boer, Vasco Tomas Tenner, Arie Jeffrey Den Boef, Christos Messinis
Abstract: A defect prediction method for a device manufacturing process involving production substrates processed by a lithographic apparatus, the method including training a classification model using a training set including measured or determined values of a process parameter associated with the production substrates processed by the device manufacturing process and an indication regarding existence of defects associated with the production substrates processed in the device manufacturing process under the values of the process parameter, and producing an output from the classification model that indicates a prediction of a defect for a substrate.
Type:
Grant
Filed:
April 17, 2020
Date of Patent:
September 14, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Scott Anderson Middlebrooks, Willem Maria Julia Marcel Coene, Frank Arnoldus Johannes Maria Driessen, Adrianus Cornelis Matheus Koopman, Markus Gerardus Martinus Maria Van Kraaij
Abstract: A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.
Type:
Application
Filed:
May 6, 2021
Publication date:
September 9, 2021
Applicant:
ASML NETHERLANDS B.V.
Inventors:
Raymond Wilhelmus Louis LAFARRE, Nicolaas TEN KATE, Nina Vladimirovna DZIOMKINA, Yogesh Pramod KARADE
Abstract: Disclosed is a method of, and associated apparatus for, determining an edge position relating to an edge of a feature comprised within an image, such as a scanning electron microscope image, which comprises noise. The method comprises determining a reference signal from said image; and determining said edge position with respect to said reference signal. The reference signal may be determined from the image by applying a 1-dimensional low-pass filter to the image in a direction parallel to an initial contour estimating the edge position.
Type:
Grant
Filed:
March 22, 2019
Date of Patent:
September 7, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Thomas Jarik Huisman, Ruben Cornelis Maas, Hermanus Adrianus Dillen
Abstract: A method to improve a lithographic process of imaging a portion of a design layout onto a substrate using a lithographic apparatus, the method including computing a multi-variable cost function. The multi-variable cost function represents an interlayer characteristic, the interlayer characteristic being a function of a plurality of design variables that represent one or more characteristics of the lithographic process. The method further includes reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables and computing the multi-variable cost function with the adjusted one or more design variables, until a certain termination condition is satisfied.
Type:
Grant
Filed:
March 14, 2017
Date of Patent:
September 7, 2021
Assignee:
ASML Netherlands B.V.
Inventors:
Wim Tjibbo Tel, Laurent Michel Marcel Depre, Jorge Humberto Salvador Entradas