Patents Assigned to Atotech Deutschland GmbH
  • Plating bath composition and method for electroless plating of palladium
    Patent number: 9758874
    Abstract: The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. The plating bath has an increased stability against undesired decomposition while maintaining a sufficient plating rate.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: September 12, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Christof Suchentrunk, Katharina Grummt, Julia Cramer
  • Methods of treating metal surfaces and devices formed thereby
    Patent number: 9763336
    Abstract: Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns.
    Type: Grant
    Filed: July 6, 2010
    Date of Patent: September 12, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Jen-Chieh Wei, Zhiming Liu, Steven Z. Shi, Werner G. Kuhr
  • Galvanic nickel electroplating bath for depositing a semi-bright nickel
    Patent number: 9752244
    Abstract: The present invention is related to a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy coating characterized in that the electroplating bath comprises at least one compound having the general formula (I) wherein R1=C1-C18 hydrocarbon moiety substituted with a SO3? group, C1-C18 hydrocarbon moiety substituted with a carboxylic group or C1-C18 hydrocarbon moiety substituted with at least an aromatic and/or a heteroaromatic group; R2=NR3R4 moiety, OR5 moiety, or cyclic NR6 moiety, wherein R3, R4, R5=hydrogen or C1-C18 hydrocarbon moiety or C1-C18 hydrocarbon moiety substituted with at least an aromatic and/or a heteroaromatic group, wherein R3, R4 and R5 are identical or different; R6=C3-C8 hydrocarbon moiety or C3-C8 hydrocarbon moiety, wherein at least one carbon atom is substituted by a heteroatom; and n=1-3.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: September 5, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Klaus-Dieter Schulz, Philip Hartmann, Philipp Wachter, Mike Briese, Heiko Brunner, Richard Richter, Lars Kohlmann
  • Method and apparatus for electrolytically depositing a deposition metal on a workpiece
    Patent number: 9745665
    Abstract: For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: August 29, 2017
    Assignee: ATOTECH DEUTSCHLAND GmbH
    Inventors: Dominik Britz, Bernd Schmitt, Bernd Böse, Frank Mücklich, Christian Selzner
  • Process for forming corrosion protection layers on metal surfaces
    Patent number: 9738790
    Abstract: The invention relates to a process for producing a corrosion-inhibiting coating for substrates having a surface consisting of zinc, magnesium, aluminum or one of their alloys, wherein the surface to be treated is brought into contact in direct succession with two aqueous treatment solutions containing chromium(III) ions, metal ions of the substrate surface to be treated and at least one complexing agent. The first treatment solution has a pH in the range from 1.0 to 4.0, while the second treatment solution has a pH of from 3.0 to 12.0. The process of the invention produces a smaller amount of wastewater polluted with heavy metals.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: August 22, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Udo Hofmann, Volker Krenzel
  • Method, treatment station and assembly for treating a planar material to be treated
    Patent number: 9713265
    Abstract: In order to remove treatment liquid (21) from a planar material to be treated (10), which is transported in an assembly for the electrolytic or wet-chemical treatment of the material to be treated (10), or to promote the exchange of material on the surface of the material to be treated (10), a roll with a roll surface (4, 14) is provided. The roll surface (4, 14) is arranged relative to a transport path of the material to be treated (10) so that a gap (8, 18) remains between the roll surface (4, 14) and a useful region of the material to be treated (10) opposing the roll surface (4, 14), which extends over the useful region. The roll is driven rotatably so that at the gap (8, 18) a relative speed is produced between the roll surface (4, 14) and the material to be treated (10).
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: July 18, 2017
    Assignee: Atotech Deutschland GmbH
    Inventor: Henry Kunze
  • Method for manufacture of fine line circuitry
    Patent number: 9713266
    Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: July 18, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Richard Nichols, Don Jang, Harald Riebel, Frank Brüning
  • Electroplating bath and method for producing dark chromium layers
    Patent number: 9689081
    Abstract: The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: June 27, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Klaus-Dieter Schulz, Philipp Wachter, Philip Hartmann
  • Plated electrical contacts for solar modules
    Patent number: 9680042
    Abstract: The present invention concerns a plating method for manufacturing of electrical contacts on a solar module wherein the wiring between silicon solar cells in a solar module is deposited by electroplating onto a conductive seed. The wiring between individual silicon solar cells comprises wiring reinforcement pillars which improve the reliability of said wiring.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: June 13, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Torsten Voss, Sven Lamprecht
  • Membrane electrolysis stack, electrodialysis device including the stack and method for the regeneration of an electroless plating bath
    Patent number: 9669361
    Abstract: To prevent biological fouling in an electrodialysis device, an electrodialysis device including a membrane electrolysis stack are created. Every membrane electrolysis stack comprises membranes stacked on top of each other and respectively dilute and concentrate compartments arranged therebetween, at least one first and at least one second membrane alternating in succession in the membrane electrolysis stack. At least one first membrane is selected from a group comprising an anion exchange membrane and a bipolar membrane, and at least one second membrane is selected from a group comprising a monoselective anion exchange membrane, a monoselective cation exchange membrane and a proton-selective exchange membrane, with the proviso that the second membranes are respectively selected independently of each other and that at least one first membrane in the membrane electrolysis stack is a bipolar membrane.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: June 6, 2017
    Assignee: ATOTECH DEUTSCHLAND GMBH
    Inventor: Jens Heydecke
  • Electroless copper plating solution
    Patent number: 9650718
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: May 16, 2017
    Assignee: ATOTECH DEUTSCHLAND GMBH
    Inventors: Frank Brüning, Elisa Langhammer, Michael Merschky, Christian Lowinski, Jörg Schulze, Johannes Etzkorn, Birgit Beck
  • Chrome-plated part and manufacturing method of the same
    Patent number: 9650722
    Abstract: An nickel plating layer (5a) intended for corrosion current distribution is formed over a body (2), and a 0.05 to 2.5 micrometers thick surface chrome plating layer (6) made of trivalent chromium is formed on the surface thereof using basic chromium sulfate as a source of metal. Further on the same, a not less than 7 nm thick chromium compound film (7) is formed by cathode acidic electrolytic chromatin. The corrosion distribution nickel plating layer (5a) has a function of forming a microporous structure, a microcrack structure, or the both of the same in the surface chrome plating layer (6).
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: May 16, 2017
    Assignees: NISSAN MOTOR CO., LTD., ATOTECH DEUTSCHLAND GMBH
    Inventors: Soichiro Sugawara, Hiroaki Koyasu, Hiroshi Sakai, Jens-Eric Geissler, Grant Keers
  • METHOD OF FORMING A METAL LAYER AND METHOD OF MANUFACTURING A SUBSTRATE HAVING SUCH METAL LAYER
    Publication number: 20170130354
    Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.
    Type: Application
    Filed: March 12, 2015
    Publication date: May 11, 2017
    Applicant: Atotech Deutschland GMBH
    Inventors: Tadahiro NISHIGAWA, Jun HIGUCHI, Hitoshi ISHIKAWA
  • IRON BORON ALLOY COATINGS AND A PROCESS FOR THEIR PREPARATION
    Publication number: 20170121824
    Abstract: An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.
    Type: Application
    Filed: March 17, 2015
    Publication date: May 4, 2017
    Applicant: Atotech Deutschland GMBH
    Inventors: Jacob BLICKENSDERFER, Rohan AKOLKAR, Paige ALTEMARE, Kay-Oliver THIEL, Hans-Jürgen SCHREIER
  • Device for vertical galvanic metal deposition on a substrate
    Patent number: 9631294
    Abstract: A method and device for vertical galvanic metal deposition on a substrate, the device including at least first and second device elements arranged vertically parallel to each other, the first device element including at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of through-going conduits, the at least first anode element and the at least first carrier element firmly connected to each other; and the second device element including at least a first substrate holder adapted to receive at least one substrate to be treated, the at least one substrate holder at least partially surrounding the at least one substrate along its outer frame after receiving it; the distance between the first anode element and the at least first substrate holder ranging from 2 to 15 mm.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: April 25, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Ray Weinhold, Ferdinand Wiener
  • Composition and method for removal of organic paint coatings from substrates
    Patent number: 9593247
    Abstract: The invention relates to a non-aqueous stripping composition for removing cured organic paint from substrates comprising i. a source of hydroxide ions; ii. a high-boiling alcohol having a boiling point of at least 100° C.; and iii. at least one surfactant represented by the following formula R—O—(CH2CH2O)nH and ?wherein R is an alkyl chain, linear or branched having a 2 to 24 carbon atom chain length.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: March 14, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Nayan H. Joshi, Kerri Little Carver, Thomas Anthony Patena, Christopher George Ringholz
  • Process to deposit zinc-iron alloy layer material
    Publication number: 20170029971
    Abstract: A process for depositing a zinc-iron alloy layer material having a body centred cubic crystal structure of the ?-phase, a (330) texture and an iron content of 12 to 20 wt.-% including the steps (i) providing a metallic substrate, (ii) contacting the substrate with an alkaline aqueous zinc-iron alloy plating bath containing 4 to 6 g/l zinc ions, 1 to 3 g/l iron ions, 25 to 35 g/l hydroxyl ions, 0.5 to 2.5 g/l of a quaternary ammonium polymer and at least one complexing agent selected from the group consisting of hydroxyl carboxylic acids and salts thereof and simultaneously applying a current to the substrate. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Applicant: Atotech Deutschland GmbH
    Inventors: Lukas BEDRNIK, Frantisek HAAS, Nadine LANG, Roland VOGEL
  • Copper plating bath composition
    Patent number: 9551080
    Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 24, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Bernd Roelfs, Agnieszka Witczak, Lars Kohlmann, Olivier Mann, Christian Ohde, Timo Bangerter, Angelo Ferro, Andreas Kirbs, Andre Schmökel, Dirk Rohde, Stefanie Ackermann
  • Method for depositing a first metallic layer onto non-conductive polymers
    Patent number: 9551073
    Abstract: The present invention relates to the etching, activation and deposition of a first metal or metal alloy layer onto non-conductive polymers. The non-conductive polymer is etched with an aqueous solution comprising 0.75 to 3.6 g/l permanganate ions in 60 to 80 vol.-% sulfuric acid, activating with a solution comprising a noble metal and depositing a first metal or metal alloy by immersion-type or electroless (autocatalytic) plating. The first metal or metal alloy layer obtained has a high adhesion on the non-conductive polymer and serves as a plating base for electroplating further metal and/or metal alloy layer(s) thereon.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: January 24, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Leonas Naruskevicius, Mykolas Baranauskas, Loreta Tamasiunaite Tamasauskaite, Ona Gyliene
  • Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
    Patent number: 9534310
    Abstract: The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: January 3, 2017
    Assignee: Atotech Deutschland GmbH
    Inventors: Ralph Rauenbusch, Christian Thomas, Ray Weinhold, Heinz Klingl